Advances in Polyimide PDF Download
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Author: Claudius Feger
Publisher: CRC Press
ISBN: 9780877629832
Category : Technology & Engineering
Languages : en
Pages : 970
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Book Description
Author: Claudius Feger
Publisher: CRC Press
ISBN: 9780877629832
Category : Technology & Engineering
Languages : en
Pages : 970
Get Book Here
Book Description
Author: Shi-Yong Yang
Publisher: Elsevier
ISBN: 0128126418
Category : Technology & Engineering
Languages : en
Pages : 499
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Book Description
Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation. - Reviews the latest research, development and future prospective of polyimides - Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers - Presents a highly organized work that is composed of different sections that are easily compared
Author: H.R. Kricheldorf
Publisher: Springer
ISBN: 3540498141
Category : Technology & Engineering
Languages : en
Pages : 267
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Book Description
These new volumes of Advances in Polymer Science inform the reader on a broad variety of topics in the field of synthesis, characterization and application of polyimides. They describe and discuss results of recent fundamental research and applied research and focus on topics such as new synthetic methods, thermostable nanofoams, insulating wire enamels, thermosetting resins and liquid-crystalline polyimides.
Author: H.R. Kricheldorf
Publisher: Springer
ISBN: 354049815X
Category : Technology & Engineering
Languages : en
Pages : 200
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Book Description
With contributions by numerous exeperts
Author: Kash L. Mittal
Publisher: CRC Press
ISBN: 9067644226
Category : Technology & Engineering
Languages : en
Pages : 582
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Book Description
This volume chronicles the proceedings of the Third International Symposium on Polyimides and Other High Temperature Polymers: Synthesis, Characterization, and Applications, held in Orlando, December 17-19, 2003. This volume is divided into three parts. Part 1. “Synthesis, Properties and Bulk Characterization”; Part 2 “Hybrids and Composites” and Part 3 “Applications and General Papers”. The topics covered include: Synthesis, characterization and processing (including some novel approaches) of a variety of polyimides and other high temperature polymers; structure-property relationships; hybrids and nanocomposites using these materials and their characterization, properties and applications; segmental dynamics in polyimide materials; photoalignable polyimides; photoconductivity and photosensitivity of polyimides; ultrafiltration membranes from polyetherimide; polyimide as a tunneling barrier; polymer materials for nonlinear optical applications; alignment of SWNTs in rigid-rod polymer compositions; surface modification of polyimide; adhesion of Cu to polyimide surfaces; and polyimide erosion in a low Earth orbit space environment.
Author: Sombel Diaham
Publisher: BoD – Books on Demand
ISBN: 1838800972
Category : Technology & Engineering
Languages : en
Pages : 336
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Book Description
Polyimide is one of the most efficient polymers in many industries for its excellent thermal, electrical, mechanical, and chemical properties as well as its easy processability. In the electronic and electrical engineering industries, polyimide has widely been used for decades thanks to its very good dielectric and insulating properties at the high electric field and at high temperatures of around 200°C in long term-service. Moreover, polyimide appears essential for the development of new electronic devices where further considerations such as high power density, integration, higher temperature, thermal conduction management, energy storage, reliability, or flexibility are required in order to sustain the growing global electrical energy consumption. This book gathers interdisciplinary chapters on polyimide in various topics through state-of-the-art and original ongoing research.
Author: H Ohya
Publisher: CRC Press
ISBN: 9789056990244
Category : Science
Languages : en
Pages : 328
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Book Description
This is a first attempt to provide a general analysis of developments in polyimide membrane synthesis and applications. It will serve as a valuable reference for those with an interest in synthesis of polyimides, the chemistry and physical chemistry of polyimide compounds, the separation properties of membranes and in their preparation and application. It is intended as a summary of the current status of polyimide membrane research for the specialist as well as a teaching aid for graduate studies in polymer chemistry. The authors collaboration demonstrates the high level of scientific research in Russia and the active development of applied research in Japan.
Author: Marc Abadie
Publisher: BoD – Books on Demand
ISBN: 9535108999
Category : Science
Languages : en
Pages : 260
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Book Description
The feature of polyimides and other heterocyclic polymers are now well-established and used for long term temperature durability in the range of 250 - 350'C. This book will review synthesis, mechanisms, ultimate properties, physico-chemical properties, processing and applications of such high performance materials needed in advanced technologies. It presents interdisciplinary papers on the state of knowledge of each topic under consideration through a combination of overviews and original unpublished research. The volume contains eleven chapters divided into three sections: Chemistry; Chemical and Physical Properties; and Applications.
Author: Beth Keser
Publisher: John Wiley & Sons
ISBN: 1119314135
Category : Technology & Engineering
Languages : en
Pages : 576
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Book Description
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Author: Jun-Wei Zha
Publisher: John Wiley & Sons
ISBN: 3527841040
Category : Technology & Engineering
Languages : en
Pages : 405
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Book Description
High Temperature Polymer Dielectrics Overview on how to achieve polymer dielectrics at high temperatures, with emphasis on diverse applications in various electrical insulation fields High Temperature Polymer Dielectrics: Fundamentals and Applications in Power Equipment systematically describes the latest research progress surrounding high-temperature polymer dielectric (HTPD) materials and their applications in electrical insulation fields such as high-temperature energy storage capacitors, motors, packaging, printed circuit board, new energy power equipment, and aerospace electrical equipment. The comprehensive text provides a description of the market demand and theoretical research value of HTPDs in electrical equipment and enables readers to improve the performance and design of existing HTPD materials, and to develop efficient new high temperature polymer dielectric materials in general. Specific sample topics covered in High Temperature Polymer Dielectrics include: Thermal and electrical properties of high-temperature polymers, and the excellent thermal stability, mechanical properties, and long service life of polymer dielectrics Why fluorinated polymers are more thermally stable than their corresponding hydrogen-substituted polymers Static Thermomechanical Analysis (TMA), a technique for measuring the functional relationship between the deformation of the materials and the temperature and time under different actions Polyetheretherketone (PEEK), a semi-crystalline polymer material with ether bonds and ketone carbonyl groups in molecular chains Providing a complete overview of the state-of-the-art high temperature polymer dielectrics, with a focus on fundamental background and recent advances, High Temperature Polymer Dielectrics is an essential resource for materials scientists, electrical engineers, polymer chemists, physicists, and professionals working in the chemical industry as a whole.
