Author:
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages :

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Author: Arman Vassighi
Publisher: Springer Science & Business Media
ISBN: 0387297499
Category : Technology & Engineering
Languages : en
Pages : 188

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Book Description
In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.

Author: Kaveh Azar
Publisher: CRC Press
ISBN: 1000141268
Category : Technology & Engineering
Languages : en
Pages : 498

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Book Description
Filled with careful explanations, step-by-step instructions, and useful examples, this handbook focuses on real-world considerations and applications of thermal measurement methods in electronics cooling. Fifteen experts in thermal engineering combine their expertise to create a complete guide to this complex topic. This practical reference covers all aspects of thermal characterization in electronics cooling and thermal management. The first part of the book introduces the concept of electronics cooling and its associated thermal phenomenon and explains why experimental investigation is required. Subsequent chapters explain methods of measuring different parameters and introduce relevant examples. Sources for locating needed equipment, tables, checklists, and to-do lists are included. Sample calculations and methodologies for error analysis ensure that you can put this valuable information to use in your work.

Author: Michael Boyle
Publisher:
ISBN: 9780780352650
Category : Semiconductors
Languages : en
Pages : 299

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Author: Márta Rencz
Publisher: MDPI
ISBN: 3039217364
Category : Technology & Engineering
Languages : en
Pages : 222

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With increasing power levels and power densities in electronics systems, thermal issues are becoming more and more critical. The elevated temperatures result in changing electrical system parameters, changing the operation of devices, and sometimes even the destruction of devices. To prevent this, the thermal behavior has to be considered in the design phase. This can be done with thermal end electro-thermal design and simulation tools. This Special Issue of Energies, edited by two well-known experts of the field, Prof. Marta Rencz, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects twelve papers carefully selected for the representation of the latest results in thermal and electro-thermal system simulation. These contributions present a good survey of the latest results in one of the most topical areas in the field of electronics: The thermal and electro-thermal simulation of electronic components and systems. Several papers of this issue are extended versions of papers presented at the THERMINIC 2018 Workshop, held in Stockholm in the fall of 2018. The papers presented here deal with modeling and simulation of state-of-the-art applications that are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. Contributions covered the thermal simulation of electronic packages, electro-thermal advanced modeling in power electronics, multi-physics modeling and simulation of LEDs, and the characterization of interface materials, among other subjects.

Author: Alhussein Albarbar
Publisher: Springer
ISBN: 3319598287
Category : Technology & Engineering
Languages : en
Pages : 224

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This book analyzes the thermal characteristics of power electronic devices (PEDs) with a focus on those used in wind and solar energy systems. The authors focus on the devices used in such applications, for example boost converters and inverters under different operating conditions. The book explains in detail finite element modeling techniques, setting up measuring systems, data analysis, and PEDs’ lifetime calculations. It is appropriate reading for graduate students and researchers who focus on the design and reliability of power electronic devices.

Author: Philip Garrou
Publisher: John Wiley & Sons
ISBN: 352762306X
Category : Technology & Engineering
Languages : en
Pages : 798

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Book Description
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.

Author: Willem Dirk van Driel
Publisher: Springer Nature
ISBN: 3030815765
Category : Technology & Engineering
Languages : en
Pages : 552

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This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.

Author: Mostafizur Rahaman
Publisher: Woodhead Publishing
ISBN: 0128216409
Category : Technology & Engineering
Languages : en
Pages : 817

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Book Description
Polymer Nanocomposites Containing Graphene: Preparation, Properties and Applications provides detailed up-to-date information on the characterization, synthesis, processing, properties and application of these materials. Key topics that are covered in the book include: the methods of synthesis and preparation of graphene as well as different processes and methods of functionalization and modification of graphene for improving composite properties. The preparation techniques focus on which method is advantageous for getting improvements in properties along with their drawbacks. The structure and property relationships are also discussed in detail. The issues related to graphene dispersion in polymer matrices is also addressed as well as the use of graphene as reinforcement in thermoset resins. The different properties of the composites like mechanical, electrical, dielectric, thermal, rheological, morphology, spectroscopy, electronic, optical, and toxicity are reviewed from the geometrical and functional point of view. Applications cover electrical and electronic fields, flame and fire retardancy, structural, sensing and catalysis, membrane, in fuel cell and solar energy, hydrogen production, aerospace engineering, packaging, and biomedical/bioengineering fields. Up-to-date patents on graphene-polymer nanocomposites are also covered. Those working in graphene-based materials will benefit from the detailed knowledge presented in this book on graphene synthesis, composite preparation methods, and the related problems associated with them. The book will enable researchers to select the appropriate composite as per their respective field of application. - Presents novel approaches for the preparation of graphene, its modification and nanocomposites with enhanced properties for state-of-the-art applications - Special attention is given to how graphene is synthesized through different routes, their functionality, dispersion related matters and structural aspects controlling the composite properties for various applications - All synthesis methodology and functionalization procedure for graphene is discussed

Author: Chunwei Cai
Publisher: Springer Nature
ISBN: 9819708656
Category :
Languages : en
Pages : 701

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