Dynamics in Small Confining Systems III: Volume 464 PDF Download
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Author: J. M. Drake
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 408
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Book Description
Interfacial science has rapidly expanded beyond the original realm of chemistry to include physics, mechanical and chemical engineering, biology, materials science, and other specialized subfields. This book in a series from MRS emphasizes the effects of confinement on the physical and chemical properties of equilibrium and nonequilibrium systems. Of particular interest is the question of how nearby surfaces or ultra-small geometries can force a system to behave in ways significantly different than it behaves in bulk. Theoretical, experimental and computational evidence of the effects of confinement on gaseous, liquid and solid systems is presented. Topics include: probing confined systems; structure and dynamics of liquids at interfaces; nanorheology and tribology; adsorption; diffusion in porous systems and reaction dynamics.
Author: J. M. Drake
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 408
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Book Description
Interfacial science has rapidly expanded beyond the original realm of chemistry to include physics, mechanical and chemical engineering, biology, materials science, and other specialized subfields. This book in a series from MRS emphasizes the effects of confinement on the physical and chemical properties of equilibrium and nonequilibrium systems. Of particular interest is the question of how nearby surfaces or ultra-small geometries can force a system to behave in ways significantly different than it behaves in bulk. Theoretical, experimental and computational evidence of the effects of confinement on gaseous, liquid and solid systems is presented. Topics include: probing confined systems; structure and dynamics of liquids at interfaces; nanorheology and tribology; adsorption; diffusion in porous systems and reaction dynamics.
Author: Ron Fulks
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 360
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Book Description
Flat-panel displays are rapidly becoming the displays of choice for a variety of information-displaying applications ranging from laptop computers to automobile and cockpit read-out devices. Passive matrix liquid-crystal displays, and more recently, active matrix liquid-crystal displays (AMLCDs) have led the way in the display revolution. In addition, emissive displays based on field emission, electroluminescence, and plasma charge are attracting considerable interest. Ultimately, however, the advancement in flat-panel display applications will be driven by cost and performance advantages which are dependent on the advancement of materials and process technologies used to fabricate the displays. This book focuses on the materials and large-area processes used by the various display technologies, both emissive and nonemissive, including liquid-crystal, electroluminescent, plasma, field-emission, and micromechanical displays. Topics include: AMLCD materials and processes; thin-film transistors for AMLCDs; emissive displays and materials and phosphor materials.
Author: Steve Granick
Publisher: Springer Science & Business Media
ISBN: 3540642668
Category : Technology & Engineering
Languages : en
Pages : 293
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Book Description
The rapidly-developing field of confined polymers is reviewed in this volume. Special emphasis is given to polymer aspects of this interdisciplinary problem. Taken together, the contributions offer ample evidence of how the field of polymer science continues to evolve with the passage of time. The topics revolve around the tendency of surfaces to impede chain relaxation and to stimulate new sorts of chain organization. These have been implicated in a variety of spectacular phenomena. Here is a listing of authors and affiliations: K. Binder (Johannes Gutenberg-Universität Mainz, Germany); P.-G. de Gennes (College de France, France); E.P. Giannelis, R. Krishnamoorti, and E. Manias (Cornell University and University of Houston, USA); G.S. Grest (Exxon Research and Engineering Co., USA); L. Leger, E. Raphael, and H. Hervet (College de France, France); S.-Q. Wang (Case Western Reserve University, USA).
Author: Carlye Case
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 320
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Fernando A. Ponce
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 1290
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Book Description
Author: Clyde L. Briant
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 546
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Book Description
The study of interfaces is one of the oldest areas of research in materials science. The presence of grain boundaries in materials has long been recognized, as has its crucial role in determining mechanical properties. Another long-recognized concept is that the properties of a surface are quite different from those of the bulk. In recent years, researchers have been able to study these interfaces, both internal and external, with a detail not before possible. These advances have stemmed from the ability to obtain atomic resolution images of interfaces, to measure accurate chemical compositions of interfaces, and to model these interfaces and their properties. This volume goes a step further, beyond structural and chemical studies, to explore how all of this information can be used to engineer interfaces for improved properties and overall improved material performance. Significant attention is given to the crystallographic nature of grain boundaries and interfaces, and the relationship between this nature and the performance of a material. The versatility of electron back-scattering pattern analysis (EBSP) in solving a number of interface-related problems is also featured.
Author: John R. Dutcher
Publisher: CRC Press
ISBN: 0203027000
Category : Science
Languages : en
Pages : 426
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Book Description
Representing the wide breadth academic disciplines involved in this ever-expanding area of research, this reference provides a comprehensive overview of current scientific and technological advancements in soft materials analysis and application. Documenting new and emerging challenges in this burgeoning field, Soft Materials is a unique and outsta
Author: J. Joseph Clement
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 488
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Book Description
The inexorable drive for increased integrated circuit functionality and performance places growing demands on the metal and dielectric thin films used in fabricating these circuits, as well as spurring demand for new materials applications and processes. This book directly addresses issues of widespread concern in the microelectronics industry - smaller feature sizes, new materials and new applications that challenge the reliability of new technologies. While the book continues the focus on issues related to interconnect reliability, such as electromigration and stress, particular emphasis is placed on the effects of microstructure. An underlying theme is understanding the importance of interactions among different materials and associated interfaces comprising a single structure with dimensions near or below the micrometer scale. Topics include: adhesion and fracture; gate oxide growth and oxide interfaces; surface preparation and gate oxide reliability; oxide degradation and defects; micro-structure, texture and reliability; novel measurement techniques; interconnect performance and reliability modeling; electromigration and interconnect reliability and stress and stress relaxation.
Author: André Lagendijk
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 224
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Book Description
Low-dielectric constant materials are needed to improve the performance and speed of future integrated circuits. In fact, the diversity of contributors to this book is testimony to the global significance of the topic to the future of semiconductor manufacturing. Presentations include those by semiconductor equipment manufacturers and chemical source suppliers, academia from six countries, four government laboratories and five major device manufacturers. Approaches to designing and implementing reduction in dielectric constant for intermetal dielectric materials are featured and range from the evolution of silicon dioxide to fluorinated silicate glass, to the use of inorganic/organic polymers and spin-on-material, to fluorinated diamond-like carbon and nanoporous silica. The book also addresses the practical aspects of the use of low-dielectric constant materials such as chemical mechanical polishing of these materials and optimization of wiring delays in devices utilizing low-k material.
Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 336
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Book Description
