Author: Ujwal Radhakrishna
Publisher:
ISBN:
Category :
Languages : en
Pages : 84
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Book Description
Gallium Nitride (GaN)-based high electron mobility transistors (HEMTs) are rapidly emerging as front-runners in high-power mm-wave circuit applications. For circuit design with current devices and to allow sensible future performance projections from device engineering in such a rapidly evolving technology, compact device models are essential. In this thesis, a physics-based compact model is developed for short channel GaN HEMTs. The model is based on the concept of virtual source (VS) transport originally developed for scaled silicon field effect transistors. Self-consistent current and charge expressions in the model require very few parameters. The parameters have straightforward physical meanings and can be extracted through independent measurements. The model is implemented in Verilog-A and is compatible with state of the art circuit simulators. The new model is calibrated and validated with experimental DC I-V and S-parameter measurements of fabricated devices. Using the model, a projection of cut-off frequency (f-[tau]) of GaN-based HEMTs with scaling is performed to highlight performance bottlenecks.
Author: Hao Zhang
Publisher:
ISBN:
Category : Gallium nitride
Languages : en
Pages : 77
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Book Description
Gallium Nitride (GaN) based high electron mobility transistors (HEMTs) outperform Gallium Arsenide (GaAs) and silicon based transistors for radio frequency (RF) applications in terms of output power and efficiency due to its large bandgap (~3.4 eV@300 K) and high carrier mobility property (1500 - 2300 cm^2/(V-s)). These advantages have made GaN technology a promising candidate for future high-power microwave and potential millimeter-wave applications. Current GaN HEMT models used by the industry, such as Angelov Model, EEHEMT Model and DynaFET (Dynamic FET) model, are empirical or semi-empirical. Lacking the physical description of the device operations, these empirical models are not directly scalable. Circuit design that uses the models requires multiple iterations between the device and circuit levels, becoming a lengthy and expensive process. Conversely existing physics based models, such as surface potential model, are computationally intensive and thus impractical for full scale circuit simulation and optimization. To enable efficient GaN-based RF circuit design, computationally efficient physics based compact models are required. In this thesis, a physics based Virtual Source (VS) compact model is developed for GaN HEMTs targeting RF applications. While the intrinsic current and charge model are developed based on the Virtual Source model originally proposed by MIT researchers, the gate current model and parasitic element network are proposed based on our applications with a new efficient parameter extraction flow. Both direct current (DC) of drain and gate currents and RF measurements are conducted for model parameter extractions. The new flow first extracts device parasitic resistive values based on the DC measurement of gate current. Then parameters related with the intrinsic region are determined based on the transport characteristics in the subthreshold and above threshold regimes. Finally, the parasitic resistance, capacitance and inductance values are optimized based on the S-parameter measurement. This new extraction flow provides reliable and accurate extraction for parasitic element values while achieving reasonable resolutions holistically with both DC and RF characteristics. The model is validated against measurement data in terms of drain current, gate current and scattering parameter (S-parameter). This model provides simple yet clear physical description for GaN HEMTs with only a short list of model parameters compared with other empirical or physics based models. It can be easily integrated in circuit simulators for RF circuit design.
Author: Patrick Fay
Publisher: Springer
ISBN: 3030202089
Category : Technology & Engineering
Languages : en
Pages : 309
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Book Description
This book brings together recent research by scientists and device engineers working on both aggressively-scaled conventional transistors as well as unconventional high-frequency device concepts in the III-N material system. Device concepts for mm-wave to THz operation based on deeply-scaled HEMTs, as well as distributed device designs based on plasma-wave propagation in polarization-induced 2DEG channels, tunneling, and hot-carrier injection are discussed in detail. In addition, advances in the underlying materials science that enable these demonstrations, and advancements in metrology that permit the accurate characterization and evaluation of these emerging device concepts are also included. Targeting readers looking to push the envelope in GaN-based electronics device research, this book provides a current, comprehensive treatment of device concepts and physical phenomenology suitable for applying GaN and related materials to emerging ultra-high-frequency applications. Offers readers an integrated treatment of the state of the art in both conventional (i.e., HEMT) scaling as well as unconventional device architectures suitable for amplification and signal generation in the mm-wave and THz regime using GaN-based devices, written by authors that are active and widely-known experts in the field; Discusses both conventional scaled HEMTs (into the deep mm-wave) as well as unconventional approaches to address the mm-wave and THz regimes; Provides “vertically integrated” coverage, including materials science that enables these recent advances, as well as device physics & design, and metrology techniques; Includes fundamental physics, as well as numerical simulations and experimental realizations.
