Advanced Semiconductor-on-Insulator Technology and Related Physics 15 PDF Download
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Author: Yasuhisa Omura
Publisher: The Electrochemical Society
ISBN: 1566778662
Category : Technology & Engineering
Languages : en
Pages : 347
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Book Description
This is the continuation of the long running ¿Silicon-on-Insulator Technology and Devices¿ symposium. The issue of ECS Transactions covers recent significant advances in SOI technologies, SOI-based nanoelectronics and innovative applications including scientific interests. It will be of interest to materials and device scientists, as well as to process and applications oriented engineers and scientists.
Author: Yasuhisa Omura
Publisher: The Electrochemical Society
ISBN: 1566778662
Category : Technology & Engineering
Languages : en
Pages : 347
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Book Description
This is the continuation of the long running ¿Silicon-on-Insulator Technology and Devices¿ symposium. The issue of ECS Transactions covers recent significant advances in SOI technologies, SOI-based nanoelectronics and innovative applications including scientific interests. It will be of interest to materials and device scientists, as well as to process and applications oriented engineers and scientists.
Author: Mikhail I. Dyakonov
Publisher: Springer
ISBN: 3319654365
Category : Technology & Engineering
Languages : en
Pages : 546
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Book Description
This book offers an extensive introduction to the extremely rich and intriguing field of spin-related phenomena in semiconductors. In this second edition, all chapters have been updated to include the latest experimental and theoretical research. Furthermore, it covers the entire field: bulk semiconductors, two-dimensional semiconductor structures, quantum dots, optical and electric effects, spin-related effects, electron-nuclei spin interactions, Spin Hall effect, spin torques, etc. Thanks to its self-contained style, the book is ideally suited for graduate students and researchers new to the field.
Author: O. M. Leonte
Publisher: The Electrochemical Society
ISBN: 1607687615
Category : Science
Languages : en
Pages : 43
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Book Description
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Category : Aeronautics
Languages : en
Pages : 318
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Book Description
Author: George K. Celler
Publisher: The Electrochemical Society
ISBN: 1566775531
Category : Semiconductors
Languages : en
Pages : 409
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Book Description
This issue of ESC Transactions covers recent significant advances in SOI technologies. It will be of interest to materials and device scientists, as well as to process and applications oriented engineers. Several keynote papers introduce and review the main topics. This is followed by contributed papers covering the latest research and implementation results.
Author: Marcelo Rubén Pagnola
Publisher: BoD – Books on Demand
ISBN: 1789841739
Category : Technology & Engineering
Languages : en
Pages : 162
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Book Description
A fundamental part of modern technology is composed of devices that use special materials as main components. Since the last few decades of the last century and even more recently, a remarkable development has been achieved in new micro- and nanostructured materials with compositional structures and production methods that open unprecedented technological, economic, and ecological perspectives due to high yields, economies of scale, the possibility of reducing weight and size, and the low environmental impact of the equipment that contains them. This book offers a collection of excellent studies that use state-of-the-art methodologies developed by professional researchers from different countries in diverse areas of materials. In this way, this book is particularly useful to academics, scientists, practicing researchers, and postgraduate students whose work relates to the latest nanomaterial technologies.
Author: Tapan Gupta
Publisher: Springer Science & Business Media
ISBN: 1441900764
Category : Technology & Engineering
Languages : en
Pages : 433
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Book Description
Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.
Author: Daniel M. Fleetwood
Publisher: CRC Press
ISBN: 1420043773
Category : Science
Languages : en
Pages : 772
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Book Description
Uncover the Defects that Compromise Performance and ReliabilityAs microelectronics features and devices become smaller and more complex, it is critical that engineers and technologists completely understand how components can be damaged during the increasingly complicated fabrication processes required to produce them.A comprehensive survey of defe
Author: United States. National Aeronautics and Space Administration
Publisher:
ISBN:
Category :
Languages : en
Pages : 792
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Book Description
Author:
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ISBN:
Category : Astronautics
Languages : en
Pages : 794
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Book Description
