Advanced Processes for 193-nm Immersion Lithography PDF Download
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Author: Yayi Wei
Publisher: SPIE Press
ISBN: 0819475572
Category : Art
Languages : en
Pages : 338
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Book Description
This book is a comprehensive guide to advanced processes and materials used in 193-nm immersion lithography (193i). It is an important text for those new to the field as well as for current practitioners who want to broaden their understanding of this latest technology. The book can be used as course material for graduate students of electrical engineering, material sciences, physics, chemistry, and microelectronics engineering and can also be used to train engineers involved in the manufacture of integrated circuits. It provides techniques for selecting critical materials (topcoats, photoresists, and antireflective coatings) and optimizing immersion processes to ensure higher performance and lower defectivity at lower cost. This book also includes sections on shrinking, trimming, and smoothing of the resist pattern to reduce feature sizes and line-edge roughness. Finally, it describes the recent development of 193i in combination with double exposure and double patterning.
Author: Yayi Wei
Publisher: SPIE Press
ISBN: 0819475572
Category : Art
Languages : en
Pages : 338
Get Book Here
Book Description
This book is a comprehensive guide to advanced processes and materials used in 193-nm immersion lithography (193i). It is an important text for those new to the field as well as for current practitioners who want to broaden their understanding of this latest technology. The book can be used as course material for graduate students of electrical engineering, material sciences, physics, chemistry, and microelectronics engineering and can also be used to train engineers involved in the manufacture of integrated circuits. It provides techniques for selecting critical materials (topcoats, photoresists, and antireflective coatings) and optimizing immersion processes to ensure higher performance and lower defectivity at lower cost. This book also includes sections on shrinking, trimming, and smoothing of the resist pattern to reduce feature sizes and line-edge roughness. Finally, it describes the recent development of 193i in combination with double exposure and double patterning.
Author: Klaus D. Sattler
Publisher: CRC Press
ISBN: 1420075519
Category : Science
Languages : en
Pages : 782
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Book Description
Many bottom-up and top-down techniques for nanomaterial and nanostructure generation have enabled the development of applications in nanoelectronics and nanophotonics. Handbook of Nanophysics: Nanoelectronics and Nanophotonics explores important recent applications of nanophysics in the areas of electronics and photonics. Each peer-reviewed c
Author: Bob D. Guenther
Publisher: Academic Press
ISBN: 0128149825
Category : Technology & Engineering
Languages : en
Pages : 2253
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Book Description
The Encyclopedia of Modern Optics, Second Edition, Five Volume Set provides a wide-ranging overview of the field, comprising authoritative reference articles for undergraduate and postgraduate students and those researching outside their area of expertise. Topics covered include classical and quantum optics, lasers, optical fibers and optical fiber systems, optical materials and light-emitting diodes (LEDs). Articles cover all subfields of optical physics and engineering, such as electro-optical design of modulators and detectors. This update contains contributions from international experts who discuss topics such as nano-photonics and plasmonics, optical interconnects, photonic crystals and 2D materials, such as graphene or holy fibers. Other topics of note include solar energy, high efficiency LED’s and their use in illumination, orbital angular momentum, quantum optics and information, metamaterials and transformation optics, high power fiber and UV fiber lasers, random lasers and bio-imaging. Addresses recent developments in the field and integrates concepts from fundamental physics with applications for manufacturing and engineering/design Provides a broad and interdisciplinary coverage of specialist areas Ensures that the material is appropriate for new researchers and those working in a new sub-field, as well as those in industry Thematically arranged and alphabetically indexed, with cross-references added to facilitate ease-of-use
Author:
Publisher: Elsevier
ISBN: 0081003587
Category : Science
Languages : en
Pages : 636
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Book Description
