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Author: Pepin van Roojen
Publisher: Agile Rabbit Edition
ISBN: 9789057681431
Category : Design
Languages : fr
Pages : 432
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Book Description
BASIC PACKAGING, the first volume of a new series of packaging books ¿ Structural Package Design ¿ , contains 300 designs, including all major international packaging standards. The CDs also included a demo version of packaging software which folds and tests two-dimensional templates in 3-D.
Author: Pepin van Roojen
Publisher: Agile Rabbit Edition
ISBN: 9789057681431
Category : Design
Languages : fr
Pages : 432
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Book Description
BASIC PACKAGING, the first volume of a new series of packaging books ¿ Structural Package Design ¿ , contains 300 designs, including all major international packaging standards. The CDs also included a demo version of packaging software which folds and tests two-dimensional templates in 3-D.
Author: Michael Baker
Publisher: Macmillan Education AU
ISBN: 9780732952112
Category : Business & Economics
Languages : en
Pages : 564
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Book Description
"Marketing: Managerial Foundations" provides students with a sound understanding of marketing theory and practice, and does so in an Australian and New Zealand context. It is an introductory text that goes beyond the prescriptive approach. It seeks to meet the needs of a discipline that is now accepted as a fundamental aspect of business and one which needs and deserves an academic base of context, concept and application. No theoretical stone is left unturned as good practice is supported by essential theoretical frameworks. Students will find more discussion of the various arguments that provide views on the foundations and application of marketing. Concepts such as relationship marketing are traced and explored. The book provides a strong foundation for the study of marketing and is essential reading for the newcomer to marketing as well as being a valuable reference for the marketing professional.
Author: United States
Publisher:
ISBN:
Category : Military supplies
Languages : en
Pages : 252
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Book Description
Author: Roger C. Griffin
Publisher: Springer Science & Business Media
ISBN: 9401173826
Category : Science
Languages : en
Pages : 388
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Book Description
Since the first edition of "Principles of Packaging Development" was published, the packaging industry has undergone many profound changes. These have included the virtual elimination of cellophane and its replacement with oriented polypropylene as a carton overwrap, fluid milk in blow-molded HDPE bottles, PET beverage bottles, cookie bags and cartons lined with polyolefin coextrusions instead of waxed glassine, and bread in reclosable polyolefin and coextruded film bags. New phrases have also worked their way into the lexicon of the practic ing packaging technologist, such as "child resistance" and "tamper evident. " This most popular text on packaging demanded updating. How these phrases and ideas have affected the industry in the 1980s and how they will probably alter its course in the future are treated. New concepts of packaging system planning and forecasting tech niques are intruding into package management, and new chapters will introduce them to the reader. The years have added a certain degree of maturity to the packaging industry. Not only have the original authors broadened their per spectives and changed professional responsibilities, we have also in cluded a third co-author, Dr. Aaron L. Brody, whose experience in the industry, academic background, and erudite insights into the very na ture of packaging have added an unparalled degree of depth to this book. We would like to thank David L.
Author: Ray Klimovitz
Publisher:
ISBN: 9780978772673
Category : Beer
Languages : en
Pages : 474
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Book Description
Author:
Publisher:
ISBN:
Category : Packaging
Languages : en
Pages : 54
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Book Description
Author: Beth Keser
Publisher: John Wiley & Sons
ISBN: 1119314135
Category : Technology & Engineering
Languages : en
Pages : 576
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Book Description
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Author: W.M. Wadman
Publisher: Routledge
ISBN: 1315501449
Category : Business & Economics
Languages : en
Pages : 334
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Book Description
Examines consumer decision-making on products and services of variable quality at the level of retail markets. Addresses for the first time consumer-producer interaction at the level of the individual consumer; issues of quality, consumption experience, and willingness-to-pay, as exhibited by individual consumers; and how these issues affect the decision-making process.
Author: Ronald Pilchik
Publisher: CRC Press
ISBN: 1420014943
Category : Medical
Languages : en
Pages : 158
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Book Description
According to the FDA Quality System Regulations, manufacturers must ensure that "device packaging and shipping containers are designed and constructed to protect the device from alteration or damage during the customary conditions of processing, storage, handling, and distribution." As specific as this statement is, the FDA does not provide instruc
Author: Beth Keser
Publisher: John Wiley & Sons
ISBN: 1119793890
Category : Technology & Engineering
Languages : en
Pages : 324
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Book Description
Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.
