Author: Douglas M. Burch
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 60
Book Description
An infrared technique for heat-loss measurement
Author: Douglas M. Burch
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 60
Book Description
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 60
Book Description
NBS Technical Note
Author:
Publisher:
ISBN:
Category : Physical instruments
Languages : en
Pages : 60
Book Description
Publisher:
ISBN:
Category : Physical instruments
Languages : en
Pages : 60
Book Description
Infrared Thermography
Author: Raghu Prakash
Publisher: BoD – Books on Demand
ISBN: 9535102427
Category : Mathematics
Languages : en
Pages : 250
Book Description
Infrared Thermography (IRT) is commonly as a NDE tool to identify damages and provide remedial action. The fields of application are vast, such as, materials science, life sciences and applied engineering. This book offers a collection of ten chapters with three major sections - relating to application of infrared thermography to study problems in materials science, agriculture, veterinary and sports fields as well as in engineering applications. Both mathematical modeling and experimental aspects of IRT are evenly discussed in this book. It is our sincere hope that the book meets the requirements of researchers in the domain and inspires more researchers to study IRT.
Publisher: BoD – Books on Demand
ISBN: 9535102427
Category : Mathematics
Languages : en
Pages : 250
Book Description
Infrared Thermography (IRT) is commonly as a NDE tool to identify damages and provide remedial action. The fields of application are vast, such as, materials science, life sciences and applied engineering. This book offers a collection of ten chapters with three major sections - relating to application of infrared thermography to study problems in materials science, agriculture, veterinary and sports fields as well as in engineering applications. Both mathematical modeling and experimental aspects of IRT are evenly discussed in this book. It is our sincere hope that the book meets the requirements of researchers in the domain and inspires more researchers to study IRT.
NBS Special Publication
Author:
Publisher:
ISBN:
Category : Building
Languages : en
Pages : 554
Book Description
Publisher:
ISBN:
Category : Building
Languages : en
Pages : 554
Book Description
The United States Department of Commerce Publications, Catalog and Index Supplement
Author: United States. Department of Commerce
Publisher:
ISBN:
Category : Commerce
Languages : en
Pages : 112
Book Description
Publisher:
ISBN:
Category : Commerce
Languages : en
Pages : 112
Book Description
Energy Research Abstracts
Author:
Publisher:
ISBN:
Category : Power resources
Languages : en
Pages : 888
Book Description
Publisher:
ISBN:
Category : Power resources
Languages : en
Pages : 888
Book Description
Journal of Research of the National Bureau of Standards
Author: United States. National Bureau of Standards
Publisher:
ISBN:
Category : Chemistry
Languages : en
Pages : 912
Book Description
Publisher:
ISBN:
Category : Chemistry
Languages : en
Pages : 912
Book Description
Dimensions
Author:
Publisher:
ISBN:
Category : Technology
Languages : en
Pages : 36
Book Description
Publisher:
ISBN:
Category : Technology
Languages : en
Pages : 36
Book Description
Scientific and Technical Aerospace Reports
Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 1126
Book Description
Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 1126
Book Description
Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.
Encyclopedia Of Thermal Packaging - Set 1: Thermal Packaging Techniques (A 6-volume Set)
Author:
Publisher: World Scientific
ISBN: 9814452599
Category : Technology & Engineering
Languages : en
Pages : 1582
Book Description
remove This Encyclopedia comes in 3 sets. To check out Set 2 and Set 3, please visit Set 2: Thermal Packaging Tools and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 1: Thermal Packaging TechniquesThe first set of the Encyclopedia, Thermal Packaging Techniques, focuses on the technology “building blocks” used to assemble a complete thermal management system and provide detailed descriptions of the underlying phenomena, modeling equations, and correlations, as well as guidance for achieving the optimal designs of individual “building blocks” and their insertion in the overall thermal solution. Specific volumes deal with microchannel coolers, cold plates, immersion cooling modules, thermoelectric microcoolers, and cooling devices for solid state lighting systems, as well as techniques and procedures for the experimental characterization of thermal management components. These “building blocks” are the essential elements in the creation of a complete, cost-effective thermal management system.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
Publisher: World Scientific
ISBN: 9814452599
Category : Technology & Engineering
Languages : en
Pages : 1582
Book Description
remove This Encyclopedia comes in 3 sets. To check out Set 2 and Set 3, please visit Set 2: Thermal Packaging Tools and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 1: Thermal Packaging TechniquesThe first set of the Encyclopedia, Thermal Packaging Techniques, focuses on the technology “building blocks” used to assemble a complete thermal management system and provide detailed descriptions of the underlying phenomena, modeling equations, and correlations, as well as guidance for achieving the optimal designs of individual “building blocks” and their insertion in the overall thermal solution. Specific volumes deal with microchannel coolers, cold plates, immersion cooling modules, thermoelectric microcoolers, and cooling devices for solid state lighting systems, as well as techniques and procedures for the experimental characterization of thermal management components. These “building blocks” are the essential elements in the creation of a complete, cost-effective thermal management system.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.