Annual Connectors and Interconnection Technology Symposium Proceedings PDF Download
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Author:
Publisher:
ISBN:
Category : Electric connectors
Languages : en
Pages : 448
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Book Description
Author:
Publisher:
ISBN:
Category : Electric connectors
Languages : en
Pages : 448
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Book Description
Author:
Publisher:
ISBN:
Category : Electric connectors
Languages : en
Pages : 532
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Book Description
Author: Society of Plastics Engineers. Technical Conference
Publisher:
ISBN:
Category : Plastics
Languages : en
Pages : 588
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Book Description
Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 1008
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Book Description
Author: IGIC, Inc. Staff
Publisher: Information Gatekeepers Inc
ISBN: 9781568510682
Category : Technology & Engineering
Languages : en
Pages : 560
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Book Description
Author:
Publisher:
ISBN:
Category : Periodicals
Languages : en
Pages : 1748
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Book Description
A union list of serials commencing publication after Dec. 31, 1949.
Author:
Publisher:
ISBN:
Category : Physics
Languages : en
Pages : 874
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Book Description
Author: Pradeep Lall
Publisher: CRC Press
ISBN: 0429605595
Category : Technology & Engineering
Languages : en
Pages : 332
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Book Description
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Author: Paul G. Slade
Publisher: CRC Press
ISBN: 9780824719340
Category : Technology & Engineering
Languages : en
Pages : 1116
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Book Description
Covering the choice, attachment, and testing of contact materials, Electrical Contacts introduces a thorough discussion on making electric contact and contact interface conduction, presents a general outline of, and measurement techniques for, important corrosion mechanisms, discusses the results of contact wear when plug-in connections are made and broken, investigates the effect of thin noble metal plating on electronic connections, relates crucial considerations for making high- and low-power contact joints, details arcing effects on contacts including contact erosion, welding, and contamination, and contains nearly 2800 references, tables, equations, drawings, and photographs.
Author: Krishna B. Misra
Publisher: Springer Science & Business Media
ISBN: 1848001312
Category : Technology & Engineering
Languages : en
Pages : 1331
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Book Description
Dependability and cost effectiveness are primarily seen as instruments for conducting international trade in the free market environment. These factors cannot be considered in isolation of each other. This handbook considers all aspects of performability engineering. The book provides a holistic view of the entire life cycle of activities of the product, along with the associated cost of environmental preservation at each stage, while maximizing the performance.
