Author: Srinivas T. Rao
Publisher: ASM International(OH)
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 256
Book Description
Eighth Electronic Materials and Processing
Author: Srinivas T. Rao
Publisher: ASM International(OH)
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 256
Book Description
Publisher: ASM International(OH)
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 256
Book Description
Electronic Materials and Processes Handbook
Author: Charles A. Harper
Publisher: McGraw-Hill Professional Publishing
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 814
Book Description
Today, the successful design and manufacture of electronic devices requires expertise in both materials science and manufacturing processes. This reference provides electronics engineers and materials scientists with the information they need on the materials and processes currently used to fabricate, interconnect and package electronic components and systems.
Publisher: McGraw-Hill Professional Publishing
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 814
Book Description
Today, the successful design and manufacture of electronic devices requires expertise in both materials science and manufacturing processes. This reference provides electronics engineers and materials scientists with the information they need on the materials and processes currently used to fabricate, interconnect and package electronic components and systems.
Handbook of Electronic Materials
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
Book Description
Reliability and Failure of Electronic Materials and Devices
Author: Milton Ohring
Publisher: Academic Press
ISBN: 0080575528
Category : Technology & Engineering
Languages : en
Pages : 759
Book Description
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Publisher: Academic Press
ISBN: 0080575528
Category : Technology & Engineering
Languages : en
Pages : 759
Book Description
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Electronic Materials and Processing
Author: M. Grasserbauer
Publisher:
ISBN:
Category :
Languages : en
Pages : 398
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 398
Book Description
Nanoelectronics and Information Technology
Author: Rainer Waser
Publisher: John Wiley & Sons
ISBN: 3527409270
Category : Technology & Engineering
Languages : en
Pages : 1041
Book Description
Fachlich auf höchstem Niveau, visuell überzeugend und durchgängig farbig illustriert: Das ist die neue Auflage der praxisbewährten Einführung in spezialisierte elektronische Materialien und Bauelemente aus der Informationstechnologie. Über ein Drittel des Inhalts ist neu, alle anderen Beiträge wurden gründlich überarbeitet und aktualisiert.
Publisher: John Wiley & Sons
ISBN: 3527409270
Category : Technology & Engineering
Languages : en
Pages : 1041
Book Description
Fachlich auf höchstem Niveau, visuell überzeugend und durchgängig farbig illustriert: Das ist die neue Auflage der praxisbewährten Einführung in spezialisierte elektronische Materialien und Bauelemente aus der Informationstechnologie. Über ein Drittel des Inhalts ist neu, alle anderen Beiträge wurden gründlich überarbeitet und aktualisiert.
Electronic Materials and Processes
Author: N. H. Kordsmeier
Publisher:
ISBN:
Category : Electronics
Languages : en
Pages : 0
Book Description
Publisher:
ISBN:
Category : Electronics
Languages : en
Pages : 0
Book Description
Electronic Materials and Processes Handbook
Author: Charles Harper
Publisher: McGraw-Hill
ISBN: 9780071634014
Category : Technology & Engineering
Languages : en
Pages : 764
Book Description
Electronic materials are the actual semiconductors, plastics, metals and ceramics that make up the chips and packages from which we construct todayis cell phones, palmtops, and PDAs. The switch in applications from PCs to smaller communications devices has driven the micro-miniaturization trend in electronics, which in turn has created a new set of challenges in creating materials to meet their specifications. This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and micro-miniature sizes. This new handbook will be an invaluable tool to anyone working electronic packaging, fabrication, or assembly design."
Publisher: McGraw-Hill
ISBN: 9780071634014
Category : Technology & Engineering
Languages : en
Pages : 764
Book Description
Electronic materials are the actual semiconductors, plastics, metals and ceramics that make up the chips and packages from which we construct todayis cell phones, palmtops, and PDAs. The switch in applications from PCs to smaller communications devices has driven the micro-miniaturization trend in electronics, which in turn has created a new set of challenges in creating materials to meet their specifications. This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and micro-miniature sizes. This new handbook will be an invaluable tool to anyone working electronic packaging, fabrication, or assembly design."
Technical Abstract Bulletin
Author: Defense Documentation Center (U.S.)
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 1032
Book Description
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 1032
Book Description
Transient Thermal Processing Techniques in Electronic Materials
Author: Nuggehalli M. Ravindra
Publisher: Minerals, Metals, & Materials Society
ISBN:
Category : Electronics
Languages : en
Pages : 192
Book Description
This volume presents a research update of silicon and non-silicon transient processing techniques such as rapid thermal processing, pulsed laser processes, flash evaporation, jet processes, and more. Also covered are process sensors, equipment issues, and the manufacturing perspective.
Publisher: Minerals, Metals, & Materials Society
ISBN:
Category : Electronics
Languages : en
Pages : 192
Book Description
This volume presents a research update of silicon and non-silicon transient processing techniques such as rapid thermal processing, pulsed laser processes, flash evaporation, jet processes, and more. Also covered are process sensors, equipment issues, and the manufacturing perspective.