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Author:
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
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Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author:
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
Get Book Here
Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author: Rakesh Kumar Garg
Publisher: Firewall Media
ISBN: 9788131803028
Category : Electronics
Languages : en
Pages : 488
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Book Description
Author: P.T. Landsberg
Publisher: Elsevier
ISBN: 1483291103
Category : Science
Languages : en
Pages : 1219
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Book Description
Since Volume 1 was published in 1982, the centres of interest in the basic physics of semiconductors have shifted. Volume 1 was called Band Theory and Transport Properties in the first edition, but the subject has broadened to such an extent that Basic Properties is now a more suitable title. Seven chapters have been rewritten by the original authors. However, twelve chapters are essentially new, with the bulk of this work being devoted to important current topics which give this volume an almost encyclopaedic form. The first three chapters discuss various aspects of modern band theory and the next two analyze impurities in semiconductors. Then follow chapters on semiconductor statistics and on surfaces, interfaces and band offsets as they occur in heterojunctions. Chapters 8 to 19 report on newer topics (though a survey of transport properties of carriers is also included). Among these are transport of hot electrons, and thermoelectric effects including here and elsewhere properties of low-dimensional and mesoscopic structures. The electron-hole liquid, the quantum Hall effect, localisation, ballistic transport, coherence in superlattices, current ideas on tunnelling and on quantum confinement and scattering processes are also covered.
Author: Nestor E Terleckyj
Publisher: Routledge
ISBN: 100024119X
Category : Social Science
Languages : en
Pages : 226
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Book Description
This volume presents a series of quantitative indicators which are intended to illuminate some of the important aspects of the role played by scientific and R&D activities in our economic and social life not already described by existing data. The present collection contains a variety of additional indicators. In preparing them, the main emphasis was placed on developing indicators of the effects of science and research on the economy and society.
Author: Jerry C. Whitaker
Publisher: CRC Press
ISBN: 9780849383458
Category : Technology & Engineering
Languages : en
Pages : 2626
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Book Description
The superb organization of The Electronics Handbook means that it is not only a comprehensive and fascinating reference, but also a pleasure to use. Some of these organizational features include:
Author: Franco Malerba
Publisher: Univ of Wisconsin Press
ISBN: 9780299104603
Category : Business & Economics
Languages : en
Pages : 276
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Book Description
Author: Vítezslav Benda
Publisher: John Wiley & Sons
ISBN: 9780471976448
Category : Technology & Engineering
Languages : en
Pages : 438
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Book Description
Dieses Buch beschreibt in leicht verständlicher Weise Aufbau, Funktion, Eigenschaften und Anwendungsmöglichkeiten wichtiger Halbleiter-Bauelemente - von Leistungsdioden über Thyristoren und MOSFETs bis hin zu integrierten Systemen. Die Autoren verzichten dabei auf komplizierte Mathematik; sie stützen sich vielmehr auf grundlegende physikalische Modelle. (11/98)
Author: Andrew F. Malison
Publisher: DIANE Publishing
ISBN: 9780788103209
Category : Technology & Engineering
Languages : en
Pages : 48
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Book Description
Provides an overview of the structure and global competitiveness of the U.S. semiconductor industry and analyzes recent trends in semiconductor consumption, production, and trade. In addition, the report contains information on the use, manufacture, and customs treatment of semiconductors. Charts, tables and graphs.
Author: Nelson J. Hogge
Publisher:
ISBN:
Category : Semiconductor industry
Languages : en
Pages : 26
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Book Description
Author:
Publisher:
ISBN:
Category : Technology
Languages : en
Pages : 810
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Book Description
