Effect of Substrate Bias on Properties and Microstructure of Nanotwinned Copper Thin Films Deposited by Magnetron Sputtering Systems PDF Download
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Author: Sun-Yi Chang
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Languages : en
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Author: Sun-Yi Chang
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Languages : en
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Author: Mohamed El Garah
Publisher:
ISBN:
Category : Electronic books
Languages : en
Pages : 0
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Surface coating is of a great interest to increase the performances of the materials and extend its lifetime. High entropy films (HEFs) become the hot spot for developing surface engineering applications due to their good performances. They are reported to have superior properties such as good corrosion, wear resistance and excellent high temperature oxidation. Various deposition techniques have been exploited to fabricate HEFs such as laser cladding, spraying, sputter deposition and electrochemical deposition. These techniques are known to be an easy process to achieve a rapid quenching. Magnetron sputtering is seen as the most efficient methods to deposit the HEFs. Different gas can be used to prepare the ceramic materials. Besides, the deposition parameters reveal a strong influence on the physicochemical properties of HEFs. Working pressure, substrate temperature, bias voltage and gas mixture flow ratios have been reported to influence the morphology, microstructure, and functional properties of HEFs. The chapter overviews the development of the recent HEFs prepared by magnetron sputtering technique. First, it describes the principal of the technique. Then, it reports the classes of HEFs followed by the effect of the deposition parameters on their different properties. Applications have been developed using some HEFs for biomaterials and machining process.
Author: Vibhor Vinodkumar Jain
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Languages : en
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Copper has become the metal of choice for metallization, owing to its high electrical and thermal conductivity, relatively higher melting temperature and correspondingly lower rate of diffusivity. Most of the current studies can get high strength copper thin films but on an expense of conductivity. This study proposes a technique to deposit high strength and high conductivity copper thin films on different silicon substrates at room temperature. Single crystal Cu (100) and Cu (111) have been grown on Si (100) and Si (110) substrates, respectively. Single crystal Cu (111) films have a high density of growth twins, oriented parallel to the substrate surface due to low twin boundary energy and a high deposition rate. The yield strengths of these twinned Cu films are much higher than that of bulk copper, with an electrical resistivity value close to that of bulk copper. X-ray diffraction, transmission electron microscopy and nanoindentation techniques were used to show that high density twins are sole reason for the increase in hardness of these thin films. The formation of growth twins and their roles in enhancing the mechanical strength of Cu films while maintaining low resistivity are discussed.
Author: Thomas Wächtler
Publisher: Thomas Waechtler
ISBN: 3941003178
Category :
Languages : en
Pages : 247
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Author: Öcal Tuna
Publisher: LAP Lambert Academic Publishing
ISBN: 9783838365695
Category :
Languages : en
Pages : 100
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In this study Indium Tin Oxide (ITO) thin films were grown by both DC and RF magnetron sputtering techniques. To know deposition rate of ITO, system was calibrated for both DCMS and RFMS and then ITO were grown on glass substrate with the thickness of 70 nm and 40 nm by changing substrate temperature. The effect of substrate temperature, film thickness and sputtering method on structural, electrical and optical properties were investigated. The results show that substrate temperature and film thickness substantially affects the film properties, especially crystallization and resistivity. The thin films grown at the lower than 150 oC showed amorphous structure. However, crystallization was detected with the furtherincrease of substrate temperature. Band gap of ITO was calculated to be about 3.64eV at the substrate temperature of 150 oC, and itwidened with substrate temperature increment. From electrical measurements the resistivity at room temperature was obtained 1.28x10-4 and 1.29x10-4 D-cm, for DC and RF sputtered films, respectively. We also measured temperature dependence resistivity and the Hall coefficient of the films, and we calculated carrier concentration and Hall mobility."
Author: Al-Ahsan Talukder
Publisher:
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Category : Electronic dissertations
Languages : en
Pages : 0
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Magnetron sputtering is a popular vacuum plasma coating technique used for depositing metals, dielectrics, semiconductors, alloys, and compounds onto a wide range of substrates. In this work, we present two popular types of magnetron sputtering, i.e., pulsed DC and RF magnetron sputtering, for depositing piezoelectric aluminum nitride (AlN) thin films with high Young's modulus. The effects of important process parameters on the plasma I-V characteristics, deposition rate, and the properties of the deposited AlN films, are studied comprehensively. The effects of these process parameters on Young's modulus of the deposited films are also presented. Scanning electron microscope imaging revealed a c-axis oriented columnar growth of AlN. Performance of surface acoustic devices, utilizing the AlN films deposited by magnetron sputtering, are also presented, which confirms the differences in qualities and microstructures of the pulsed DC and RF sputtered films. The RF sputtered AlN films showed a denser microstructure with smaller grains and a smoother surface than the pulsed DC sputtered films. However, the deposition rate of RF sputtering is about half of the pulsed DC sputtering process. We also present a novel ion source enhanced pulsed DC magnetron sputtering for depositing high-quality nitrogen-doped zinc telluride (ZnTe:N) thin films. This ion source enhanced magnetron sputtering provides an increased deposition rate, efficient N-doping, and improved electrical, structural, and optical properties than the traditional magnetron sputtering. Ion source enhanced deposition leads to ZnTe:N films with smaller lattice spacing and wider X-ray diffraction peak, which indicates denser films with smaller crystallites embedded in an amorphous matrix.
