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Author: Jianfeng Luo
Publisher: Springer Science & Business Media
ISBN: 3662079283
Category : Science
Languages : en
Pages : 327
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Book Description
Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process.
Author: Jianfeng Luo
Publisher: Springer Science & Business Media
ISBN: 3662079283
Category : Science
Languages : en
Pages : 327
Get Book Here
Book Description
Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process.
Author: Babu Suryadevara
Publisher: Woodhead Publishing
ISBN: 0128218193
Category : Technology & Engineering
Languages : en
Pages : 650
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Book Description
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP
Author: Yuzhuo Li
Publisher: John Wiley & Sons
ISBN: 0471719196
Category : Technology & Engineering
Languages : en
Pages : 764
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Book Description
An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.
Author: Horacio E. Bergna
Publisher: CRC Press
ISBN: 1420028707
Category : Science
Languages : en
Pages : 926
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Book Description
In spite of the apparent simplicity of silica's composition and structure, scientists are still investigating fundamental questions regarding the formation, constitution, and behavior of colloidal silica systems. Colloidal Silica: Fundamentals and Applications introduces new information on colloid science related to silica chemistry as well
Author: Anna Rudawska
Publisher: BoD – Books on Demand
ISBN: 1789841933
Category : Technology & Engineering
Languages : en
Pages : 214
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Book Description
The subject matter of this book is the information on the abrasive technology methods, the characteristics of the methods (for example, the technological parameters, tools, and machines), innovative methods, characteristics of surface structure and surface properties after this type of mechanical process, and application in various industrial branches and other technical and technological domains. Abrasive technology is very important, for example, in precision component manufacturing and nano-technology devices. The aim of this book is to present information on the characteristics and applications of abrasive technology, abrasive tools, tests, and also the innovative methods of this technology. This information enables scientists, engineers, and designers to ensure the soundness and integrity of the fabricated components and to develop new techniques effectively.
Author: M.R. Oliver
Publisher: Springer Science & Business Media
ISBN: 9783540431817
Category : Technology & Engineering
Languages : en
Pages : 444
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Book Description
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Author: Joseph M. Steigerwald
Publisher: John Wiley & Sons
ISBN: 3527617752
Category : Science
Languages : en
Pages : 337
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Book Description
Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.
Author: Masuo Hosokawa
Publisher: Elsevier
ISBN: 008055802X
Category : Technology & Engineering
Languages : en
Pages : 645
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Book Description
Nanoparticle technology, which handles the preparation, processing, application and characterisation of nanoparticles, is a new and revolutionary technology. It becomes the core of nanotechnology as an extension of the conventional Fine Particle / Powder Technology. Nanoparticle technology plays an important role in the implementation of nanotechnology in many engineering and industrial fields including electronic devices, advanced ceramics, new batteries, engineered catalysts, functional paint and ink, Drug Delivery System, biotechnology, etc.; and makes use of the unique properties of the nanoparticles which are completely different from those of the bulk materials.This new handbook is the first to explain complete aspects of nanoparticles with many application examples showing their advantages and advanced development. There are handbooks which briefly mention the nanosized particles or their related applications, but no handbook describing the complete aspects of nanoparticles has been published so far.The handbook elucidates of the basic properties of nanoparticles and various nanostructural materials with their characterisation methods in the first part. It also introduces more than 40 examples of practical and potential uses of nanoparticles in the later part dealing with applications. It is intended to give readers a clear picture of nanoparticles as well as new ideas or hints on their applications to create new materials or to improve the performance of the advanced functional materials developed with the nanoparticles.* Introduces all aspects of nanoparticle technology, from the fundamentals to applications.* Includes basic information on the preparation through to the characterization of nanoparticles from various viewpoints * Includes information on nanostructures, which play an important role in practical applications.
Author: Jean Michel Martin
Publisher: John Wiley & Sons
ISBN: 0470987707
Category : Science
Languages : en
Pages : 246
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Book Description
The technology involved in lubrication by nanoparticles is a rapidly developing scientific area and one that has been watched with interest for the past ten years. Nanolubrication offers a solution to many problems associated with traditional lubricants that contain sulphur and phosphorus; and though for some time the production of nanoparticles was restricted by the technologies available, today synthesis methods have been improved to such a level that it is possible to produce large quantities relatively cheaply and efficiently. Nanolubricants develops a new concept of lubrication, based on these nanoparticles, and along with the authors’ own research it synthesises the information available on the topic of nanolubrication from existing literature and presents it in a concise form. Describes the many advantages and potential applications of nanotechnology in the tribological field. Offers a full review of the state-of-the-art as well as much original research that is yet unpublished. Includes sections on boundary lubrication by colloïdal systems, nanolubricants made of metal dichalcogenides, carbon-based nanolubricants, overbased detergent salts, nanolubricants made of metals and boron-based solid nanolubricants and lubrication additives. Authored by highly regarded experts in the field with contributions from leading international academics. Nanolubricants will appeal to postgraduate students, academics and researchers in mechanical engineering, chemical engineering and materials science. It should also be of interest to practising engineers with petroleum companies and mechanical manufacturers.
Author: Toshiro Doi
Publisher: William Andrew
ISBN: 1437778593
Category : Science
Languages : en
Pages : 330
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Book Description
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan
