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Author: Yogesh Kumar Sharma
Publisher: BoD – Books on Demand
ISBN: 1789236681
Category : Technology & Engineering
Languages : en
Pages : 154
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Book Description
SiC and GaN devices have been around for some time. The first dedicated international conference on SiC and related devices, "ICSCRM," was held in Washington, DC, in 1987. But only recently, the commercialization of SiC and GaN devices has happened. Due to its material properties, Si as a semiconductor has limitations in high-temperature, high-voltage, and high-frequency regimes. With the help of SiC and GaN devices, it is possible to realize more efficient power systems. Devices manufactured from SiC and GaN have already been impacting different areas with their ability to outperform Si devices. Some of the examples are the telecommunications, automotive/locomotive, power, and renewable energy industries. To achieve the carbon emission targets set by different countries, it is inevitable to use these new technologies. This book attempts to cover all the important facets related to wide bandgap semiconductor technology, including new challenges posed by it. This book is intended for graduate students, researchers, engineers, and technology experts who have been working in the exciting fields of SiC and GaN power devices.
Author: Yogesh Kumar Sharma
Publisher: BoD – Books on Demand
ISBN: 1789236681
Category : Technology & Engineering
Languages : en
Pages : 154
Get Book Here
Book Description
SiC and GaN devices have been around for some time. The first dedicated international conference on SiC and related devices, "ICSCRM," was held in Washington, DC, in 1987. But only recently, the commercialization of SiC and GaN devices has happened. Due to its material properties, Si as a semiconductor has limitations in high-temperature, high-voltage, and high-frequency regimes. With the help of SiC and GaN devices, it is possible to realize more efficient power systems. Devices manufactured from SiC and GaN have already been impacting different areas with their ability to outperform Si devices. Some of the examples are the telecommunications, automotive/locomotive, power, and renewable energy industries. To achieve the carbon emission targets set by different countries, it is inevitable to use these new technologies. This book attempts to cover all the important facets related to wide bandgap semiconductor technology, including new challenges posed by it. This book is intended for graduate students, researchers, engineers, and technology experts who have been working in the exciting fields of SiC and GaN power devices.
Author: Yogesh Kumar Sharma
Publisher:
ISBN: 9781789236699
Category : Electrical engineering. Electronics. Nuclear engineering
Languages : en
Pages : 152
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Book Description
SiC and GaN devices have been around for some time. The first dedicated international conference on SiC and related devices, ""ICSCRM,"" was held in Washington, DC, in 1987. But only recently, the commercialization of SiC and GaN devices has happened. Due to its material properties, Si as a semiconductor has limitations in high-temperature, high-voltage, and high-frequency regimes. With the help of SiC and GaN devices, it is possible to realize more efficient power systems. Devices manufactured from SiC and GaN have already been impacting different areas with their ability to outperform Si devices. Some of the examples are the telecommunications, automotive/locomotive, power, and renewable energy industries. To achieve the carbon emission targets set by different countries, it is inevitable to use these new technologies. This book attempts to cover all the important facets related to wide bandgap semiconductor technology, including new challenges posed by it. This book is intended for graduate students, researchers, engineers, and technology experts who have been working in the exciting fields of SiC and GaN power devices.
