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Author: Yuan Xie
Publisher: Springer Nature
ISBN: 3031017471
Category : Technology & Engineering
Languages : en
Pages : 113
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Book Description
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.
Author: Yuan Xie
Publisher: Springer Nature
ISBN: 3031017471
Category : Technology & Engineering
Languages : en
Pages : 113
Get Book Here
Book Description
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.
Author: Yuan Xie
Publisher: Morgan & Claypool Publishers
ISBN: 1627057668
Category : Computers
Languages : en
Pages : 129
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Book Description
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.
Author: Hafizur Rahaman
Publisher: Springer
ISBN: 3642314945
Category : Computers
Languages : en
Pages : 427
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Book Description
This book constitutes the refereed proceedings of the 16th International Symposium on VSLI Design and Test, VDAT 2012, held in Shibpur, India, in July 2012. The 30 revised regular papers presented together with 10 short papers and 13 poster sessions were carefully selected from 135 submissions. The papers are organized in topical sections on VLSI design, design and modeling of digital circuits and systems, testing and verification, design for testability, testing memories and regular logic arrays, embedded systems: hardware/software co-design and verification, emerging technology: nanoscale computing and nanotechnology.
Author: Lizhong Chen
Publisher: Springer Nature
ISBN: 3031017706
Category : Technology & Engineering
Languages : en
Pages : 124
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Book Description
Artificial intelligence has already enabled pivotal advances in diverse fields, yet its impact on computer architecture has only just begun. In particular, recent work has explored broader application to the design, optimization, and simulation of computer architecture. Notably, machine-learning-based strategies often surpass prior state-of-the-art analytical, heuristic, and human-expert approaches. This book reviews the application of machine learning in system-wide simulation and run-time optimization, and in many individual components such as caches/memories, branch predictors, networks-on-chip, and GPUs. The book further analyzes current practice to highlight useful design strategies and identify areas for future work, based on optimized implementation strategies, opportune extensions to existing work, and ambitious long term possibilities. Taken together, these strategies and techniques present a promising future for increasingly automated computer architecture designs.
Author: Riko Radojcic
Publisher: Springer
ISBN: 3319525484
Category : Technology & Engineering
Languages : en
Pages : 192
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Book Description
This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.
Author: Nima Aghaee Ghaleshahi
Publisher: Linköping University Electronic Press
ISBN: 9176859495
Category :
Languages : en
Pages : 219
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Book Description
Many cutting-edge computer and electronic products are powered by advanced Systems-on-Chip (SoC). Advanced SoCs encompass superb performance together with large number of functions. This is achieved by efficient integration of huge number of transistors. Such very large scale integration is enabled by a core-based design paradigm as well as deep-submicron and 3D-stacked-IC technologies. These technologies are susceptible to reliability and testing complications caused by thermal issues. Three crucial thermal issues related to temperature variations, temperature gradients, and temperature cycling are addressed in this thesis. Existing test scheduling techniques rely on temperature simulations to generate schedules that meet thermal constraints such as overheating prevention. The difference between the simulated temperatures and the actual temperatures is called temperature error. This error, for past technologies, is negligible. However, advanced SoCs experience large errors due to large process variations. Such large errors have costly consequences, such as overheating, and must be taken care of. This thesis presents an adaptive approach to generate test schedules that handle such temperature errors. Advanced SoCs manufactured as 3D stacked ICs experience large temperature gradients. Temperature gradients accelerate certain early-life defect mechanisms. These mechanisms can be artificially accelerated using gradient-based, burn-in like, operations so that the defects are detected before shipping. Moreover, temperature gradients exacerbate some delay-related defects. In order to detect such defects, testing must be performed when appropriate temperature-gradients are enforced. A schedule-based technique that enforces the temperature-gradients for burn-in like operations is proposed in this thesis. This technique is further developed to support testing for delay-related defects while appropriate gradients are enforced. The last thermal issue addressed by this thesis is related to temperature cycling. Temperature cycling test procedures are usually applied to safety-critical applications to detect cycling-related early-life failures. Such failures affect advanced SoCs, particularly through-silicon-via structures in 3D-stacked-ICs. An efficient schedule-based cycling-test technique that combines cycling acceleration with testing is proposed in this thesis. The proposed technique fits into existing 3D testing procedures and does not require temperature chambers. Therefore, the overall cycling acceleration and testing cost can be drastically reduced. All the proposed techniques have been implemented and evaluated with extensive experiments based on ITC’02 benchmarks as well as a number of 3D stacked ICs. Experiments show that the proposed techniques work effectively and reduce the costs, in particular the costs related to addressing thermal issues and early-life failures. We have also developed a fast temperature simulation technique based on a closed-form solution for the temperature equations. Experiments demonstrate that the proposed simulation technique reduces the schedule generation time by more than half.
