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Author: Ken Gilleo
Publisher: McGraw-Hill Professional Publishing
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 232
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Book Description
This engineering reference covers new techniques in electronic packaging - flip chip, BGA, and MEMs. It includes high density packaging and cleaning options.
Author: Ken Gilleo
Publisher: McGraw-Hill Professional Publishing
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 232
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Book Description
This engineering reference covers new techniques in electronic packaging - flip chip, BGA, and MEMs. It includes high density packaging and cleaning options.
Author: Ken Gilleo
Publisher: McGraw Hill Professional
ISBN:
Category : Business & Economics
Languages : en
Pages : 832
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Book Description
*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)
Author: Karl J. Puttlitz
Publisher: Springer Science & Business Media
ISBN: 1461513898
Category : Technology & Engineering
Languages : en
Pages : 1250
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Book Description
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Author: Ken Gilleo
Publisher: McGraw-Hill
ISBN: 9780071738019
Category : Technology & Engineering
Languages : en
Pages : 272
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Book Description
This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.
Author: William Greig
Publisher: Springer Science & Business Media
ISBN: 0387339132
Category : Technology & Engineering
Languages : en
Pages : 312
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Book Description
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
Author: Suny Li (Li Yang)
Publisher: John Wiley & Sons
ISBN: 1119045932
Category : Technology & Engineering
Languages : en
Pages : 508
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Book Description
An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies design FlipChip and RDL design Routing and coppering 3D Real-Time DRC check SiP simulation technology Mentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.
Author: Michael Pecht
Publisher: CRC Press
ISBN: 1351829971
Category : Technology & Engineering
Languages : en
Pages : 910
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Book Description
Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Author: Raminderpal Singh
Publisher: John Wiley & Sons
ISBN: 0471150428
Category : Technology & Engineering
Languages : en
Pages : 484
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Book Description
"...offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity." —Jake Buurma, Senior Vice President, Worldwide Research & Development, Cadence Design Systems, Inc. Covers signal integrity effects in high performance Radio Frequency (RF) IC Brings together research papers from the past few years that address the broad range of issues faced by IC designers and CAD managers now and in the future A Wiley-IEEE Press publication
Author: Ning-Cheng Lee
Publisher: Newnes
ISBN: 0750672188
Category : Technology & Engineering
Languages : en
Pages : 282
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Book Description
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
Author: John H. Lau
Publisher: McGraw Hill Professional
ISBN: 9780070366084
Category : Technology & Engineering
Languages : en
Pages : 664
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Book Description
A summary of progress in ball grid array (BGA) packaging technology, for professionals in BGA research and development, and for manufacturers researching BGA for their interconnect systems. Discusses economic, design, material, process, and quality issues, and describes techniques for processing substrates, routing PCB, assembling CBGA, PBGA, and TBGA packages, and inspection of BGA PCB assemblies. Includes treatment of BGA industry infrastructure, and an electronic packaging glossary. Contains bandw photos and diagrams. Annotation copyright by Book News, Inc., Portland, OR