Author: Farid Medjdoub
Publisher: MDPI
ISBN: 3036505660
Category : Technology & Engineering
Languages : en
Pages : 242
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Book Description
Emerging wide bandgap (WBG) semiconductors hold the potential to advance the global industry in the same way that, more than 50 years ago, the invention of the silicon (Si) chip enabled the modern computer era. SiC- and GaN-based devices are starting to become more commercially available. Smaller, faster, and more efficient than their counterpart Si-based components, these WBG devices also offer greater expected reliability in tougher operating conditions. Furthermore, in this frame, a new class of microelectronic-grade semiconducting materials that have an even larger bandgap than the previously established wide bandgap semiconductors, such as GaN and SiC, have been created, and are thus referred to as “ultra-wide bandgap” materials. These materials, which include AlGaN, AlN, diamond, Ga2O3, and BN, offer theoretically superior properties, including a higher critical breakdown field, higher temperature operation, and potentially higher radiation tolerance. These attributes, in turn, make it possible to use revolutionary new devices for extreme environments, such as high-efficiency power transistors, because of the improved Baliga figure of merit, ultra-high voltage pulsed power switches, high-efficiency UV-LEDs, and electronics. This Special Issue aims to collect high quality research papers, short communications, and review articles that focus on wide bandgap device design, fabrication, and advanced characterization. The Special Issue will also publish selected papers from the 43rd Workshop on Compound Semiconductor Devices and Integrated Circuits, held in France (WOCSDICE 2019), which brings together scientists and engineers working in the area of III–V, and other compound semiconductor devices and integrated circuits. In particular, the following topics are addressed: – GaN- and SiC-based devices for power and optoelectronic applications – Ga2O3 substrate development, and Ga2O3 thin film growth, doping, and devices – AlN-based emerging material and devices – BN epitaxial growth, characterization, and devices
Author: Zhe Chuan Feng
Publisher: CRC Press
ISBN: 0429583958
Category : Science
Languages : en
Pages : 465
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Book Description
This handbook presents the key properties of silicon carbide (SiC), the power semiconductor for the 21st century. It describes related technologies, reports the rapid developments and achievements in recent years, and discusses the remaining challenging issues in the field. The book consists of 15 chapters, beginning with a chapter by Professor W. J. Choyke, the leading authority in the field, and is divided into four sections. The topics include presolar SiC history, vapor-liquid-solid growth, spectroscopic investigations of 3C-SiC/Si, developments and challenges in the 21st century; CVD principles and techniques, homoepitaxy of 4H-SiC, cubic SiC grown on 4H-SiC, SiC thermal oxidation processes and MOS interface, Raman scattering, NIR luminescent studies, Mueller matrix ellipsometry, Raman microscopy and imaging, 4H-SiC UV photodiodes, radiation detectors, and short wavelength and synchrotron X-ray diffraction. This comprehensive work provides a strong contribution to the engineering, materials, and basic science knowledge of the 21st century, and will be of interest to material growers, designers, engineers, scientists, postgraduate students, and entrepreneurs.
Author: Jung-Hun Seo
Publisher: MDPI
ISBN: 3038978426
Category : Technology & Engineering
Languages : en
Pages : 138
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Book Description
While group IV or III-V based device technologies have reached their technical limitations (e.g., limited detection wavelength range or low power handling capability), wide bandgap (WBG) semiconductors which have band-gaps greater than 3 eV have gained significant attention in recent years as a key semiconductor material in high-performance optoelectronic and electronic devices. These WBG semiconductors have two definitive advantages for optoelectronic and electronic applications due to their large bandgap energy. WBG energy is suitable to absorb or emit ultraviolet (UV) light in optoelectronic devices. It also provides a higher electric breakdown field, which allows electronic devices to possess higher breakdown voltages. This Special Issue seeks research papers, short communications, and review articles that focus on novel synthesis, processing, designs, fabrication, and modeling of various WBG semiconductor power electronics and optoelectronic devices.
Author: Michael Robert Hontz
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 120
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Book Description
This dissertation investigates the modeling of next generation wide bandgap semiconductors in several domains. The first model developed is of a GaN Schottky diode with a unique AlGaN cap layer. This model is developed using fundamental physical laws and analysis and allows for the characteristics of the diode to be designed by adjusting aspects of the diode's fabrication and structure. The second model is of a lateral GaN HEMT and is developed using TCAD simulation software in order to fit experimental data based on static characteristics. This procedure endeavors to simultaneously fit several output characteristics of the HEMT device to facilitate the applicability and evaluation of the device for power electronics applications. This model is then used to analyze the effects of various substrate material choices on the performance of the GaN HEMT in a switching application. Finally, a link between TCAD models of devices and a circuit simulation platform is demonstrated. This system allows for simulation and testing of devices in complex power electronic systems while maintaining a direct dependence between the system-level performance and the physical parameters of the device. This link between TCAD and circuit simulation is then used to develop an iterative optimization procedure to design a semiconductor device for a particular power electronic application. The work demonstrated here develops procedures to create high-fidelity models of wide bandgap semiconductor devices and enables the purposeful design of devices for their intended application with a high degree of confidence in meeting system requirements. It is through this focusing of device modeling and design, that the rate of technological transfer of next-generation semiconductor devices to power electronics systems can be improved.
