Bifurcation Behavior in Laser Direct-write Metallization from Thin Films PDF Download
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Author: Peter Everett Price
Publisher:
ISBN:
Category :
Languages : en
Pages : 656
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Author: Peter Everett Price
Publisher:
ISBN:
Category :
Languages : en
Pages : 656
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Author:
Publisher:
ISBN:
Category : Dissertation abstracts
Languages : en
Pages : 768
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Author:
Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 802
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Author: University of Minnesota. Graduate School
Publisher:
ISBN:
Category :
Languages : en
Pages : 102
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Author:
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Category : Physics
Languages : en
Pages : 1146
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Author:
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ISBN:
Category : Mechanics, Applied
Languages : en
Pages : 390
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Author:
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Category : Electrical engineering
Languages : en
Pages : 2240
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Author: Ismail C. Noyan
Publisher: Springer
ISBN: 1461395704
Category : Technology & Engineering
Languages : en
Pages : 286
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Author: A. Christou
Publisher: Springer Science & Business Media
ISBN: 9400924828
Category : Technology & Engineering
Languages : en
Pages : 571
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Book Description
This publication is a compilation of papers presented at the Semiconductor Device Reliabi lity Workshop sponsored by the NATO International Scientific Exchange Program. The Workshop was held in Crete, Greece from June 4 to June 9, 1989. The objective of the Workshop was to review and to further explore advances in the field of semiconductor reliability through invited paper presentations and discussions. The technical emphasis was on quality assurance and reliability of optoelectronic and high speed semiconductor devices. The primary support for the meeting was provided by the Scientific Affairs Division of NATO. We are indebted to NATO for their support and to Dr. Craig Sinclair, who admin isters this program. The chapters of this book follow the format and order of the sessions of the meeting. Thirty-six papers were presented and discussed during the five-day Workshop. In addi tion, two panel sessions were held, with audience participation, where the particularly controversial topics of bum-in and reliability modeling and prediction methods were dis cussed. A brief review of these sessions is presented in this book.
Author: J.F. Bussière
Publisher: Springer Science & Business Media
ISBN: 9780306440472
Category : Technology & Engineering
Languages : en
Pages : 536
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Book Description
There is a great deal of interest in extending nondestructive technologies beyond the location and identification of cracks and voids. Specifically there is growing interest in the application of nondestructive evaluation (NOEl to the measurement of physical and mechanical properties of materials. The measurement of materials properties is often referred to as materials characterization; thus nondestructive techniques applied to characterization become nondestructive characterization (NDCl. There are a number of meetings, proceedings and journals focused upon nondestructive technologies and the detection and identification of cracks and voids. However, the series of symposia, of which these proceedings represent the fourth, are the only meetings uniquely focused upon nondestructive characterization. Moreover, these symposia are especially concerned with stimulating communication between the materials, mechanical and manufacturing engineer and the NDE technology oriented engineer and scientist. These symposia recognize that it is the welding of these areas of expertise that is necessary for practical development and application of NDC technology to measurements of components for in service life time and sensor technology for intelligent processing of materials. These proceedings are from the fourth international symposia and are edited by c.o. Ruud, J. F. Bussiere and R.E. Green, Jr. . The dates, places, etc of the symposia held to date area as follows: Symposia on Nondestructive Methods for TITLE: Material Property Determination DATES: April 6-8, 1983 PLACE: Hershey, PA, USA CHAIRPERSONS: C.O. Ruud and R.E. Green, Jr.
