Characterization and Modeling of Pattern Dependencies in Copper Interconnects for Integrated Circuits PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download Characterization and Modeling of Pattern Dependencies in Copper Interconnects for Integrated Circuits PDF full book. Access full book title Characterization and Modeling of Pattern Dependencies in Copper Interconnects for Integrated Circuits by Tae Hong Park. Download full books in PDF and EPUB format.
Author: Tae Hong Park
Publisher:
ISBN:
Category :
Languages : en
Pages : 204
Get Book Here
Book Description
(Cont.) Especially for the multi-level studies, electrical test structures and measurements in addition to surface profile scans are seen to be important in accurately determining thickness variations. The developed test vehicle and characterization of copper dishing and oxide erosion serve as a basis for further pattern dependent model development. Finally, integration of electroplating and CMP chip-scale models is illustrated; the simulated step and array heights as well as topography pattern density are used as an input for the initial starting topography for CMP simulation of subsequent polishing profile evolution.
Author: Tae Hong Park
Publisher:
ISBN:
Category :
Languages : en
Pages : 204
Get Book Here
Book Description
(Cont.) Especially for the multi-level studies, electrical test structures and measurements in addition to surface profile scans are seen to be important in accurately determining thickness variations. The developed test vehicle and characterization of copper dishing and oxide erosion serve as a basis for further pattern dependent model development. Finally, integration of electroplating and CMP chip-scale models is illustrated; the simulated step and array heights as well as topography pattern density are used as an input for the initial starting topography for CMP simulation of subsequent polishing profile evolution.
Author: Jianfeng Luo
Publisher: Springer Science & Business Media
ISBN: 3662079283
Category : Science
Languages : en
Pages : 327
Get Book Here
Book Description
Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process.
Author: Tapan Gupta
Publisher: Springer Science & Business Media
ISBN: 1441900764
Category : Technology & Engineering
Languages : en
Pages : 433
Get Book Here
Book Description
Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.
Author: G. S. Mathad
Publisher: The Electrochemical Society
ISBN: 9781566773904
Category : Science
Languages : en
Pages : 290
Get Book Here
Book Description
Author: J. C. Flake
Publisher: The Electrochemical Society
ISBN: 1566778123
Category : Science
Languages : en
Pages : 171
Get Book Here
Book Description
This issue focuses on recent advances in damascene interconnects and 3D interconnects.
Author: Rajappa Tadepalli
Publisher:
ISBN:
Category :
Languages : en
Pages : 108
Get Book Here
Book Description
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 636
Get Book Here
Book Description
Author: Hong Cai (Ph. D.)
Publisher:
ISBN:
Category :
Languages : en
Pages : 303
Get Book Here
Book Description
(Cont.) The CMP model integrates contact wear and density-step-height approaches, so that a consistent and coherent chip-scale model framework can be used for copper bulk polishing, copper over-polishing, and barrier layer polishing stages. A variant of this CMP model is developed which explicitly considers the pad topography properties. Finally, ECD and CMP parts are combined into an integrated model applicable to single level and multilevel metallization cases. The integrated multilevel copper metallization model is applied to the co-optimization of the plating and CMP processes. An alternative in-pattern (rather than between-pattern) dummy fill strategy is proposed. The integrated ECD/CMP model is applied to the optimization of the in-pattern fill, to achieve improved ECD uniformity and final post-CMP topography.
Author:
Publisher:
ISBN:
Category : Dissertation abstracts
Languages : en
Pages : 776
Get Book Here
Book Description
Author: Charles J. Alpert
Publisher: CRC Press
ISBN: 0849372429
Category : Computers
Languages : en
Pages : 1044
Get Book Here
Book Description
The physical design flow of any project depends upon the size of the design, the technology, the number of designers, the clock frequency, and the time to do the design. As technology advances and design-styles change, physical design flows are constantly reinvented as traditional phases are removed and new ones are added to accommodate changes in technology. Handbook of Algorithms for Physical Design Automation provides a detailed overview of VLSI physical design automation, emphasizing state-of-the-art techniques, trends and improvements that have emerged during the previous decade. After a brief introduction to the modern physical design problem, basic algorithmic techniques, and partitioning, the book discusses significant advances in floorplanning representations and describes recent formulations of the floorplanning problem. The text also addresses issues of placement, net layout and optimization, routing multiple signal nets, manufacturability, physical synthesis, special nets, and designing for specialized technologies. It includes a personal perspective from Ralph Otten as he looks back on the major technical milestones in the history of physical design automation. Although several books on this topic are currently available, most are either too broad or out of date. Alternatively, proceedings and journal articles are valuable resources for researchers in this area, but the material is widely dispersed in the literature. This handbook pulls together a broad variety of perspectives on the most challenging problems in the field, and focuses on emerging problems and research results.
