High-Frequency Integrated Circuits PDF Download
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Author: Sorin Voinigescu
Publisher: Cambridge University Press
ISBN: 0521873029
Category : Technology & Engineering
Languages : en
Pages : 921
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Book Description
A transistor-level, design-intensive overview of high speed and high frequency monolithic integrated circuits for wireless and broadband systems from 2 GHz to 200 GHz, this comprehensive text covers high-speed, RF, mm-wave, and optical fibre circuits using nanoscale CMOS, SiGe BiCMOS, and III-V technologies. Step-by-step design methodologies, end-of chapter problems, and practical simulation and design projects are provided, making this an ideal resource for senior undergraduate and graduate courses in circuit design. With an emphasis on device-circuit topology interaction and optimization, it gives circuit designers and students alike an in-depth understanding of device structures and process limitations affecting circuit performance.
Author: Sorin Voinigescu
Publisher: Cambridge University Press
ISBN: 0521873029
Category : Technology & Engineering
Languages : en
Pages : 921
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Book Description
A transistor-level, design-intensive overview of high speed and high frequency monolithic integrated circuits for wireless and broadband systems from 2 GHz to 200 GHz, this comprehensive text covers high-speed, RF, mm-wave, and optical fibre circuits using nanoscale CMOS, SiGe BiCMOS, and III-V technologies. Step-by-step design methodologies, end-of chapter problems, and practical simulation and design projects are provided, making this an ideal resource for senior undergraduate and graduate courses in circuit design. With an emphasis on device-circuit topology interaction and optimization, it gives circuit designers and students alike an in-depth understanding of device structures and process limitations affecting circuit performance.
Author: François Brunier
Publisher: CRC Press
ISBN: 1003812260
Category : Technology & Engineering
Languages : en
Pages : 194
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Book Description
In today’s connected world, the demand for mobile communications and instant access to information, anytime and anywhere, has drastically changed the electronics landscape, both consumer and industrial. Novel 5G and 6G systems will enable connectivity in all forms between humans, devices, machines, and any objects. They will provide virtually ubiquitous, ultra-high bandwidth and low latency network access to individual users, as well as to all objects benefiting from being connected. They will be the "eyes and ears" of Artificial Intelligence systems as it will provide real-time data collection and analysis. Such diversity calls for a new paradigm in terms of flexibility, not only related to performance, but also in terms of scalability and cost. 5G and 6G communication systems imply a major stake of sovereignty and autonomy for the communication sector and digital infrastructures of the future. All products related to IoT, traffic, and health care, supported by connectivity will benefit the citizens in their daily lives to improve everything from business to private affairs. Together, this will influence society as much as smart phones did in the recent past. It is all about communication and connectivity. This book provides an overview of the latest research results in this field. It is based on the close collaboration in the BEYOND5 project, extended with vision and roadmap insights by European experts leading the 6G development. The BEYOND5 project has built a completely European supply chain for Radio-Frequency Electronics, enabling new RF domains for sensing, communication, 5G radio infrastructure and beyond. Moving forward into higher frequency bands above 100 GHz for 6G, also more disruptive technologies, using heterogeneous integration of CMOS, SOI, and III/V components such as GaN or InP, and advanced packaging techniques will be necessary to realize the objectives of ubiquitous, ultra-high bandwidth and low latency networks. The book bundles the scientific content of the International Workshop on "Technologies enabling future mobile connectivity & sensing" in Lisbon, Portugal 10 September 2023, as part of the ESSCIRC/ESSDERC 2023 European Solid-state Circuits and Devices Conference. Through articles and abstracts, a combined view of experts and practitioners representing academia, research, and industry in the field of wireless communication systems is given. They cover the topics of RF and digital SOI technology development for 5 and 6G, device and substrate characterization, packaging technology, and the realization of full systems including power amplifiers, linearization techniques, beamforming transceivers, access points, and radar detection.
