Author: David G. Seiler
Publisher: American Institute of Physics
ISBN:
Category : Computers
Languages : en
Pages : 714
Book Description
The worldwide semiconductor community faces increasingly difficult challenges in the era of silicon nanotechnology and beyond. The magnitude of these challenges demands special attention from the metrology and analytical measurements community. New paradigms must be found. Adequate research and development for new metrology concepts are urgently needed. Characterization and metrology are key enablers for developing new semiconductor technology and in improving manufacturing. This book summarizes major issues and gives critical reviews of important measurement techniques that are crucial to continuing the advances in semiconductor technology. It covers major aspects of process technology and most characterization techniques for silicon research, including development, manufacturing, and diagnostics. The book also covers emerging nano-devices and the corresponding metrology challenges that arise.
Characterization and Metrology for ULSI Technology 2005
Author: David G. Seiler
Publisher: American Institute of Physics
ISBN:
Category : Computers
Languages : en
Pages : 714
Book Description
The worldwide semiconductor community faces increasingly difficult challenges in the era of silicon nanotechnology and beyond. The magnitude of these challenges demands special attention from the metrology and analytical measurements community. New paradigms must be found. Adequate research and development for new metrology concepts are urgently needed. Characterization and metrology are key enablers for developing new semiconductor technology and in improving manufacturing. This book summarizes major issues and gives critical reviews of important measurement techniques that are crucial to continuing the advances in semiconductor technology. It covers major aspects of process technology and most characterization techniques for silicon research, including development, manufacturing, and diagnostics. The book also covers emerging nano-devices and the corresponding metrology challenges that arise.
Publisher: American Institute of Physics
ISBN:
Category : Computers
Languages : en
Pages : 714
Book Description
The worldwide semiconductor community faces increasingly difficult challenges in the era of silicon nanotechnology and beyond. The magnitude of these challenges demands special attention from the metrology and analytical measurements community. New paradigms must be found. Adequate research and development for new metrology concepts are urgently needed. Characterization and metrology are key enablers for developing new semiconductor technology and in improving manufacturing. This book summarizes major issues and gives critical reviews of important measurement techniques that are crucial to continuing the advances in semiconductor technology. It covers major aspects of process technology and most characterization techniques for silicon research, including development, manufacturing, and diagnostics. The book also covers emerging nano-devices and the corresponding metrology challenges that arise.
Characterization and Metrology for ULSI Technology, 2000
Author: David G. Seiler
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 734
Book Description
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 734
Book Description
Characterization and Metrology for ULSI Technology: 2003
Author: David G. Seiler
Publisher: American Institute of Physics
ISBN:
Category : Computers
Languages : en
Pages : 868
Book Description
The worldwide semiconductor community faces increasingly difficult challenges as it moves into the manufacturing of chips with feature sizes approaching 100 nm and beyond. The magnitude of these challenges demands special attention from the metrology and analytical measurements community. New paradigms must be found. Adequate research and development for new metrology concepts are urgently needed. Topics include: integrated circuit history, challenges and overviews, front end, lithography, interconnect and back end, and critical analytical techniques. Characterization and metrology are key enablers for developing new semiconductor technology and in improving manufacturing. This book summarizes major issues and gives critical reviews of important measurement techniques that are crucial to continue the advances in semiconductor technology. It covers major aspects of process technology and most characterization techniques for silicon research, including development, manufacturing, and diagnostics. The editors believe that this book of collected papers provides a concise and effective portrayal of industry characterization needs and the way they are being addressed by industry, academia, and government to continue the dramatic progress in semiconductor technology. Hopefully, it will also provide a basis for stimulating advances in metrology and new ideas for research and development.
Publisher: American Institute of Physics
ISBN:
Category : Computers
Languages : en
Pages : 868
Book Description
The worldwide semiconductor community faces increasingly difficult challenges as it moves into the manufacturing of chips with feature sizes approaching 100 nm and beyond. The magnitude of these challenges demands special attention from the metrology and analytical measurements community. New paradigms must be found. Adequate research and development for new metrology concepts are urgently needed. Topics include: integrated circuit history, challenges and overviews, front end, lithography, interconnect and back end, and critical analytical techniques. Characterization and metrology are key enablers for developing new semiconductor technology and in improving manufacturing. This book summarizes major issues and gives critical reviews of important measurement techniques that are crucial to continue the advances in semiconductor technology. It covers major aspects of process technology and most characterization techniques for silicon research, including development, manufacturing, and diagnostics. The editors believe that this book of collected papers provides a concise and effective portrayal of industry characterization needs and the way they are being addressed by industry, academia, and government to continue the dramatic progress in semiconductor technology. Hopefully, it will also provide a basis for stimulating advances in metrology and new ideas for research and development.
Istfa 2005
Author: ASM International
Publisher: ASM International
ISBN: 1615030883
Category : Technology & Engineering
Languages : en
Pages : 524
Book Description
Publisher: ASM International
ISBN: 1615030883
Category : Technology & Engineering
Languages : en
Pages : 524
Book Description
Measurement of 100 nm and 60 nm Particle Standards by Differential Mobility Analysis
Author:
Publisher: DIANE Publishing
ISBN: 9781422328514
Category :
Languages : en
Pages : 56
Book Description
Publisher: DIANE Publishing
ISBN: 9781422328514
Category :
Languages : en
Pages : 56
Book Description
Istc/cstic 2009 (cistc)
Author: David Huang
Publisher: The Electrochemical Society
ISBN: 1566777038
Category : Science
Languages : en
Pages : 1124
Book Description
ISTC/CSTIC is an annual semiconductor technology conference covering all the aspects of semiconductor technology and manufacturing, including devices, design, lithography, integration, materials, processes, manufacturing as well as emerging semiconductor technologies and silicon material applications. ISTC/CSTIC 2009 was merged by ISTC (International Semiconductor Technology Conference) and CSTIC (China Semiconductor Technology International Conference), the two industry leading technical conferences in China, and consisted of one plenary session and nine technical symposia. This issue of ECS Transactions contains 159 papers from the conference.
