Colloidal Properties of Alumina Abrasives for Copper Chemical Mechanical Planarization PDF Download
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Author: Robin Veronica Ihnfeldt
Publisher:
ISBN:
Category :
Languages : en
Pages : 290
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Book Description
Author: Robin Veronica Ihnfeldt
Publisher:
ISBN:
Category :
Languages : en
Pages : 290
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Book Description
Author: Babu Suryadevara
Publisher: Woodhead Publishing
ISBN: 0081002181
Category : Technology & Engineering
Languages : en
Pages : 538
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Book Description
Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. - Considers techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for particular materials - Addresses consumables and process control for improved CMP
Author: G. S. Mathad
Publisher: The Electrochemical Society
ISBN: 9781566772945
Category : Science
Languages : en
Pages : 262
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Book Description
Author: Babu Suryadevara
Publisher: Woodhead Publishing
ISBN: 0128218193
Category : Technology & Engineering
Languages : en
Pages : 650
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Book Description
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP
Author: Duane S. Boning
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 376
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Book Description
Chemical-mechanical planarization (CMP) has emerged as a critical fabrication technology for advanced integrated circuits. Even as the applications of CMP have diversified and we have begun to understand aspects of the physics and chemistry of the process, a new generation of CMP innovations is unfolding. New slurries and consumables are under development. New applications to novel devices continue to appear. This book, the most recent in a successful series on CMP, offers a review of the advances to date and provides a comprehensive discussion of the future challenges that must be overcome. Presentations from academia, government labs and industry are featured. Topics include; CMP modeling; CMP science; CMP slurries and particles for planarization of copper, oxide, and other materials; planarization applications including shallow trench isolation (STI), copper damascene, and novel devices and CMP integration.
Author: Anna Rudawska
Publisher: BoD – Books on Demand
ISBN: 1789841933
Category : Technology & Engineering
Languages : en
Pages : 214
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Book Description
The subject matter of this book is the information on the abrasive technology methods, the characteristics of the methods (for example, the technological parameters, tools, and machines), innovative methods, characteristics of surface structure and surface properties after this type of mechanical process, and application in various industrial branches and other technical and technological domains. Abrasive technology is very important, for example, in precision component manufacturing and nano-technology devices. The aim of this book is to present information on the characteristics and applications of abrasive technology, abrasive tools, tests, and also the innovative methods of this technology. This information enables scientists, engineers, and designers to ensure the soundness and integrity of the fabricated components and to develop new techniques effectively.
Author: Qiu Sheng Yan
Publisher: Trans Tech Publications Ltd
ISBN: 3038133949
Category : Technology & Engineering
Languages : en
Pages : 485
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Book Description
Selected, peer reviewed papers from the International Conference on Surface Finishing Technology & Surface Engineering, (ICSFT 2010), 5 - 7 November, 2010, Guangzhou, China
Author: Myer Kutz
Publisher: William Andrew
ISBN: 1437735142
Category : Technology & Engineering
Languages : en
Pages : 661
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Book Description
A practical reference for all plastics engineers who are seeking to answer a question, solve a problem, reduce a cost, improve a design or fabrication process, or even venture into a new market. Applied Plastics Engineering Handbook covers both polymer basics - helpful to bring readers quickly up to speed if they are not familiar with a particular area of plastics processing - and recent developments - enabling practitioners to discover which options best fit their requirements. Each chapter is an authoritative source of practical advice for engineers, providing authoritative guidance from experts that will lead to cost savings and process improvements. Throughout the book, the focus is on the engineering aspects of producing and using plastics. The properties of plastics are explained along with techniques for testing, measuring, enhancing and analyzing them. Practical introductions to both core topics and new developments make this work equally valuable for newly qualified plastics engineers seeking the practical rules-of-thumb they don't teach you in school, and experienced practitioners evaluating new technologies or getting up to speed on a new field The depth and detail of the coverage of new developments enables engineers and managers to gain knowledge of, and evaluate, new technologies and materials in key growth areas such as biomaterials and nanotechnology This highly practical handbook is set apart from other references in the field, being written by engineers for an audience of engineers and providing a wealth of real-world examples, best practice guidance and rules-of-thumb
Author: Shantanu Tripathi
Publisher:
ISBN:
Category :
Languages : en
Pages : 404
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Book Description
Author: Joseph M. Steigerwald
Publisher: John Wiley & Sons
ISBN: 3527617752
Category : Science
Languages : en
Pages : 337
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Book Description
Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.
