NASA Technical Memorandum PDF Download
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Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 22
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Book Description
Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 22
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Book Description
Author: Giancarlo Genta
Publisher: CUP Archive
ISBN:
Category :
Languages : en
Pages : 618
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Book Description
Author: United States. Patent Office
Publisher:
ISBN:
Category : Patents
Languages : en
Pages : 308
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Book Description
Includes list of replacement pages.
Author: United States. Patent Office
Publisher:
ISBN:
Category : Patents
Languages : en
Pages : 1166
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Book Description
Author:
Publisher:
ISBN:
Category : Patents
Languages : en
Pages : 1232
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Book Description
Author: Thomas G Smith
Publisher: Springer
ISBN: 1461476011
Category : Medical
Languages : en
Pages : 263
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Book Description
Edited and authored by international experts on voltage and patch clamping, this volume is designed to help anyone undertaking experiments requiring the use of these techniques. The only book of its kind to bring together this wealth of information on theory as well as practical techniques, this is a volume that no one involved in voltage and patch clamping can afford to be without.
Author: Ali Iftekhar Maswood
Publisher: John Wiley & Sons
ISBN: 1119476011
Category : Technology & Engineering
Languages : en
Pages : 499
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Book Description
A comprehensive survey of advanced multilevel converter design, control, operation and grid-connected applications Advanced Multilevel Converters and Applications in Grid Integration presents a comprehensive review of the core principles of advanced multilevel converters, which require fewer components and provide higher power conversion efficiency and output power quality. The authors – noted experts in the field – explain in detail the operation principles and control strategies and present the mathematical expressions and design procedures of their components. The text examines the advantages and disadvantages compared to the classical multilevel and two level power converters. The authors also include examples of the industrial applications of the advanced multilevel converters and offer thoughtful explanations on their control strategies. Advanced Multilevel Converters and Applications in Grid Integration provides a clear understanding of the gap difference between research conducted and the current industrial needs. This important guide: Puts the focus on the new challenges and topics in related areas such as modulation methods, harmonic analysis, voltage balancing and balanced current injection Makes a strong link between the fundamental concepts of power converters and advances multilevel converter topologies and examines their control strategies, together with practical engineering considerations Provides a valid reference for further developments in the multilevel converters design issue Contains simulations files for further study Written for university students in electrical engineering, researchers in areas of multilevel converters, high-power converters and engineers and operators in power industry, Advanced Multilevel Converters and Applications in Grid Integration offers a comprehensive review of the core principles of advanced multilevel converters, with contributions from noted experts in the field.
Author: Nadine Collaert
Publisher: Elsevier
ISBN: 0128234504
Category : Technology & Engineering
Languages : en
Pages : 369
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Book Description
New Materials and Devices for 5G Applications and Beyond focuses on the materials, device architectures and enabling integration schemes for 5G applications and emerging technologies. It gives a comprehensive overview of the trade-offs, challenges and unique properties of novel upcoming technologies. Starting from the application side and its requirements, the book examines different technologies under consideration for the different functions, both more conventional to exploratory, and within this context the book provides guidance to the reader on how to possibly optimize the system for a particular application. This book aims at guiding the reader through the technologies required to enable 5G applications, with the main focus on mm-wave frequencies, up to THz. New Materials and Devises for 5G Applications and Beyond is suitable for industrial researchers and development engineers, and researchers in materials science, device engineering and circuit design. - Reviews challenges and emerging opportunities for materials, devices, and integration to enable 5G technologies - Includes discussion of technologies such as RF-MEMs, RF FINFETs, and transistors based on current and emerging materials (InP, GaN, etc.) - Focuses on mm-wave frequencies up to the terahertz regime
Author: Lester Gray French
Publisher:
ISBN:
Category : Machine-tools
Languages : en
Pages : 486
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Book Description
Author: Jose Luis Huertas Díaz
Publisher: Springer Science & Business Media
ISBN: 0387235213
Category : Technology & Engineering
Languages : en
Pages : 310
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Book Description
Test and Design-for-Testability in Mixed-Signal Integrated Circuits deals with test and design for test of analog and mixed-signal integrated circuits. Especially in System-on-Chip (SoC), where different technologies are intertwined (analog, digital, sensors, RF); test is becoming a true bottleneck of present and future IC projects. Linking design and test in these heterogeneous systems will have a tremendous impact in terms of test time, cost and proficiency. Although it is recognized as a key issue for developing complex ICs, there is still a lack of structured references presenting the major topics in this area. The aim of this book is to present basic concepts and new ideas in a manner understandable for both professionals and students. Since this is an active research field, a comprehensive state-of-the-art overview is very valuable, introducing the main problems as well as the ways of solution that seem promising, emphasizing their basis, strengths and weaknesses. In essence, several topics are presented in detail. First of all, techniques for the efficient use of DSP-based test and CAD test tools. Standardization is another topic considered in the book, with focus on the IEEE 1149.4. Also addressed in depth is the connecting design and test by means of using high-level (behavioural) description techniques, specific examples are given. Another issue is related to test techniques for well-defined classes of integrated blocks, like data converters and phase-locked-loops. Besides these specification-driven testing techniques, fault-driven approaches are described as they offer potential solutions which are more similar to digital test methods. Finally, in Design-for-Testability and Built-In-Self-Test, two other concepts that were taken from digital design, are introduced in an analog context and illustrated for the case of integrated filters. In summary, the purpose of this book is to provide a glimpse on recent research results in the area of testing mixed-signal integrated circuits, specifically in the topics mentioned above. Much of the work reported herein has been performed within cooperative European Research Projects, in which the authors of the different chapters have actively collaborated. It is a representative snapshot of the current state-of-the-art in this emergent field.