Publisher: The Electrochemical Society
ISBN: 1566777038
Category : Science
Languages : en
Pages : 1124
Book Description
ISTC/CSTIC is an annual semiconductor technology conference covering all the aspects of semiconductor technology and manufacturing, including devices, design, lithography, integration, materials, processes, manufacturing as well as emerging semiconductor technologies and silicon material applications. ISTC/CSTIC 2009 was merged by ISTC (International Semiconductor Technology Conference) and CSTIC (China Semiconductor Technology International Conference), the two industry leading technical conferences in China, and consisted of one plenary session and nine technical symposia. This issue of ECS Transactions contains 159 papers from the conference.
Semiconductor Strain Metrology
Author: Terence K. S. Wong
Publisher: Bentham Science Publishers
ISBN: 1608053598
Category : Technology & Engineering
Languages : en
Pages : 141
Book Description
This book surveys the major and newly developed techniques for semiconductor strain metrology. Semiconductor strain metrology has emerged in recent years as a topic of great interest to researchers involved in thin film and nanoscale device characterizati
Publisher: Bentham Science Publishers
ISBN: 1608053598
Category : Technology & Engineering
Languages : en
Pages : 141
Book Description
This book surveys the major and newly developed techniques for semiconductor strain metrology. Semiconductor strain metrology has emerged in recent years as a topic of great interest to researchers involved in thin film and nanoscale device characterizati
A Practical Guide to Optical Metrology for Thin Films
Author: Michael Quinten
Publisher: John Wiley & Sons
ISBN: 3527664351
Category : Science
Languages : en
Pages : 212
Book Description
A one-stop, concise guide on determining and measuring thin film thickness by optical methods. This practical book covers the laws of electromagnetic radiation and interaction of light with matter, as well as the theory and practice of thickness measurement, and modern applications. In so doing, it shows the capabilities and opportunities of optical thickness determination and discusses the strengths and weaknesses of measurement devices along with their evaluation methods. Following an introduction to the topic, Chapter 2 presents the basics of the propagation of light and other electromagnetic radiation in space and matter. The main topic of this book, the determination of the thickness of a layer in a layer stack by measuring the spectral reflectance or transmittance, is treated in the following three chapters. The color of thin layers is discussed in chapter 6. Finally, in chapter 7, the author discusses several industrial applications of the layer thickness measurement, including high-reflection and anti-reflection coatings, photolithographic structuring of semiconductors, silicon on insulator, transparent conductive films, oxides and polymers, thin film photovoltaics, and heavily doped silicon. Aimed at industrial and academic researchers, engineers, developers and manufacturers involved in all areas of optical layer and thin optical film measurement and metrology, process control, real-time monitoring, and applications.
Publisher: John Wiley & Sons
ISBN: 3527664351
Category : Science
Languages : en
Pages : 212
Book Description
A one-stop, concise guide on determining and measuring thin film thickness by optical methods. This practical book covers the laws of electromagnetic radiation and interaction of light with matter, as well as the theory and practice of thickness measurement, and modern applications. In so doing, it shows the capabilities and opportunities of optical thickness determination and discusses the strengths and weaknesses of measurement devices along with their evaluation methods. Following an introduction to the topic, Chapter 2 presents the basics of the propagation of light and other electromagnetic radiation in space and matter. The main topic of this book, the determination of the thickness of a layer in a layer stack by measuring the spectral reflectance or transmittance, is treated in the following three chapters. The color of thin layers is discussed in chapter 6. Finally, in chapter 7, the author discusses several industrial applications of the layer thickness measurement, including high-reflection and anti-reflection coatings, photolithographic structuring of semiconductors, silicon on insulator, transparent conductive films, oxides and polymers, thin film photovoltaics, and heavily doped silicon. Aimed at industrial and academic researchers, engineers, developers and manufacturers involved in all areas of optical layer and thin optical film measurement and metrology, process control, real-time monitoring, and applications.
Handbook of Semiconductor Manufacturing Technology
Author: Yoshio Nishi
Publisher: CRC Press
ISBN: 1420017667
Category : Technology & Engineering
Languages : en
Pages : 1720
Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Publisher: CRC Press
ISBN: 1420017667
Category : Technology & Engineering
Languages : en
Pages : 1720
Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
ISTFA 2007 Proceedings of the 33rd International Symposium for Testing and Failure Analysis
Author: ASM International
Publisher: ASM International
ISBN: 1615030905
Category : Technology & Engineering
Languages : en
Pages : 372
Book Description
Printbegrænsninger: Der kan printes 10 sider ad gangen og max. 40 sider pr. session
Publisher: ASM International
ISBN: 1615030905
Category : Technology & Engineering
Languages : en
Pages : 372
Book Description
Printbegrænsninger: Der kan printes 10 sider ad gangen og max. 40 sider pr. session