Advanced Metallization Conference 2002 (AMC 2002) PDF Download
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Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 920
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Book Description
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 920
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Book Description
Author: Bradley M. Melnick
Publisher: Materials Research Society
ISBN: 9781558997196
Category : Technology & Engineering
Languages : en
Pages : 882
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Book Description
Leading-edge metallization schemes inherently involve the introduction of novel metal systems and novel dielectric materials. Technological advances highlighted during AMC 2002 include the latest developments in integrating copper-based metallization with low-dielectric constant materials and in evaluating the reliability of such interconnects. For the second consecutive year, the volume takes a special look at the status of vertical integration, or 3D chips, and the promise it holds for high-density functional integration and heterogeneous integration. Technical leaders from around the world come together in this volume, the 18th in a popular series from the Materials Research Society, to offers a comprehensive overview of the current state of advanced metallization science and technologies. Topics include: advanced interconnects, 3D integration and packaging; CMP; reliability, test and characterization; metallization; integration; low-k/dielectric materials and characterization; atomic layer deposition (ALD) and barriers.
Author: Advanced Metallization Conference
Publisher:
ISBN:
Category :
Languages : en
Pages : 881
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Book Description
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 730
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Book Description
Author:
Publisher: The Electrochemical Society
ISBN: 9781566774178
Category : Dielectrics
Languages : en
Pages : 508
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Book Description
Author: Darrell Erb
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 922
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Book Description
Author: G. S. Mathad
Publisher: The Electrochemical Society
ISBN: 9781566773935
Category : Technology & Engineering
Languages : en
Pages : 438
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Book Description
Author: Cheol Seong Hwang
Publisher: Springer Science & Business Media
ISBN: 146148054X
Category : Science
Languages : en
Pages : 266
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Book Description
Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.
Author:
Publisher: The Electrochemical Society
ISBN: 9781566774024
Category : Technology & Engineering
Languages : en
Pages : 404
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Book Description
Author: Mikhail Baklanov
Publisher: John Wiley & Sons
ISBN: 1119966868
Category : Technology & Engineering
Languages : en
Pages : 616
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Book Description
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