As the requirements of the semiconductor industry have become more demanding in terms of resolution and speed it has been necessary to push photoresist materials far beyond the capabilities previously envisioned. Currently there is significant worldwide research effort in to so called Next Generation Lithography techniques such as EUV lithography and multibeam electron beam lithography. These developments in both the industrial and the academic lithography arenas have led to the proliferation of numerous novel approaches to resist chemistry and ingenious extensions of traditional photopolymers. Currently most texts in this area focus on either lithography with perhaps one or two chapters on resists, or on traditional resist materials with relatively little consideration of new approaches. This book therefore aims to bring together the worlds foremost resist development scientists from the various community to produce in one place a definitive description of the many approaches to lithography fabrication. - Assembles up-to-date information from the world's premier resist chemists and technique development lithographers on the properties and capabilities of the wide range of resist materials currently under investigation - Includes information on processing and metrology techniques - Brings together multiple approaches to litho pattern recording from academia and industry in one place
Author: Bruce W. Smith
Publisher: CRC Press
ISBN: 1351643444
Category : Technology & Engineering
Languages : en
Pages : 913
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Book Description
The completely revised Third Edition to the bestselling Microlithography: Science and Technology provides a balanced treatment of theoretical and operational considerations, from fundamental principles to advanced topics of nanoscale lithography. The book is divided into chapters covering all important aspects related to the imaging, materials, and processes that have been necessary to drive semiconductor lithography toward nanometer-scale generations. Renowned experts from the world’s leading academic and industrial organizations have provided in-depth coverage of the technologies involved in optical, deep-ultraviolet (DUV), immersion, multiple patterning, extreme ultraviolet (EUV), maskless, nanoimprint, and directed self-assembly lithography, together with comprehensive descriptions of the advanced materials and processes involved. New in the Third Edition In addition to the full revision of existing chapters, this new Third Edition features coverage of the technologies that have emerged over the past several years, including multiple patterning lithography, design for manufacturing, design process technology co-optimization, maskless lithography, and directed self-assembly. New advances in lithography modeling are covered as well as fully updated information detailing the new technologies, systems, materials, and processes for optical UV, DUV, immersion, and EUV lithography. The Third Edition of Microlithography: Science and Technology authoritatively covers the science and engineering involved in the latest generations of microlithography and looks ahead to the future systems and technologies that will bring the next generations to fruition. Loaded with illustrations, equations, tables, and time-saving references to the most current technology, this book is the most comprehensive and reliable source for anyone, from student to seasoned professional, looking to better understand the complex world of microlithography science and technology.
Author: Changhwan Shin
Publisher: Springer
ISBN: 9401775974
Category : Technology & Engineering
Languages : en
Pages : 141
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Book Description
This book provides a comprehensive overview of contemporary issues in complementary metal-oxide semiconductor (CMOS) device design, describing how to overcome process-induced random variations such as line-edge-roughness, random-dopant-fluctuation, and work-function variation, and the applications of novel CMOS devices to cache memory (or Static Random Access Memory, SRAM). The author places emphasis on the physical understanding of process-induced random variation as well as the introduction of novel CMOS device structures and their application to SRAM. The book outlines the technical predicament facing state-of-the-art CMOS technology development, due to the effect of ever-increasing process-induced random/intrinsic variation in transistor performance at the sub-30-nm technology nodes. Therefore, the physical understanding of process-induced random/intrinsic variations and the technical solutions to address these issues plays a key role in new CMOS technology development. This book aims to provide the reader with a deep understanding of the major random variation sources, and the characterization of each random variation source. Furthermore, the book presents various CMOS device designs to surmount the random variation in future CMOS technology, emphasizing the applications to SRAM.