Author: S. Jang
Publisher: The Electrochemical Society
ISBN: 1607688700
Category : Science
Languages : en
Pages : 53
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Book Description
This issue of ECS Transactions includes papers based on presentations from the symposium "Wide Bandgap Semiconductor Materials and Devices 20," originally held at the 235th ECS Meeting in Dallas, Texas, May 26-30, 2019.
Author: Wenshen Li
Publisher:
ISBN:
Category :
Languages : en
Pages : 452
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Book Description
Compared with silicon, wide-bandgap semiconductors offer much higher power efficiency for high-power applications, primarily due to the much higher breakdown field. While the performance advantage has already been offered by vertical SiC and lateral GaN-on-Si devices, even higher promises from vertical GaN devices and ultrawide-bandgap semiconductors such as _-Ga2O3 have not been fully delivered. One of the major reasons is the challenge in managing the high electric field in those materials, without established selective-area p-type doping techniques as in GaN, or effective p-type doping alone as in _-Ga2O3. In this dissertation, we tackle this challenge in vertical GaN and Ga2O3 power devices by investigating novel electric-field management techniques and doping-related issues. The first half the work is centered around leakage-current reduction in power Schottky barrier diodes (SBDs) through the reduced surface field (RESURF) effect, which is arguably necessary for kilovolt-class operations. Two novel device structures are designed and implemented, including i) a trench junction-barrier-Schottky diode (JBSD) structure in GaN that possess the desired RESURF effect without needing for selective-area p-doping, and ii) a trench SBD structure in Ga2O3 that achieves significant leakage-current reduction thus a record-high power figure-of-merit of up to 0.95 GW/cm2 among Ga2O3 power devices, but without the need for p-doping. Furthermore, the ideal reverse leakage characteristics in Ga2O3 SBDs is convincingly identified, enabling the calculation of the practical maximum surface electric field in SBDs - an important concept we unambiguously proposed for the first time. The second half of the work is related to vertical power transistors. Using the MBE-regrowth technique, two novel designs of vertical GaN transistors are demonstrated, including GaN trench MOSFETs with regrown channel and GaN PolarMOS - a VDMOS-like transistor with unique polarization-induced (PI) bulk doping. The main challenge in the regrown lateral p-n junctions in these devices is explicitly revealed by interrogating the regrowth interface, where a significant amount of donor-like charges are found. In addition, sidewall activation and incorporations of PI doping in buried p-type layers are realized for voltage-blocking purposes. In Ga2O3, vertical fin power transistors are developed, showing a high breakdown voltage of over 2.6 kV and a normally-off operation without needing for p-doping. Overall, while p-type doping is extremely beneficial for wide-bandgap vertical power devices, it might not be absolutely necessary, provided that proper electrostatic designs and alternative voltage-blocking junctions are effectively implemented.
Author: Gregory S. Nusinovich
Publisher: John Wiley & Sons
ISBN: 0471683728
Category : Technology & Engineering
Languages : en
Pages : 885
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Book Description
A comprehensive study of microwave vacuum electronic devices and their current and future applications While both vacuum and solid-state electronics continue to evolve and provide unique solutions, emerging commercial and military applications that call for higher power and higher frequencies to accommodate massive volumes of transmitted data are the natural domain of vacuum electronics technology. Modern Microwave and Millimeter-Wave Power Electronics provides systems designers, engineers, and researchers-especially those with primarily solid-state training-with a thoroughly up-to-date survey of the rich field of microwave vacuum electronic device (MVED) technology. This book familiarizes the R&D and academic communities with the capabilities and limitations of MVED and highlights the exciting scientific breakthroughs of the past decade that are dramatically increasing the compactness, efficiency, cost-effectiveness, and reliability of this entire class of devices. This comprehensive text explores a wide range of topics: Traveling-wave tubes, which form the backbone of satellite and airborne communications, as well as of military electronic countermeasures systems Microfabricated MVEDs and advanced electron beam sources Klystrons, gyro-amplifiers, and crossed-field devices "Virtual prototyping" of MVEDs via advanced 3-D computational models High-Power Microwave (HPM) sources Next-generation microwave structures and circuits How to achieve linear amplification Advanced materials technologies for MVEDs A Web site appendix providing a step-by-step walk-through of a typical MVED design process Concluding with an in-depth examination of emerging applications and future possibilities for MVEDs, Modern Microwave and Millimeter-Wave Power Electronics ensures that systems designers and engineers understand and utilize the significant potential of this mature, yet continually developing technology. SPECIAL NOTE: All of the editors' royalties realized from the sale of this book will fund the future research and publication activities of graduate students in the vacuum electronics field.