Author: IEEE Staff
Publisher:
ISBN: 9781665430821
Category :
Languages : en
Pages :
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Book Description
RFIC is the premier IC Conference focused on the latest developments in RF Microwave, and Millimeter Wave Integrated Circuit Technology and Innovation
Author: Theodore S. Rappaport
Publisher: Pearson Education
ISBN: 0132172283
Category : Computers
Languages : en
Pages : 705
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Book Description
The Definitive, Comprehensive Guide to Cutting-Edge Millimeter Wave Wireless Design “This is a great book on mmWave systems that covers many aspects of the technology targeted for beginners all the way to the advanced users. The authors are some of the most credible scholars I know of who are well respected by the industry. I highly recommend studying this book in detail.” —Ali Sadri, Ph.D., Sr. Director, Intel Corporation, MCG mmWave Standards and Advanced Technologies Millimeter wave (mmWave) is today's breakthrough frontier for emerging wireless mobile cellular networks, wireless local area networks, personal area networks, and vehicular communications. In the near future, mmWave products, systems, theories, and devices will come together to deliver mobile data rates thousands of times faster than today's existing cellular and WiFi networks. In Millimeter Wave Wireless Communications, four of the field's pioneers draw on their immense experience as researchers, entrepreneurs, inventors, and consultants, empowering engineers at all levels to succeed with mmWave. They deliver exceptionally clear and useful guidance for newcomers, as well as the first complete desk reference for design experts. The authors explain mmWave signal propagation, mmWave circuit design, antenna designs, communication theory, and current standards (including IEEE 802.15.3c, Wireless HD, and ECMA/WiMedia). They cover comprehensive mmWave wireless design issues, for 60 GHz and other mmWave bands, from channel to antenna to receiver, introducing emerging design techniques that will be invaluable for research engineers in both industry and academia. Topics include Fundamentals: communication theory, channel propagation, circuits, antennas, architectures, capabilities, and applications Digital communication: baseband signal/channel models, modulation, equalization, error control coding, multiple input multiple output (MIMO) principles, and hardware architectures Radio wave propagation characteristics: indoor and outdoor applications Antennas/antenna arrays, including on-chip and in-package antennas, fabrication, and packaging Analog circuit design: mmWave transistors, fabrication, and transceiver design approaches Baseband circuit design: multi–gigabit-per-second, high-fidelity DAC and ADC converters Physical layer: algorithmic choices, design considerations, and impairment solutions; and how to overcome clipping, quantization, and nonlinearity Higher-layer design: beam adaptation protocols, relaying, multimedia transmission, and multiband considerations 60 GHz standardization: IEEE 802.15.3c for WPAN, Wireless HD, ECMA-387, IEEE 802.11ad, Wireless Gigabit Alliance (WiGig)
Author: Jaco du Preez
Publisher: Springer
ISBN: 3319621661
Category : Technology & Engineering
Languages : en
Pages : 367
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Book Description
This book provides a detailed review of millimeter-wave power amplifiers, discussing design issues and performance limitations commonly encountered in light of the latest research. Power amplifiers, which are able to provide high levels of output power and linearity while being easily integrated with surrounding circuitry, are a crucial component in wireless microwave systems. The book is divided into three parts, the first of which introduces readers to mm-wave wireless systems and power amplifiers. In turn, the second focuses on design principles and EDA concepts, while the third discusses future trends in power amplifier research. The book provides essential information on mm-wave power amplifier theory, as well as the implementation options and technologies involved in their effective design, equipping researchers, circuit designers and practicing engineers to design, model, analyze, test and implement high-performance, spectrally clean and energy-efficient mm-wave systems.
Author: Kiyoo Itoh
Publisher: Springer Science & Business Media
ISBN: 0387688536
Category : Technology & Engineering
Languages : en
Pages : 351
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Book Description
Ultra-low voltage large-scale integrated circuits (LSIs) in nano-scale technologies are needed both to meet the needs of a rapidly growing mobile cell phone market and to offset a significant increase in the power dissipation of high-end microprocessor units. The goal of this book is to provide a detailed explanation of the state-of-the-art nanometer and sub-1-V memory LSIs that are playing decisive roles in power conscious systems. Emerging problems between the device, circuit, and system levels are systematically discussed in terms of reliable high-speed operations of memory cells and peripheral logic circuits. The effectiveness of solutions at device and circuit levels is also described at length through clarifying noise components in an array, and even essential differences in ultra-low voltage operations between DRAMs and SRAMs.
Author: Ali M. Niknejad
Publisher: Springer Science & Business Media
ISBN: 0387765611
Category : Technology & Engineering
Languages : en
Pages : 313
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Book Description
This book compiles and presents the research results from the past five years in mm-wave Silicon circuits. This area has received a great deal of interest from the research community including several university and research groups. The book covers device modeling, circuit building blocks, phased array systems, and antennas and packaging. It focuses on the techniques that uniquely take advantage of the scale and integration offered by silicon based technologies.
Author:
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 2240
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Book Description
Author: Gernot Hueber
Publisher: Cambridge University Press
ISBN: 1108757510
Category : Technology & Engineering
Languages : en
Pages : 455
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Book Description
Discover the concepts, architectures, components, tools, and techniques needed to design millimeter-wave circuits for current and emerging wireless system applications. Focusing on applications in 5G, connectivity, radar, and more, leading experts in radio frequency integrated circuit (RFIC) design provide a comprehensive treatment of cutting-edge physical-layer technologies for radio frequency (RF) transceivers - specifically RF, analog, mixed-signal, and digital circuits and architectures. The full design chain is covered, from system design requirements through to building blocks, transceivers, and process technology. Gain insight into the key novelties of 5G through authoritative chapters on massive MIMO and phased arrays, and learn about the very latest technology developments, such as FinFET logic process technology for RF and millimeter-wave applications. This is an essential reading and an excellent reference for high-frequency circuit designers in both academia and industry.
Author: Rabindranath Bera
Publisher: Springer
ISBN: 9811334501
Category : Technology & Engineering
Languages : en
Pages : 574
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Book Description
The book covers recent trends in the field of devices, wireless communication and networking. It presents the outcomes of the International Conference in Communication, Devices and Networking (ICCDN 2018), which was organized by the Department of Electronics and Communication Engineering, Sikkim Manipal Institute of Technology, Sikkim, India on 2–3 June, 2018. Gathering cutting-edge research papers prepared by researchers, engineers and industry professionals, it will help young and experienced scientists and developers alike to explore new perspectives, and offer them inspirations on addressing real-world problems in the field of electronics, communication, devices and networking.