Author: Ban P. Wong
Publisher: John Wiley & Sons
ISBN: 0470382813
Category : Technology & Engineering
Languages : en
Pages : 408
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Book Description
Discover innovative tools that pave the way from circuit and physical design to fabrication processing Nano-CMOS Design for Manufacturability examines the challenges that design engineers face in the nano-scaled era, such as exacerbated effects and the proven design for manufacturability (DFM) methodology in the midst of increasing variability and design process interactions. In addition to discussing the difficulties brought on by the continued dimensional scaling in conformance with Moore's law, the authors also tackle complex issues in the design process to overcome the difficulties, including the use of a functional first silicon to support a predictable product ramp. Moreover, they introduce several emerging concepts, including stress proximity effects, contour-based extraction, and design process interactions. This book is the sequel to Nano-CMOS Circuit and Physical Design, taking design to technology nodes beyond 65nm geometries. It is divided into three parts: Part One, Newly Exacerbated Effects, introduces the newly exacerbated effects that require designers' attention, beginning with a discussion of the lithography aspects of DFM, followed by the impact of layout on transistor performance Part Two, Design Solutions, examines how to mitigate the impact of process effects, discussing the methodology needed to make sub-wavelength patterning technology work in manufacturing, as well as design solutions to deal with signal, power integrity, WELL, stress proximity effects, and process variability Part Three, The Road to DFM, describes new tools needed to support DFM efforts, including an auto-correction tool capable of fixing the layout of cells with multiple optimization goals, followed by a look ahead into the future of DFM Throughout the book, real-world examples simplify complex concepts, helping readers see how they can successfully handle projects on Nano-CMOS nodes. It provides a bridge that allows engineers to go from physical and circuit design to fabrication processing and, in short, make designs that are not only functional, but that also meet power and performance goals within the design schedule.
Author: Massimo Rudan
Publisher: Springer Nature
ISBN: 3030798275
Category : Technology & Engineering
Languages : en
Pages : 1680
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Book Description
This Springer Handbook comprehensively covers the topic of semiconductor devices, embracing all aspects from theoretical background to fabrication, modeling, and applications. Nearly 100 leading scientists from industry and academia were selected to write the handbook's chapters, which were conceived for professionals and practitioners, material scientists, physicists and electrical engineers working at universities, industrial R&D, and manufacturers. Starting from the description of the relevant technological aspects and fabrication steps, the handbook proceeds with a section fully devoted to the main conventional semiconductor devices like, e.g., bipolar transistors and MOS capacitors and transistors, used in the production of the standard integrated circuits, and the corresponding physical models. In the subsequent chapters, the scaling issues of the semiconductor-device technology are addressed, followed by the description of novel concept-based semiconductor devices. The last section illustrates the numerical simulation methods ranging from the fabrication processes to the device performances. Each chapter is self-contained, and refers to related topics treated in other chapters when necessary, so that the reader interested in a specific subject can easily identify a personal reading path through the vast contents of the handbook.
Author: M Feldman
Publisher: Woodhead Publishing
ISBN: 0857098756
Category : Technology & Engineering
Languages : en
Pages : 599
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Book Description
Integrated circuits, and devices fabricated using the techniques developed for integrated circuits, have steadily gotten smaller, more complex, and more powerful. The rate of shrinking is astonishing – some components are now just a few dozen atoms wide. This book attempts to answer the questions, "What comes next? and "How do we get there?Nanolithography outlines the present state of the art in lithographic techniques, including optical projection in both deep and extreme ultraviolet, electron and ion beams, and imprinting. Special attention is paid to related issues, such as the resists used in lithography, the masks (or lack thereof), the metrology needed for nano-features, modeling, and the limitations caused by feature edge roughness. In addition emerging technologies are described, including the directed assembly of wafer features, nanostructures and devices, nano-photonics, and nano-fluidics.This book is intended as a guide to the researcher new to this field, reading related journals or facing the complexities of a technical conference. Its goal is to give enough background information to enable such a researcher to understand, and appreciate, new developments in nanolithography, and to go on to make advances of his/her own. - Outlines the current state of the art in alternative nanolithography technologies in order to cope with the future reduction in size of semiconductor chips to nanoscale dimensions - Covers lithographic techniques, including optical projection, extreme ultraviolet (EUV), nanoimprint, electron beam and ion beam lithography - Describes the emerging applications of nanolithography in nanoelectronics, nanophotonics and microfluidics
Author: Mikhail Baklanov
Publisher: John Wiley & Sons
ISBN: 0470662549
Category : Technology & Engineering
Languages : en
Pages : 616
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Book Description
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
