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Author: Gerald L. Ginsberg
Publisher: Springer Science & Business Media
ISBN: 1461535425
Category : Science
Languages : en
Pages : 285
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Book Description
The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, many future applications have yet to be conceived. This versatility of electron ics has been brought about primarily by the significant advances that have been made in integrated circuit technology. The electronic product user is rarely aware of the integrated circuits within the equipment. However, the user is often very aware of the size, weight, mod ularity, maintainability, aesthetics, and human interface features of the product. In fact, these are aspects of the products that often are instrumental in deter mining its success or failure in the marketplace. Optimizing these and other product features is the primary role of Electronic Equipment Packaging Technology. As the electronics industry continues to pro vide products that operate faster than their predecessors in a smaller space with a reduced cost per function, the role of electronic packaging technology will assume an even greater role in the development of cost-effective products.
Author: Gerald L. Ginsberg
Publisher: Springer Science & Business Media
ISBN: 1461535425
Category : Science
Languages : en
Pages : 285
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Book Description
The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, many future applications have yet to be conceived. This versatility of electron ics has been brought about primarily by the significant advances that have been made in integrated circuit technology. The electronic product user is rarely aware of the integrated circuits within the equipment. However, the user is often very aware of the size, weight, mod ularity, maintainability, aesthetics, and human interface features of the product. In fact, these are aspects of the products that often are instrumental in deter mining its success or failure in the marketplace. Optimizing these and other product features is the primary role of Electronic Equipment Packaging Technology. As the electronics industry continues to pro vide products that operate faster than their predecessors in a smaller space with a reduced cost per function, the role of electronic packaging technology will assume an even greater role in the development of cost-effective products.
Author: King-Ning Tu
Publisher: John Wiley & Sons
ISBN: 1119418313
Category : Science
Languages : en
Pages : 340
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Book Description
Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.
Author: Jennie Hwang
Publisher: Springer Science & Business Media
ISBN: 146153528X
Category : Technology & Engineering
Languages : en
Pages : 374
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Book Description
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology.
Author: Glenn R. Blackwell
Publisher: CRC Press
ISBN: 9781420049848
Category : Technology & Engineering
Languages : en
Pages : 648
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Book Description
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Author: Yong Liu
Publisher: Springer Science & Business Media
ISBN: 1461410533
Category : Technology & Engineering
Languages : en
Pages : 606
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Book Description
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Author: Beth Keser
Publisher: John Wiley & Sons
ISBN: 1119314135
Category : Technology & Engineering
Languages : en
Pages : 576
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Book Description
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Author: Puligandla Viswanadham
Publisher: American Society of Mechanical Engineers
ISBN: 9780791859667
Category : Technology & Engineering
Languages : en
Pages : 0
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Book Description
ASME Press Book Series on Electronic Packaging. Series Editor: Dereje Agonafer. This book provides the basic essentials and fundamentals of electronic packaging technology. It introduces the language and terminology, as well as the basic building blocks of information processing technology such as: a) printed wiring boards and laminates, b) various types of components and packages, c) materials and processes, d) fundamentals of reliability and relevant reliability enhancement methods, and e) typical failures observed are described. A fully tested semiconductor device is the starting point for this text. Thus, no background in the semiconductor design or fabrication is assumed. The reader is exposed to the interaction and convergence of various disciplines such as chemistry, physics, materials science, metallurgy, process engineering in the fabrication of an electronic appliance. The reader is also made aware of the emerging trends in electronic packaging to prepare him or her for the near-term miniaturization and integration of technology trends.
Author:
Publisher: World Scientific
ISBN: 9811209642
Category : Technology & Engineering
Languages : en
Pages : 1079
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Book Description
Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.
Author: Mckeown
Publisher: CRC Press
ISBN: 9780824770334
Category : Technology & Engineering
Languages : en
Pages : 382
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Book Description
"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."
Author: Rao Tummala
Publisher: McGraw Hill Professional
ISBN: 1259861562
Category : Technology & Engineering
Languages : en
Pages : 849
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Book Description
A fully updated, comprehensive guide to electronic packaging technologies This thoroughly revised resource offers rigorous and complete coverage of microsystems packaging at both the device and system level. You will get in-depth guidance on the latest technologies from academic and industry leaders. New chapters cover topics highly relevant to today's small and ultra-small systems. Fundamentals of Microsystems Packaging, Second Edition, discusses the entire field, from wafer to systems, and clearly explains every major contributing technology. The book details emerging systems, including smart wearables, the Internet of Things, bioelectronics for medical applications, cloud computing, and much more. Microelectronics, photonics, MEMS, sensors, RF, and wireless technologies are fully covered. • Covers the electrical, mechanical, chemical, and materials aspects of each technology • Contains examples of all common configurations and technologies • Written by the leading author in the field
