Author: Prashant N. Kumta
Publisher: Mrs Proceedings
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 496
Book Description
Containing 65 papers from the symposium titled Chemical Aspects of Electronic Ceramics Processing held in November- December 1997 in Boston, the contents of this volume are divided into five sections: chemical vapor deposition of oxide ceramics; chemical vapor deposition of nonoxide ceramics; solution routes to ceramic materials; characterization and application of ceramic materials; and process characterization as a form of novel processing of ceramic materials. Annotation copyrighted by Book News, Inc., Portland, OR
Chemical Aspects of Electronic Ceramics Processing: Volume 495
Author: Prashant N. Kumta
Publisher: Mrs Proceedings
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 496
Book Description
Containing 65 papers from the symposium titled Chemical Aspects of Electronic Ceramics Processing held in November- December 1997 in Boston, the contents of this volume are divided into five sections: chemical vapor deposition of oxide ceramics; chemical vapor deposition of nonoxide ceramics; solution routes to ceramic materials; characterization and application of ceramic materials; and process characterization as a form of novel processing of ceramic materials. Annotation copyrighted by Book News, Inc., Portland, OR
Publisher: Mrs Proceedings
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 496
Book Description
Containing 65 papers from the symposium titled Chemical Aspects of Electronic Ceramics Processing held in November- December 1997 in Boston, the contents of this volume are divided into five sections: chemical vapor deposition of oxide ceramics; chemical vapor deposition of nonoxide ceramics; solution routes to ceramic materials; characterization and application of ceramic materials; and process characterization as a form of novel processing of ceramic materials. Annotation copyrighted by Book News, Inc., Portland, OR
Chemical Vapour Deposition (CVD)
Author: Kwang-Leong Choy
Publisher: CRC Press
ISBN: 1000691071
Category : Science
Languages : en
Pages : 501
Book Description
This book offers a timely and complete overview on chemical vapour deposition (CVD) and its variants for the processing of nanoparticles, nanowires, nanotubes, nanocomposite coatings, thin and thick films, and composites. Chapters discuss key aspects, from processing, material structure and properties to practical use, cost considerations, versatility, and sustainability. The author presents a comprehensive overview of CVD and its potential in producing high performance, cost-effective nanomaterials and thin and thick films. Features Provides an up-to-date introduction to CVD technology for the fabrication of nanomaterials, nanostructured films, and composite coatings Discusses processing, structure, functionalization, properties, and use in clean energy, engineering, and biomedical grand challenges Covers thin and thick films and composites Compares CVD with other processing techniques in terms of structure/properties, cost, versatility, and sustainability Kwang-Leong Choy is the Director of the UCL Centre for Materials Discovery and Professor of Materials Discovery in the Institute for Materials Discovery at the University College London. She earned her D.Phil. from the University of Oxford, and is the recipient of numerous honors including the Hetherington Prize, Oxford Metallurgical Society Award, and Grunfeld Medal and Prize from the Institute of Materials (UK). She is an elected fellow of the Institute of Materials, Minerals and Mining, and the Royal Society of Chemistry.
Publisher: CRC Press
ISBN: 1000691071
Category : Science
Languages : en
Pages : 501
Book Description
This book offers a timely and complete overview on chemical vapour deposition (CVD) and its variants for the processing of nanoparticles, nanowires, nanotubes, nanocomposite coatings, thin and thick films, and composites. Chapters discuss key aspects, from processing, material structure and properties to practical use, cost considerations, versatility, and sustainability. The author presents a comprehensive overview of CVD and its potential in producing high performance, cost-effective nanomaterials and thin and thick films. Features Provides an up-to-date introduction to CVD technology for the fabrication of nanomaterials, nanostructured films, and composite coatings Discusses processing, structure, functionalization, properties, and use in clean energy, engineering, and biomedical grand challenges Covers thin and thick films and composites Compares CVD with other processing techniques in terms of structure/properties, cost, versatility, and sustainability Kwang-Leong Choy is the Director of the UCL Centre for Materials Discovery and Professor of Materials Discovery in the Institute for Materials Discovery at the University College London. She earned her D.Phil. from the University of Oxford, and is the recipient of numerous honors including the Hetherington Prize, Oxford Metallurgical Society Award, and Grunfeld Medal and Prize from the Institute of Materials (UK). She is an elected fellow of the Institute of Materials, Minerals and Mining, and the Royal Society of Chemistry.