Author: Andrew Joseph Sellers
Publisher:
ISBN:
Category : Power electronics
Languages : en
Pages : 0
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Book Description
This dissertation investigates the propagation of information between models of disparate computational complexity and simulation domains with specific focus on the modeling of wide bandgap semiconductors for power electronics applications. First, analytical physics models and technology computer-aided design numerical physics models are presented. These types of physics models are contrasted by ease of generation and computational complexity. Next, processes generating transient simulations from these models are identified. Mixed-mode simulation and behavioral device models are established as two available options. Of these two, behavioral models are identified as the method producing superior computational performance due to their much-reduced simulation time. A comparison of switching performance for two wide bandgap field-effect transistors manufactured with the same process is next presented. Empirical and simulated switching results demonstrate that available models predict the slew rates reasonably well, but fail to accurately capture ringing frequencies. This is attributed to two primary causes; the modeling tool used for this comparison is incapable of producing a sufficiently high-quality fit to ensure accurate prediction and the devices are sensitive to parasitic values beyond the measurement uncertainty of the characterization hardware. To remedy this, a two-fold approach is necessary. First, a new model must be generated which is more capable of predicting steady-state performance. Second, a characterization procedure must be produced which tunes parameters beyond what is possible with empirical characterization. To the first point, a novel model based on the Curtice model is presented. The novel model adapts the Curtice model by adding gate-bias dependence to model parameters and introducing an exponential smoothing function to account for the gradual transition from linear to saturation exhibited by some wide bandgap field-effect transistors. Care is taken to model forward conduction, reverse conduction, and transfer characteristics with high accuracy. Non-linear capacitances are then modeled using a charge-based lookup table demonstrated by previous work in the literature to be effective. Thermal performance is accounted for with both the incorporation of thermal scaling factors and a thermal RC network to account for joule-heating. The proposed model is capable of capturing device steady-state and small-signal performance more precisely than previous models. A tuning and optimization procedure is next presented which is capable of tuning device model parasitic values within uncertainty bounds of characterization data. This method identifies the need for and introduces new model parameters intended to account for dispersive phenomena to a first degree. Pairing this method with the aforementioned model, significant improvements in transient agreement can be achieved for fast-switching devices. A method is also presented which identifies and quantifies the impact of parameters on transient performance. This process can be used to remove model parameters from the tuning set and possibly decouple parameter tuning. The propagation of these fully-tuned device and circuit models to the system level is next discussed. The cases of a buck converter and double pulse test are used as examples of dc switching circuits which may be used for switching characterization and to account for switching losses. Simulation is used to demonstrate that these circuits, when using similar components, produce comparable results. This allows the use of double pulse tests for switching characterization in simulation, thus eliminating the need for quasi-steady-state conditions to be reached in converter simulation. Methods are proposed for the inclusion of this data into system-level models such that simulation time will be minimally impacted. When used in conjunction, the methods presented in this chapter are sufficient to propagate information from the physics level all the way through to the system level. If specific circuits and system components are known, the impact of including a theoretical device can be assessed. This lends itself to advanced design of each type of model by analyzing the interactions predicted by various levels of models. This has serious implications for accelerating the deployment of wide bandgap semiconductor in power electronics by addressing the primary concerns of reliability and ease of implementation. By using these methods, devices, circuits, and systems can each be optimized to fully benefit from the theoretical advantages presented by wide bandgap semiconductor materials.
