Advanced Metallization and Interconnect Systems for ULSI Applications in 1996: Volume 12 PDF Download
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Author: Robert Havemann
Publisher:
ISBN:
Category : Computers
Languages : en
Pages : 640
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Robert Havemann
Publisher:
ISBN:
Category : Computers
Languages : en
Pages : 640
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Daniel C. Edelstein
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 606
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Yoshio Nishi
Publisher: CRC Press
ISBN: 1420017667
Category : Technology & Engineering
Languages : en
Pages : 1722
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Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Author:
Publisher: Academic Press
ISBN: 0080864619
Category : Science
Languages : en
Pages : 325
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Book Description
Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. The Willardson and Beer series, as it is widely known, has succeeded in producing numerous landmark volumes and chapters. Not only did many of these volumes make an impact at the time of their publication, but they continue to be well-cited years after their original release. Recently, Professor Eicke R. Weber of the University of California at Berkeley joined as a co-editor of the series. Professor Weber, a well-known expert in the field of semiconductor materials, will further contribute to continuing the series' tradition of publishing timely, highly relevant, and long-impacting volumes. Some of the recent volumes, such as Hydrogen in Semiconductors, Imperfections in III/V Materials, Epitaxial Microstructures, High-Speed Heterostructure Devices, Oxygen in Silicon, and others promise that this tradition will be maintained and even expanded. Reflecting the truly interdisciplinary nature of the field that the series covers, the volumes in Semiconductors and Semimetals have been and will continue to be of great interest to physicists, chemists, materials scientists, and device engineers in modern industry.
Author: Mark Donald Allendorf
Publisher: The Electrochemical Society
ISBN: 9781566772785
Category : Technology & Engineering
Languages : en
Pages : 826
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Book Description
Author: Paul S. Ho
Publisher: Springer Science & Business Media
ISBN: 3642559085
Category : Technology & Engineering
Languages : en
Pages : 323
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Book Description
Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for
Author: Arief Suriadi Budiman
Publisher: Springer
ISBN: 981287335X
Category : Technology & Engineering
Languages : en
Pages : 182
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Book Description
This Brief highlights the search for strain gradients and geometrically necessary dislocations as a possible source of strength for two cases of deformation of materials at small scales: nanoindented single crystal copper and uniaxially compressed single crystal submicron gold pillars. When crystalline materials are mechanically deformed in small volumes, higher stresses are needed for plastic flow. This has been called the "Smaller is Stronger" phenomenon and has been widely observed. studies suggest that plasticity in one case is indeed controlled by the GNDs (strain gradient hardening), whereas in the other, plasticity is not controlled by strain gradients or sub-structure hardening, but rather by dislocation source starvation, wherein smaller volumes are stronger because fewer sources of dislocations are available (dislocation starvation hardening).
Author: William D. Brown
Publisher: The Electrochemical Society
ISBN: 9781566771979
Category : Technology & Engineering
Languages : en
Pages : 384
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Book Description
Author: Hazara S. Rathore
Publisher: The Electrochemical Society
ISBN: 9781566771351
Category : Science
Languages : en
Pages : 278
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Book Description
Author: M.R. Oliver
Publisher: Springer Science & Business Media
ISBN: 3662062348
Category : Technology & Engineering
Languages : en
Pages : 432
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Book Description
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
