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Author: National Institute of Standards and Technology (U.S.)
Publisher:
ISBN:
Category :
Languages : en
Pages : 1162
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Book Description
Author: National Institute of Standards and Technology (U.S.)
Publisher:
ISBN:
Category :
Languages : en
Pages : 1162
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Book Description
Author: Kenneth L. Kaiser
Publisher: CRC Press
ISBN: 9780849363627
Category : Technology & Engineering
Languages : en
Pages : 456
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Book Description
In chapters culled from the popular and critically acclaimed Electromagnetic Compatibility Handbook, Transmission Lines, Matching, and Crosstalk provides a tightly focused, convenient, and affordable reference for those interested primarily in this subset of topics. Author Kenneth L. Kaiser demystifies transmission lines, matching, and crosstalk and explains the source and limitations of the approximations, guidelines, models, and rules-of-thumb used in this field. The material is presented in a unique question-and-answer format that gets straight to the heart of each topic. The book includes numerous examples and uses Mathcad to generate all of the figures and many solutions to equations. In many cases, the entire Mathcad program is provided.
Author: Ashok Goel
Publisher: Momentum Press
ISBN: 1606505130
Category : Technology & Engineering
Languages : en
Pages : 394
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Book Description
Quantitative understanding of the parasitic capacitances and inductances, and the resultant propagation delays and crosstalk phenomena associated with the metallic interconnections on the very large scale integrated (VLSI) circuits has become extremely important for the optimum design of the state-of-the-art integrated circuits. More than 65 percent of the delays on the integrated circuit chip occur in the interconnections and not in the transistors on the chip. Mathematical techniques to model the parasitic capacitances, inductances, propagation delays, crosstalk noise, and electromigration-induced failure associated with the interconnections in the realistic high-density environment on a chip will be discussed. A One-Semester Course in Modeling of VLSI Interconnections also includes an overview of the future interconnection technologies for the nanotechnology circuits.
Author: Ashok K. Goel
Publisher: John Wiley & Sons
ISBN: 0470165960
Category : Technology & Engineering
Languages : en
Pages : 433
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Book Description
This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
Author: Blaise Ravelo
Publisher: Springer Nature
ISBN: 9811505527
Category : Technology & Engineering
Languages : en
Pages : 239
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Book Description
This book focuses on the modelling methodology of microstrip interconnects, discussing various structures of single-input multiple-output (SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based on single-input single-output (SIMO) models of symmetric and asymmetric trees, and investigates more complicated phenomenon, such as interbranch coupling. The modelling approaches are based on the analytical methods using the Z-, Y- and T-matrices. The established method enables the S-parameters and voltage transfer function of SIMO tree to be determined. Providing illustrative results with frequency and time domain analyses for each tree interconnect structure, the book is a valuable resource for researchers, engineers, and graduate students in fields of analogue, RF/microwave, digital and mixed circuit design, SI and manufacturing engineering.
Author: Franco Di Paolo
Publisher: CRC Press
ISBN: 1420039687
Category : Technology & Engineering
Languages : en
Pages : 643
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Book Description
A single text that incorporates all of the theoretical principles and practical aspects of planar transmission line devices - since the early development of striplines, it has been sought by countless microwave engineers, researchers, and students. With the publication of Networks and Devices Using Planar Transmission Lines, the search for that one authoritative resource is over. This is more than just a handbook, much more than a theoretical treatment. It's the ideal integration of the theory and applications of planar transmission lines and devices. Striplines, microstrips, slot lines, coplanar waveguides and strips, phase shifters, hybrids, and more - the author examines them all. For each type of structure, his treatment is complete and self-contained, including: Geometric characteristics Electric and magnetic field lines Solution techniques for the electromagnetic problem Quasi-static, coupled modes, and full wave analysis methods Design equations Attenuation Practical considerations Of particular interest is the author's comprehensive treatment of planar ferrimagnetic devices, such as phase shifters, isolators, and circulators, and three appendices dedicated to the theoretical aspects of ferrimagetism. Five other appendices provide thorough reviews of various theoretical concepts implicit in the body of the work, such as wave theory, the external properties of networks, and resonant circuits.
Author:
Publisher:
ISBN:
Category : Technology
Languages : en
Pages : 1454
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Book Description
Author: Andrew Peterson
Publisher: Springer Nature
ISBN: 3031472772
Category : Technology & Engineering
Languages : en
Pages : 224
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Book Description
This book provides an introduction to transmission line effects in the time domain. Fundamentals including time of flight, impedance discontinuities, proper termination schemes, nonlinear and reactive loads, and crosstalk are considered. Required prerequisite knowledge is limited to conventional circuit theory. The material is tutorial for electrical and computer engineers on the topic of transient signals on transmission lines. Emphasis has been placed on aspects of the subject that have application to signal integrity and high-speed digital circuit design issues, including proper termination schemes to avoid impedance discontinuities, reactive and nonlinear loads, and an introduction to crosstalk. The coverage focuses on the very important topic of transmission line transients which have been de-emphasized in most current textbooks. This book is prepared to supplement traditional texts for advanced students studying electromagnetics and for a vast array of practicing electrical engineers, computer engineers and material scientists with interests in signal integrity and high-speed digital design. In this second edition, examples and new problems have been added throughout. A new chapter on differential transmission lines has also been incorporated
Author:
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 524
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Book Description
Author: Elya B. Joffe
Publisher: John Wiley & Sons
ISBN: 1119770939
Category : Technology & Engineering
Languages : en
Pages : 1220
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Book Description
GROUNDS FOR GROUNDING Gain a comprehensive understanding of all aspects of grounding theory and application in this new, expanded edition Grounding design and installation are crucial to ensure the safety and performance of any electrical or electronic system irrespective of size. Successful grounding design requires a thorough familiarity with theory combined with practical experience with real-world systems. Rarely taught in schools due to its complexity, identifying and implementing the appropriate solution to grounding problems is nevertheless a vital skill in the industrial world for any electrical engineer. In Grounds for Grounding, readers will discover a complete and thorough approach to the topic that blends theory and practice to demonstrate that a few rules apply to many applications. The book provides basic concepts of Electromagnetic Compatibility (EMC) that act as the foundation for understanding grounding theory and its applications. Each avenue of grounding is covered in its own chapter, topics from safety aspects in facilities, lightning, and NEMP to printed circuit board, cable shields, and enclosure grounding, and more. Grounds for Grounding readers will also find: Revised and updated information presented in every chapter New chapters on grounding for generators, uninterruptible power sources (UPSs) New appendices including a grounding design checklist, grounding documentation content, and grounding verification procedures Grounds for Grounding is a useful reference for engineers in circuit design, equipment, and systems, as well as power engineers, platform, and facility designers.
