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Author: F. Patrick McCluskey
Publisher: CRC Press
ISBN: 9780849396236
Category : Technology & Engineering
Languages : en
Pages : 354
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Book Description
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Author: F. Patrick McCluskey
Publisher: CRC Press
ISBN: 9780849396236
Category : Technology & Engineering
Languages : en
Pages : 354
Get Book Here
Book Description
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Author: Srinivasan Chandrasekaran
Publisher: Springer
ISBN: 9811076081
Category : Technology & Engineering
Languages : en
Pages : 344
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Book Description
This book provides detailed analysis methods and design guidelines for fire resistance, a vital consideration for offshore processing and production platforms. Recent advancements in the selection of various geometric structural forms for deep-water oil exploration and production require a detailed understanding of the design of offshore structures under special loads. Focusing on a relatively new aspect of offshore engineering, the book offers essential teaching material, illustrating and explaining the concepts discussed through many tutorials. It creates a basis for designing new courses for students of ocean engineering and naval architecture, civil engineering, and applied mechanics at both undergraduate and graduate levels. As such, its content can be used for self-study or as a text in structured courses and professional development programs.
Author: Jun-Shan Zhang
Publisher: Elsevier
ISBN: 0857090801
Category : Technology & Engineering
Languages : en
Pages : 383
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Book Description
The energy, petrochemical, aerospace and other industries all require materials able to withstand high temperatures. High temperature strength is defined as the resistance of a material to high temperature deformation and fracture. This important book provides a valuable reference to the main theories of high temperature deformation and fracture and the ways they can be used to predict failure and service life. - Analyses creep behaviour of materials, the evolution of dislocation substructures during creep, dislocation motion at elevated temperatures and importantly, recovery-creep theories of pure metals - Examines high temperature fracture, including nucleation of creep cavity, diffusional growth and constrained growth of creep cavities - A valuable reference to the main theories of high temperature deformation and fracture and the ways they can be used to predict failure and service life
Author: Aris Christou
Publisher: RIAC
ISBN: 1933904100
Category :
Languages : en
Pages : 260
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Book Description
Author:
Publisher: ASTM International
ISBN:
Category : Metals
Languages : en
Pages : 804
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Book Description
Author: Edward Miller
Publisher: CRC Press
ISBN: 100011032X
Category : Technology & Engineering
Languages : en
Pages : 392
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Book Description
This book provides information on complexities, peculiarities, and limitations of various molding processes, and the comparative advantages and disadvantages of the possible plastic products manufacturing techniques, to permit an ideal match of good design and processing.
Author: Geoffrey W. A. Dummer
Publisher: Elsevier
ISBN: 1483135918
Category : Technology & Engineering
Languages : en
Pages : 473
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Book Description
Environmental Testing Techniques for Electronics and Materials reviews environmental testing techniques for evaluating the performance of electronic equipment, components, and materials. Environmental test planning, test methods, and instrumentation are described, along with the general environmental conditions under which equipment must operate. This book is comprised of 15 chapters and begins by explaining why environmental testing is necessary and describing the environment in which electronics must operate. The next chapter considers how an environmental test plan is designed; the methods for the environmental testing of components and materials; instrumentation and control of test chambers; shock and vibration test instrumentation; and requirements for specification writing. The reader is then introduced to factors that might affect the reliability of equipment, including high humidity environment; galvanic corrosion problems; high- and low-temperature environments; mechanical and associated hazards; transport hazards; and long-term storage. Problems posed by high altitude and space environments, nuclear radiation, and acoustic noise are also discussed. The final chapter is devoted to environmental protection techniques and looks at the effects of climatic environments on radio interference as well as the effects of the environment on the human operator. This monograph will be of value to materials scientists and electronics engineers as well as those engaged in the design, development, and production of professional and military equipment.
Author: Timothy P. Gabb
Publisher:
ISBN:
Category : Heat resistant alloys
Languages : en
Pages : 16
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Book Description
Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 290
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Book Description
Author: C. G. Swanson
Publisher:
ISBN:
Category : Aerodynamics
Languages : en
Pages : 142
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Book Description
Time-dependent methods of analysis for colums, stiffened and unstiffened plates, and torsional members have been developed and programmed for the IBM 709 digital computer. The important material behaviors, i.e., soaking at temperatures, elastic and plastic strain, creep and residual stress and strain under varying temperature inputs, can be accounted for in the digital solutions. Two illustrative examples for obtaining allowable stresses are shown; the first for a stable structure in combined tensile and bending and the second for a column subjected to time-dependent displacements due to creep. These two examples are sufficiently typical to demonstrate the applicability of the procedures developed in this report or other procedures which give the stress-strain-deflection time history of a structure.
