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Author:
Publisher: DIANE Publishing
ISBN: 1428900632
Category : Printed circuits industry
Languages : en
Pages : 43
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Book Description
Author:
Publisher: DIANE Publishing
ISBN: 1428900632
Category : Printed circuits industry
Languages : en
Pages : 43
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Book Description
Author:
Publisher: DIANE Publishing
ISBN: 1428901817
Category :
Languages : en
Pages : 49
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Book Description
Author: Shengqiang Yang
Publisher: Springer
ISBN: 3662541335
Category : Technology & Engineering
Languages : en
Pages : 505
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Book Description
This book focuses on the theory and techniques of free abrasive tool finishing technology. Providing analytical methods and practical technical references for the engineers involved in surface-finishing processes, it significantly contributes to improving part quality and performance while also promoting further developments in surface finishing technology. Combining a highly systematic approach, readability and novel content, it is a valuable resource for researchers and graduates working in mechanical engineering fields, especially in surface finishing.
Author: United States. Environmental Protection Agency
Publisher:
ISBN:
Category : Environmental protection
Languages : en
Pages : 222
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Book Description
Author: Peter H.-T. Liu
Publisher: CRC Press
ISBN: 1040113923
Category : Medical
Languages : en
Pages : 1003
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Book Description
Waterjet technology involves complex flow phenomena, which include supersonic, turbulent, compressible, and three-phase interactions. This book, by the editor and colleagues, distills three decades of R&D expertise from Flow Industries, Inc. and OMAX Corp., based in Kent, Washington, USA. Organized into 10 sections and 32 chapters, it blends physical experiments and limited computational fluid dynamics analyses as R&D methodologies. Through flow visualization and probe measurement, the book characterizes waterjet geometry, water-droplet and abrasive speeds, surface roughness and edge qualities of machined parts, and more. It showcases advancements in micro abrasive-waterjet technology, recognized as a 2016 R&D 100 Awards finalist and honored with the 2016 Tibbitts Award from the U.S. Small Business Administration.
Author:
Publisher: Allied Publishers
ISBN: 9788170236276
Category :
Languages : en
Pages : 746
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Book Description
Author: Dr. Bijaya Bijeta Nayak
Publisher: RK Publication
ISBN: 8197398372
Category : Technology & Engineering
Languages : en
Pages : 247
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Book Description
Advancements in 3D Printing and Additive Manufacturing the transformative impact of cutting-edge technologies in design and manufacturing. The principles, processes, and materials driving 3D printing innovations, emphasizing their applications across industries like healthcare, aerospace, and construction. It highlights breakthroughs in precision, scalability, and sustainability, offering insights into the future of customizable and efficient production. Aimed at professionals, researchers, and students, this comprehensive guide bridges the gap between theoretical foundations and practical advancements in additive manufacturing.
Author: A Doukelis
Publisher: Elsevier
ISBN: 1782422412
Category : Technology & Engineering
Languages : en
Pages : 403
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Book Description
Thanks to their outstanding hydrogen selectivity, palladium membranes have attracted extensive R&D interest. They are a potential breakthrough technology for hydrogen production and also have promising applications in the areas of thermochemical biorefining. This book summarises key research in palladium membrane technologies, with particular focus on the scale-up challenges. After an introductory chapter, Part one reviews the fabrication of palladium membranes. Part two then focuses on palladium membrane module and reactor design. The final part of the book reviews the operation of palladium membranes for synthesis gas/hydrogen production, carbon capture and other applications. - Review of manufacture and design issues for palladium membranes - Discussion of the applications of palladium membrane technology, including solar steam reforming, IGCC plants, NGCC plants, CHP plants and hydrogen production - Examples of the technology in operation
Author:
Publisher:
ISBN:
Category : Electroplating
Languages : en
Pages : 416
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Book Description
Author: Daryl Ann Doane
Publisher: Springer Science & Business Media
ISBN: 1461531004
Category : Computers
Languages : en
Pages : 895
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Book Description
Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.