Solution Processing of Inorganic Materials
Author: David Mitzi
Publisher: John Wiley & Sons
ISBN: 0470407611
Category : Science
Languages : en
Pages : 522
Book Description
Discover the materials set to revolutionize the electronics industry The search for electronic materials that can be cheaply solution-processed into films, while simultaneously providing quality device characteristics, represents a major challenge for materials scientists. Continuous semiconducting thin films with large carrier mobilities are particularly desirable for high-speed microelectronic applications, potentially providing new opportunities for the development of low-cost, large-area, flexible computing devices, displays, sensors, and solar cells. To date, the majority of solution-processing research has focused on molecular and polymeric organic films. In contrast, this book reviews recent achievements in the search for solution-processed inorganic semiconductors and other critical electronic components. These components offer the potential for better performance and more robust thermal and mechanical stability than comparable organic-based systems. Solution Processing of Inorganic Materials covers everything from the more traditional fields of sol-gel processing and chemical bath deposition to the cutting-edge use of nanomaterials in thin-film deposition. In particular, the book focuses on materials and techniques that are compatible with high-throughput, low-cost, and low-temperature deposition processes such as spin coating, dip coating, printing, and stamping. Throughout the text, illustrations and examples of applications are provided to help the reader fully appreciate the concepts and opportunities involved in this exciting field. In addition to presenting the state-of-the-art research, the book offers extensive background material. As a result, any researcher involved or interested in electronic device fabrication can turn to this book to become fully versed in the solution-processed inorganic materials that are set to revolutionize the electronics industry.
Publisher: John Wiley & Sons
ISBN: 0470407611
Category : Science
Languages : en
Pages : 522
Book Description
Discover the materials set to revolutionize the electronics industry The search for electronic materials that can be cheaply solution-processed into films, while simultaneously providing quality device characteristics, represents a major challenge for materials scientists. Continuous semiconducting thin films with large carrier mobilities are particularly desirable for high-speed microelectronic applications, potentially providing new opportunities for the development of low-cost, large-area, flexible computing devices, displays, sensors, and solar cells. To date, the majority of solution-processing research has focused on molecular and polymeric organic films. In contrast, this book reviews recent achievements in the search for solution-processed inorganic semiconductors and other critical electronic components. These components offer the potential for better performance and more robust thermal and mechanical stability than comparable organic-based systems. Solution Processing of Inorganic Materials covers everything from the more traditional fields of sol-gel processing and chemical bath deposition to the cutting-edge use of nanomaterials in thin-film deposition. In particular, the book focuses on materials and techniques that are compatible with high-throughput, low-cost, and low-temperature deposition processes such as spin coating, dip coating, printing, and stamping. Throughout the text, illustrations and examples of applications are provided to help the reader fully appreciate the concepts and opportunities involved in this exciting field. In addition to presenting the state-of-the-art research, the book offers extensive background material. As a result, any researcher involved or interested in electronic device fabrication can turn to this book to become fully versed in the solution-processed inorganic materials that are set to revolutionize the electronics industry.
