Advanced Sol-gel Processing of PZT Thin Films for Piezoelectric MEMS Structures PDF Download
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Author: Nachiappan Chidambaram
Publisher:
ISBN:
Category :
Languages : en
Pages : 107
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Book Description
Author: Nachiappan Chidambaram
Publisher:
ISBN:
Category :
Languages : en
Pages : 107
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Book Description
Author: Masayoshi Esashi
Publisher: John Wiley & Sons
ISBN: 3527823255
Category : Technology & Engineering
Languages : en
Pages : 528
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Book Description
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Author: Hans Bach
Publisher: Springer Science & Business Media
ISBN: 3662034751
Category : Technology & Engineering
Languages : en
Pages : 445
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Book Description
This book, entitled Thin Films on Glass, is one of a series reporting on research and development activities on products and processes conducted by the Schott Group. The scientifically founded development of new products and technical pro cesses has traditionally been of vital importance to Schott and has always been performed on a scale determined by the prospects for application of our special glasses. Since the reconstruction of the Schott Glaswerke in Mainz, the scale has increased enormously. The range of expert knowledge required could never have been supplied by Schott alone. It is also a tradition in our company to cultivate collaboration with customers, universities, and research institutes. Publications in numerous technical journals, which since 1969 we have edited to a regular schedule as Forschungsberichte - 'research reports' - describe the results of these cooperations. They contain up-to-date infor mation on various topics for the expert but are not suited as survey material for those whose standpoint is more remote. This is the point where we would like to place our series, to stimulate the exchange of thoughts, so that we can consider from different points of view the possibilities offered by those incredibly versatile materials, glass and glass ceramics. We would like to share the knowledge won through our research and development at Schott in cooperation with the users of our materials with scientists and engineers, interested customers and friends, and with the employees of our firm.
Author: Kenji Uchino
Publisher: Woodhead Publishing
ISBN: 0081012551
Category : Technology & Engineering
Languages : en
Pages : 850
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Book Description
Advanced Piezoelectric Materials: Science and Technology, Second Edition, provides revised, expanded, and updated content suitable for those researching piezoelectric materials or using them to develop new devices in areas such as microelectronics, optical, sound, structural, and biomedical engineering. Three new chapters cover multilayer technologies with base-metal internal electrodes, templated grain growth preparation techniques for manufacturing piezoelectric single crystals, and piezoelectric MEMS technologies. Chapters from the first edition have been revised in order to provide up-to-date, comprehensive coverage of developments in the field. Part One covers the structure and properties of a range of piezoelectric materials. Part Two details advanced manufacturing processes for particular materials and device types, including three new chapters. Finally, Part Three covers materials development for three key applications of piezoelectric materials. Dr. Kenji Uchino is a pioneer in piezoelectric actuators, Professor of Electrical Engineering at Penn State University, and Director of the International Center for Actuators and Transducers. He has authored 550 papers, 54 books and 26 patents in the ceramic actuator area. - Features an overview of manufacturing methods for a wide range of piezoelectric materials - Provides revised, expanded, and updated coverage compared to the first edition, including three new chapters - Suitable for those researching piezoelectric materials or using them to develop new devices in areas such as microelectronics, optical, sound, structural, and biomedical engineering
Author: Clifford Fredrick Knollenberg
Publisher:
ISBN:
Category :
Languages : en
Pages : 248
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Book Description
Author: Cheng-Chen Hsueh
Publisher:
ISBN:
Category :
Languages : en
Pages : 296
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Book Description
Author: Randolph Nicholas Jacobs
Publisher:
ISBN:
Category :
Languages : en
Pages : 144
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Book Description
Author: Masanori Okuyama
Publisher: Springer Science & Business Media
ISBN: 9783540241638
Category : Computers
Languages : en
Pages : 272
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Book Description
Ferroelectric thin films continue to attract much attention due to their developing applications in memory devices, FeRAM, infrared sensors, piezoelectric sensors and actuators. This book, aimed at students, researchers and developers, gives detailed information about the basic properties of these materials and the associated device physics. The contributing authors are acknowledged experts in the field.
Author: Lisa C. Klein
Publisher: William Andrew
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 440
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Book Description
Annotation Provides background and fundamentals and evaluates present technology. Main topics are thin films in optical, mechanical, and electrical applications; fibers in refractories, composite reinforcement, and thermal insulation; and special applications such as preforms, microballoons, and electronics. Articles are grouped under chemistry and phase transformations; coatings, thin films, and surface treatment; continuous, discontinuous, and woven fibers; monoliths, shapes, and preforms; and special applications. Annotation(c) 2003 Book News, Inc., Portland, OR (booknews.com)
Author: Francis E. H. Tay
Publisher: Springer Science & Business Media
ISBN: 1475757913
Category : Technology & Engineering
Languages : en
Pages : 302
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Book Description
The field of materials and process integration for MEMS research has an extensive past as well as a long and promising future. Researchers, academicians and engineers from around the world are increasingly devoting their efforts on the materials and process integration issues and opportunities in MEMS devices. These efforts are crucial to sustain the long-term growth of the MEMS field. The commercial MEMS community is heavily driven by the push for profitable and sustainable products. In the course of establishing high volume and low-cost production processes, the critical importance of materials properties, behaviors, reliability, reproducibility, and predictability, as well as process integration of compatible materials systems become apparent. Although standard IC fabrication steps, particularly lithographic techniques, are leveraged heavily in the creation of MEMS devices, additional customized and novel micromachining techniques are needed to develop sophisticated MEMS structures. One of the most common techniques is bulk micromachining, by which micromechanical structures are created by etching into the bulk of the substrates with either anisotropic etching with strong alk:ali solution or deep reactive-ion etching (DRIB). The second common technique is surface micromachining, by which planar microstructures are created by sequential deposition and etching of thin films on the surface of the substrate, followed by a fmal removal of sacrificial layers to release suspended structures. Other techniques include deep lithography and plating to create metal structures with high aspect ratios (LIGA), micro electrodischarge machining (J.