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Languages : en
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Aluminum nitride thin films have been deposited by pulsed DC reactive magnetron sputtering. The pulsed DC power provides arc-free deposition of insulating films. Two types of pulsed DC (unipolar and asymmetric bipolar) were studied with respect to characteristics and properties of resultant films. The unipolar power supply generates a series of 75 kHz DC pulses modulated with 2.5 kHz frequency. The frequency of asymmetric power supply can be varied from 50 kHz to 250 kHz. The duty cycle, which is a ratio of negative pulse time to total time, can be varied from 60% to 98%. Very fast oscillation and overshoot were observed when the polarity of the target voltage was changed. The control of crystal orientation of deposited film is important since the properties of AlN film is related with the orientation. For example, the acoustic velocity is high along the c-axis. The electromechanical coupling coefficient is large in a-axis direction. The crystal orientation and microstructure of the AlN films were strongly affected by the deposition conditions such as sputtering power, growth temperature, sputtering gas pressure and frequency/duty cycle. The crystal orientation of AlN films was closely related with the energy of sputtered atoms and mobility of adatoms on substrate. The c-axis oriented films were obtained when the target power and growth temperature were high. This provided higher energy of sputtered atoms and mobility of adatoms. The deposited AlN films have a columnar structure. The crystal orientation of the AlN films was changed from (101) to (002) by applying an RF bias was applied to the substrate in unipolar pulsed DC sputtering. The columnar structure disappeared when the RF bias was applied to the substrate. Applying bias was thought to increase mobility of adatoms by ion bombardment. MIM (aluminum-AlN-aluminum or molybdenum) structure was fabricated to measure electric properties of AlN films. Dielectric constants of 8.5 to 11.5 were obtained at 100 kHz. Th.
Author: W. Prater
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Category :
Languages : en
Pages :
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We report and contrast both the electrical resistance and the microstructure of copper thin films deposited in an oxygen containing atmosphere by ion-beam and dc-magnetron sputtering. For films with thicknesses 5 nm or less, the resistivity of the Cu films is minimized at oxygen concentrations ranging from 0.2% to 1% for dc-magnetron sputtering and 6% to 10% for ion beam sputtering. Films sputtered under both conditions show a similar decrease of interface roughness with increasing oxygen concentration, although the magnetron deposited films are smoother. The dc-magnetron produced films have higher resistivity, have smaller Cu grains, and contain a higher concentration of cuprous oxide particles. We discuss the mechanisms leading to the grain refinement and the consequent reduced resistivity in both types of films.
Author:
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Category :
Languages : en
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Author: Edward V. Barnat
Publisher: The Rosen Publishing Group
ISBN: 9781402075438
Category : Science
Languages : en
Pages : 164
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Diffusion Barrier Stack - 5 nm -3 nm -2 nm :. . . -. . . . : . . O. 21-lm Figure 2: Schematic representing a cross-sectional view of the topography that is encountered in the processing of integrated circuits. (Not to scale) these sub-micron sized features is depicted in Fig. 2. The role of the diffusion barrier is to prevent the diffusion of metallic ions into the interlayer dielectric (lLD). Depending on the technology, in particular the choice of the ILD and the metal interconnect, the diffusion barrier may be Ti, Ta, TiN, TaN, or a multi-layered structure of these materials. The adhesion of the barrier to the dielectric, the conformality of the barrier to the feature, the physical structure of the film, and the chemical composition of the film are key issues that are determined in part by the nature of the deposition process. Likewise, after the growth of the barrier, a conducting layer (the seed layer) is needed for subsequent filling of the trench by electrochemical deposition. Again, the growth process must be able to deposit a film that is continuous along the topography of the sub-micron sized features. Other factors of concern are the purity and the texture of the seed layer, as both of these factors influence the final resistivity of the metallic interconnect. Sputter-deposited coatings are also commonly employed for their electro-optical properties. For example, an electrochromic glazing is used to control the flux of light that is transmitted through a glazed material.
