Author: Dominique Persano Adorno
Publisher: Nova Science Publishers
ISBN: 9781633217553
Category : Semiconductors
Languages : en
Pages : 0
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Book Description
The world of semiconductor research is continuously expanding our knowledge of the physics governing phenomena at micro and nano scales, driving the development of new technologies and rapidly enhancing the quality of our everyday life. The huge amount of scientific papers published today in this field of research confirms the great interest of the scientific community in semiconductor science and its future applications. However, this enormous growth of available scientific information sometimes makes the familiar channels of communication considerably less effective, because of the difficulties for experts in a given field to keep up with the current literature. "Advances in Semiconductor Physics" Series has been conceived mainly to improve this situation. This monograph presents a collection of selected contributions reporting some of the most stimulating and challenging results obtained by recent researches in the field of semiconductor physics. About the same number of theoretical, experimental and simulative studies have been included in this book, driven by the basic idea that all these different types of investigations are equally important in increasing our understanding of the physics of semiconductors.
Author: Alexander V. Latyshev
Publisher: Elsevier
ISBN: 0128105135
Category : Technology & Engineering
Languages : en
Pages : 553
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Book Description
Advances in Semiconductor Nanostructures: Growth, Characterization, Properties and Applications focuses on the physical aspects of semiconductor nanostructures, including growth and processing of semiconductor nanostructures by molecular-beam epitaxy, ion-beam implantation/synthesis, pulsed laser action on all types of III–V, IV, and II–VI semiconductors, nanofabrication by bottom-up and top-down approaches, real-time observations using in situ UHV-REM and high-resolution TEM of atomic structure of quantum well, nanowires, quantum dots, and heterostructures and their electrical, optical, magnetic, and spin phenomena. The very comprehensive nature of the book makes it an indispensable source of information for researchers, scientists, and post-graduate students in the field of semiconductor physics, condensed matter physics, and physics of nanostructures, helping them in their daily research. - Presents a comprehensive reference on the novel physical phenomena and properties of semiconductor nanostructures - Covers recent developments in the field from all over the world - Provides an International approach, as chapters are based on results obtained in collaboration with research groups from Russia, Germany, France, England, Japan, Holland, USA, Belgium, China, Israel, Brazil, and former Soviet Union countries
Author: Amalia Patane
Publisher: Springer Science & Business Media
ISBN: 3642233511
Category : Technology & Engineering
Languages : en
Pages : 384
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Book Description
The book describes the fundamentals, latest developments and use of key experimental techniques for semiconductor research. It explains the application potential of various analytical methods and discusses the opportunities to apply particular analytical techniques to study novel semiconductor compounds, such as dilute nitride alloys. The emphasis is on the technique rather than on the particular system studied.
Author:
Publisher: Academic Press
ISBN: 0080864937
Category : Technology & Engineering
Languages : en
Pages : 401
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Book Description
Solid State Physics
Author: Ming Fu Li
Publisher: World Scientific
ISBN: 1908978384
Category : Technology & Engineering
Languages : en
Pages : 529
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Book Description
This unique volume assembles the author's scientific and engineering achievements of the past three decades in the areas of (1) semiconductor physics and materials, including topics in deep level defects and band structures, (2) CMOS devices, including the topics in device technology, CMOS device reliability, and nano CMOS device quantum modeling, and (3) Analog Integrated circuit design. It reflects the scientific career of a semiconductor researcher educated in China during the 20th century. The book can be referenced by research scientists, engineers, and graduate students working in the areas of solid state and semiconductor physics and materials, electrical engineering and semiconductor devices, and chemical engineering./a
Author: C. Claeys
Publisher: Springer Science & Business Media
ISBN: 3662049740
Category : Science
Languages : en
Pages : 424
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Book Description
This wide-ranging book summarizes the current knowledge of radiation defects in semiconductors, outlining the shortcomings of present experimental and modelling techniques and giving an outlook on future developments. It also provides information on the application of sensors in nuclear power plants.
Author: Dieter Bimberg
Publisher: Springer Science & Business Media
ISBN: 3540778993
Category : Technology & Engineering
Languages : en
Pages : 369
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Book Description
Reducing the size of a coherently grown semiconductor cluster in all three directions of space to a value below the de Broglie wavelength of a charge carrier leads to complete quantization of the energy levels, density of states, etc. Such “quantum dots” are more similar to giant atoms in a dielectric cage than to classical solids or semiconductors showing a dispersion of energy as a function of wavevector. Their electronic and optical properties depend strongly on their size and shape, i.e. on their geometry. By designing the geometry by controlling the growth of QDs, absolutely novel possibilities for material design leading to novel devices are opened. This multiauthor book written by world-wide recognized leaders of their particular fields and edited by the recipient of the Max-Born Award and Medal 2006 Professor Dieter Bimberg reports on the state of the art of the growing of quantum dots, the theory of self-organised growth, the theory of electronic and excitonic states, optical properties and transport in a variety of materials. It covers the subject from the early work beginning of the 1990s up to 2006. The topics addressed in the book are the focus of research in all leading semiconductor and optoelectronic device laboratories of the world.
Author: Chue San Yoo
Publisher: World Scientific
ISBN: 9812568239
Category : Technology & Engineering
Languages : en
Pages : 483
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Book Description
This textbook contains all the materials that an engineer needs to know to start a career in the semiconductor industry. It also provides readers with essential background information for semiconductor research. It is written by a professional who has been working in the field for over two decades and teaching the material to university students for the past 15 years. It includes process knowledge from raw material preparation to the passivation of chips in a modular format.
Author: Angus Rockett
Publisher: Springer Science & Business Media
ISBN: 0387686509
Category : Technology & Engineering
Languages : en
Pages : 629
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Book Description
This book describes semiconductors from a materials science perspective rather than from condensed matter physics or electrical engineering viewpoints. It includes discussion of current approaches to organic materials for electronic devices. It further describes the fundamental aspects of thin film nucleation and growth, and the most common physical and chemical vapor deposition techniques. Examples of the application of the concepts in each chapter to specific problems or situations are included, along with recommended readings and homework problems.
Author: John H. Lau
Publisher: Springer Nature
ISBN: 9811613761
Category : Technology & Engineering
Languages : en
Pages : 513
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Book Description
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