Materials Science of the Cell: Volume 489
Author: B. Mulder
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 248
Book Description
The 34 papers investigate the processing routes and properties of the complex molecular and macromolecular structures that hold biological cells together, both to reveal some of the mysteries of cell function and to identify natural solutions for optimizing membranes that might be adapted for applications in materials science. They cover the mechanics of DNA; the cytoskeleton, semiflexible polymers, polyelectrolytes, and motor proteins; properties and models of membranes and their interactions with macromolecules; biomaterials; and cells and cellular processes. Annotation copyrighted by Book News, Inc., Portland, OR
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 248
Book Description
The 34 papers investigate the processing routes and properties of the complex molecular and macromolecular structures that hold biological cells together, both to reveal some of the mysteries of cell function and to identify natural solutions for optimizing membranes that might be adapted for applications in materials science. They cover the mechanics of DNA; the cytoskeleton, semiflexible polymers, polyelectrolytes, and motor proteins; properties and models of membranes and their interactions with macromolecules; biomaterials; and cells and cellular processes. Annotation copyrighted by Book News, Inc., Portland, OR
Diffusion Mechanisms in Crystalline Materials: Volume 527
Author: Yuri Mishin
Publisher: Mrs Proceedings
ISBN:
Category : Science
Languages : en
Pages : 576
Book Description
Participants of the symposium held in April 1998 in San Francisco as part of the 1998 MRS Spring Meeting cleared the fog at least on some aspects of solid-state diffusion, particularly experimental and simulation techniques that provide access to atomic-scale mechanisms of diffusion in diverse classes of crystalline materials. The 68 contributions (including 18 invited talks) added to the knowledge base in several key areas: diffusion mechanisms in metals and alloys, in intermetallic compounds, and in semiconductors; grain boundary and surface diffusion, and diffusion in quasicrystals; and diffusion and ionic conductivity in ionic materials. Annotation copyrighted by Book News, Inc., Portland, OR
Publisher: Mrs Proceedings
ISBN:
Category : Science
Languages : en
Pages : 576
Book Description
Participants of the symposium held in April 1998 in San Francisco as part of the 1998 MRS Spring Meeting cleared the fog at least on some aspects of solid-state diffusion, particularly experimental and simulation techniques that provide access to atomic-scale mechanisms of diffusion in diverse classes of crystalline materials. The 68 contributions (including 18 invited talks) added to the knowledge base in several key areas: diffusion mechanisms in metals and alloys, in intermetallic compounds, and in semiconductors; grain boundary and surface diffusion, and diffusion in quasicrystals; and diffusion and ionic conductivity in ionic materials. Annotation copyrighted by Book News, Inc., Portland, OR
Fabrication Methods for Environmentally Hardened Sensors
Author: Anthony F. Flannery (Jr.)
Publisher: Stanford University
ISBN:
Category :
Languages : en
Pages : 146
Book Description
around the gaskets.
Publisher: Stanford University
ISBN:
Category :
Languages : en
Pages : 146
Book Description
around the gaskets.
Power Semiconductor Materials and Devices: Volume 483
Author: S. J. Pearton
Publisher: Mrs Proceedings
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 478
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Publisher: Mrs Proceedings
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 478
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Electronic Packaging Materials Science X: Volume 515
Author: Daniel J. Belton
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 288
Book Description
Proceedings of the April 1998 symposium, which focused on high-density package solutions, with an emphasis on flip-chip technology. Topics include interfacial adhesion behavior, flip-chip interconnections, high-density substrates, thermomechanical behavior, and packaging reliability issues. Articles address the fracture of polymer interfaces and the delamination tendencies seen with flip-chip interconnections on organic substrates, under-bump metallurgy issues, and overall reliability issues. Annotation copyrighted by Book News, Inc., Portland, OR
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 288
Book Description
Proceedings of the April 1998 symposium, which focused on high-density package solutions, with an emphasis on flip-chip technology. Topics include interfacial adhesion behavior, flip-chip interconnections, high-density substrates, thermomechanical behavior, and packaging reliability issues. Articles address the fracture of polymer interfaces and the delamination tendencies seen with flip-chip interconnections on organic substrates, under-bump metallurgy issues, and overall reliability issues. Annotation copyrighted by Book News, Inc., Portland, OR
Materials Issues in Vacuum Microelectronics: Volume 509
Author: Wei Zhu
Publisher: Mrs Proceedings
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 232
Book Description
The 31 papers, about half of the symposium's presentations, were selected to provide a representative sampling of the present status of materials used in vacuum microelectronics. They range across all aspects of electron field emission from theory and physical mechanisms to device structure, but many focus on the fabrication, characterization, and modeling of electron emissive materials. The sections cover field-emitter arrays and applications, carbon and wide-bandgap cathodes, and other cathode materials. Reproduced from typescripts. Annotation copyrighted by Book News, Inc., Portland, OR
Publisher: Mrs Proceedings
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 232
Book Description
The 31 papers, about half of the symposium's presentations, were selected to provide a representative sampling of the present status of materials used in vacuum microelectronics. They range across all aspects of electron field emission from theory and physical mechanisms to device structure, but many focus on the fabrication, characterization, and modeling of electron emissive materials. The sections cover field-emitter arrays and applications, carbon and wide-bandgap cathodes, and other cathode materials. Reproduced from typescripts. Annotation copyrighted by Book News, Inc., Portland, OR
International Aerospace Abstracts
Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 1044
Book Description
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 1044
Book Description