Author: Susan M. Mini
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 408
Book Description
The 57 papers update the status of characterization techniques that use synchrotron radiation since the previous symposium on the subject in the spring of 1996. The techniques considered include X-ray absorption and scattering, imaging, tomography, microscopy, and topographic methods. Among the materials are surfaces, interfaces, electronic materials, metal oxides, solar cells, thin films, carbides, polymers, alloys, nanoparticles, and graphitic materials. Some of the papers are doubled spaced. Annotation copyrighted by Book News, Inc., Portland, OR
Applications of Synchrotron Radiation Techniques to Materials Science IV: Volume 524
Applications of Synchrotron Radiation Techniques to Materials Science
Author:
Publisher:
ISBN:
Category : Materials
Languages : en
Pages : 408
Book Description
Publisher:
ISBN:
Category : Materials
Languages : en
Pages : 408
Book Description
Chemical Applications of Synchrotron Radiation: X-ray applications
Author: Tsun-Kong Sham
Publisher: World Scientific
ISBN: 9789810249786
Category : Science
Languages : en
Pages : 648
Book Description
Publisher: World Scientific
ISBN: 9789810249786
Category : Science
Languages : en
Pages : 648
Book Description
Applications of Synchrotron Radiation Techniques to Materials Science IV: Volume 678
Author: P. G. Allen
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 226
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. Much like earlier books in the series, this collection of papers, first published in 2001, brings together the materials science community and the characterization techniques that use synchrotron radiation.
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 226
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. Much like earlier books in the series, this collection of papers, first published in 2001, brings together the materials science community and the characterization techniques that use synchrotron radiation.
Defect and Impurity Engineered Semiconductors and Devices
Author:
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 712
Book Description
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 712
Book Description
Hydrogen in Semiconductors and Metals
Author: Norbert H. Nickel
Publisher:
ISBN:
Category : Metals
Languages : en
Pages : 480
Book Description
Publisher:
ISBN:
Category : Metals
Languages : en
Pages : 480
Book Description
High-Temperature Ordered Intermetallic Alloys VIII: Volume 552
Author: Easo P. George
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 864
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 864
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Dynamics in Small Confining Systems IV: Volume 543
Author: J. M. Drake
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 392
Book Description
This book, the fourth in a series from the Materials Research Society, follows the tradition of earlier volumes in the series and covers a broad range of topics relating to structure and dynamics under geometric restrictions. Emphasis is on methods of probing confined systems, diffusion in porous media, polymers and membranes, dielectric and mechanical relaxation in nanopores, rheology and friction studies of embedded liquids, and properties of dendrimer supermolecules. Participants from many varied disciplines share their points of view on the fundamental questions of how spatial restrictions modify a system to behave significantly different than in bulk, how this difference relates to the molecular properties, and how it can be probed.
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 392
Book Description
This book, the fourth in a series from the Materials Research Society, follows the tradition of earlier volumes in the series and covers a broad range of topics relating to structure and dynamics under geometric restrictions. Emphasis is on methods of probing confined systems, diffusion in porous media, polymers and membranes, dielectric and mechanical relaxation in nanopores, rheology and friction studies of embedded liquids, and properties of dendrimer supermolecules. Participants from many varied disciplines share their points of view on the fundamental questions of how spatial restrictions modify a system to behave significantly different than in bulk, how this difference relates to the molecular properties, and how it can be probed.
Nanotechnology General Session featuring Nanoscale Luminescent Materials 4
Author: O. M. Leonte
Publisher: The Electrochemical Society
ISBN: 1607687615
Category : Science
Languages : en
Pages : 43
Book Description
Publisher: The Electrochemical Society
ISBN: 1607687615
Category : Science
Languages : en
Pages : 43
Book Description
Electronic Packaging Materials Science X: Volume 515
Author: Daniel J. Belton
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 288
Book Description
Proceedings of the April 1998 symposium, which focused on high-density package solutions, with an emphasis on flip-chip technology. Topics include interfacial adhesion behavior, flip-chip interconnections, high-density substrates, thermomechanical behavior, and packaging reliability issues. Articles address the fracture of polymer interfaces and the delamination tendencies seen with flip-chip interconnections on organic substrates, under-bump metallurgy issues, and overall reliability issues. Annotation copyrighted by Book News, Inc., Portland, OR
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 288
Book Description
Proceedings of the April 1998 symposium, which focused on high-density package solutions, with an emphasis on flip-chip technology. Topics include interfacial adhesion behavior, flip-chip interconnections, high-density substrates, thermomechanical behavior, and packaging reliability issues. Articles address the fracture of polymer interfaces and the delamination tendencies seen with flip-chip interconnections on organic substrates, under-bump metallurgy issues, and overall reliability issues. Annotation copyrighted by Book News, Inc., Portland, OR