Author: Luiz André Barroso
Publisher: Morgan & Claypool Publishers
ISBN: 1681734346
Category : Computers
Languages : en
Pages : 209
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Book Description
This book describes warehouse-scale computers (WSCs), the computing platforms that power cloud computing and all the great web services we use every day. It discusses how these new systems treat the datacenter itself as one massive computer designed at warehouse scale, with hardware and software working in concert to deliver good levels of internet service performance. The book details the architecture of WSCs and covers the main factors influencing their design, operation, and cost structure, and the characteristics of their software base. Each chapter contains multiple real-world examples, including detailed case studies and previously unpublished details of the infrastructure used to power Google's online services. Targeted at the architects and programmers of today's WSCs, this book provides a great foundation for those looking to innovate in this fascinating and important area, but the material will also be broadly interesting to those who just want to understand the infrastructure powering the internet. The third edition reflects four years of advancements since the previous edition and nearly doubles the number of pictures and figures. New topics range from additional workloads like video streaming, machine learning, and public cloud to specialized silicon accelerators, storage and network building blocks, and a revised discussion of data center power and cooling, and uptime. Further discussions of emerging trends and opportunities ensure that this revised edition will remain an essential resource for educators and professionals working on the next generation of WSCs.
Author: Daichi Fujiki
Publisher: Springer Nature
ISBN: 3031017722
Category : Technology & Engineering
Languages : en
Pages : 124
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Book Description
This book provides a structured introduction of the key concepts and techniques that enable in-/near-memory computing. For decades, processing-in-memory or near-memory computing has been attracting growing interest due to its potential to break the memory wall. Near-memory computing moves compute logic near the memory, and thereby reduces data movement. Recent work has also shown that certain memories can morph themselves into compute units by exploiting the physical properties of the memory cells, enabling in-situ computing in the memory array. While in- and near-memory computing can circumvent overheads related to data movement, it comes at the cost of restricted flexibility of data representation and computation, design challenges of compute capable memories, and difficulty in system and software integration. Therefore, wide deployment of in-/near-memory computing cannot be accomplished without techniques that enable efficient mapping of data-intensive applications to such devices, without sacrificing accuracy or increasing hardware costs excessively. This book describes various memory substrates amenable to in- and near-memory computing, architectural approaches for designing efficient and reliable computing devices, and opportunities for in-/near-memory acceleration of different classes of applications.
Author: Gogte Vaibhav
Publisher: Springer Nature
ISBN: 303179205X
Category : Technology & Engineering
Languages : en
Pages : 95
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Book Description
This book introduces readers to emerging persistent memory (PM) technologies that promise the performance of dynamic random-access memory (DRAM) with the durability of traditional storage media, such as hard disks and solid-state drives (SSDs). Persistent memories (PMs), such as Intel's Optane DC persistent memories, are commercially available today. Unlike traditional storage devices, PMs can be accessed over a byte-addressable load-store interface with access latency that is comparable to DRAM. Unfortunately, existing hardware and software systems are ill-equipped to fully avail the potential of these byte-addressable memory technologies as they have been designed to access traditional storage media over a block-based interface. Several mechanisms have been explored in the research literature over the past decade to design hardware and software systems that provide high-performance access to PMs.Because PMs are durable, they can retain data across failures, such as power failures and program crashes. Upon a failure, recovery mechanisms may inspect PM data, reconstruct state and resume program execution. Correct recovery of data requires that operations to the PM are properly ordered during normal program execution. Memory persistency models define the order in which memory operations are performed at the PM. Much like memory consistency models, memory persistency models may be relaxed to improve application performance. Several proposals have emerged recently to design memory persistency models for hardware and software systems and for high-level programming languages. These proposals differ in several key aspects; they relax PM ordering constraints, introduce varying programmability burden, and introduce differing granularity of failure atomicity for PM operations.This primer provides a detailed overview of the various classes of the memory persistency models, their implementations in hardware, programming languages and software systems proposed in the recent research literature, and the PM ordering techniques employed by modern processors.
Author: Brandon Reagen
Publisher: Springer Nature
ISBN: 3031017560
Category : Technology & Engineering
Languages : en
Pages : 109
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Book Description
Machine learning, and specifically deep learning, has been hugely disruptive in many fields of computer science. The success of deep learning techniques in solving notoriously difficult classification and regression problems has resulted in their rapid adoption in solving real-world problems. The emergence of deep learning is widely attributed to a virtuous cycle whereby fundamental advancements in training deeper models were enabled by the availability of massive datasets and high-performance computer hardware. This text serves as a primer for computer architects in a new and rapidly evolving field. We review how machine learning has evolved since its inception in the 1960s and track the key developments leading up to the emergence of the powerful deep learning techniques that emerged in the last decade. Next we review representative workloads, including the most commonly used datasets and seminal networks across a variety of domains. In addition to discussing the workloads themselves, we also detail the most popular deep learning tools and show how aspiring practitioners can use the tools with the workloads to characterize and optimize DNNs. The remainder of the book is dedicated to the design and optimization of hardware and architectures for machine learning. As high-performance hardware was so instrumental in the success of machine learning becoming a practical solution, this chapter recounts a variety of optimizations proposed recently to further improve future designs. Finally, we present a review of recent research published in the area as well as a taxonomy to help readers understand how various contributions fall in context.