Author: Sourabh Khandelwal
Publisher: Springer Nature
ISBN: 3030777308
Category : Technology & Engineering
Languages : en
Pages : 194
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Book Description
This book discusses in detail the Advanced SPICE Model for GaN HEMTs (ASM-HEMT), a new industry standard model for GaN-based power and RF circuit design. The author describes this new, standard model in detail, covering the different components of the ASM GaN model from fundamental derivations to the implementation in circuit simulation tools. The book also includes a detailed description of parameter extraction steps and model quality tests, which are critically important for effective use of this standard model in circuit simulation and product design. Coverage includes both radio-frequency (RF), and power electronics applications of this model. Practical issues related to measurement data and parameter extraction flow are also discussed, enabling readers easily to adopt this new model for design flow and simulation tools. Describes in detail a new industry standard for GaN-based power and RF circuit design; Includes discussion of practical problems and their solutions in GaN device modeling; Covers both radio-frequency (RF) and power electronics application of GaN technology; Describes modeling of both GaN RF and power devices.
Author: Gunter Kompa
Publisher: Artech House
ISBN: 1630817457
Category : Technology & Engineering
Languages : en
Pages : 610
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Book Description
All model parameters are fundamentally coupled together, so that directly measured individual parameters, although widely used and accepted, may initially only serve as good estimates. This comprehensive resource presents all aspects concerning the modeling of semiconductor field-effect device parameters based on gallium-arsenide (GaAs) and gallium nitride (GaN) technology. Metal-semiconductor field-effect transistors (MESFETs), high electron mobility transistors (HEMTs) and heterojunction bipolar transistors (HBTs), their structures and functions, and existing transistor models are also classified. The Shockley model is presented in order to give insight into semiconductor field-effect transistor (FET) device physics and explain the relationship between geometric and material parameters and device performance. Extraction of trapping and thermal time constants is discussed. A special section is devoted to standard nonlinear FET models applied to large-signal measurements, including static-/pulsed-DC and single-/two-tone stimulation. High power measurement setups for signal waveform measurement, wideband source-/load-pull measurement (including envelope source-/load pull) are also included, along with high-power intermodulation distortion (IMD) measurement setup (including envelope load-pull). Written by a world-renowned expert in the field, this book is the first to cover of all aspects of semiconductor FET device modeling in a single volume.
Author: D. Nirmal
Publisher: Springer
ISBN: 9789819775057
Category : Technology & Engineering
Languages : en
Pages : 0
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Book Description
This volume focuses on GaN HEMT, the most promising transistor technology for RF power applications such as 5G communications, space and defense. The contents include accurate small signal models required to predict the RF power performance of RF electronic circuits, large signal modeling of GaN HEMTs, accurate and compact physical models to assist the RF circuit designers to optimize GaN HEMT-based power amplifiers and integrated circuits, among others. The book also covers thermal resistance modeling of GaN HEMTs, charge-based compact models, and surface potential-based models to study the impact of gate leakage current on the RF power performance of GaN HEMTs. This book also deals with the analytical modeling of intrinsic charges and surface potential of GaN HEMTs, physical modeling of charge trapping, neural network-based GaN HEMT models, numerical-based GaN HEMT models, modeling of short channel effects in GaN HEMTs, modeling of parasitic capacitances and resistances, modelingof current collapse and kink effects in HGaN HEMTs, etc. This volume will be a useful to those in industry and academia.
Author: Ujwal Radhakrishna
Publisher:
ISBN:
Category :
Languages : en
Pages : 291
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Book Description
Gallium-Nitride-based high electron mobility transistor (HEMTs) technology is increasingly finding space in high voltage (HV) and high frequency (HF) circuit application domains. The superior breakdown electric field, high electron mobility, and high temperature performance of GaN HEMTs are the key factors for its use as HV switches in converters and active components of RF-power amplifiers. Designing circuits in both application regimes requires accurate compact device models that are grounded in physics and can describe the non-linear terminal characteristics. Currently available compact models for HEMTs are empirical and hence are lacking in physical description of the device, which becomes a handicap in understanding key device-circuit interactions and in accurate estimation of device behavior in circuits. This thesis seeks to develop a physics-based compact model for GaN HEMTs from first principles which can be used as a design tool for technology optimization to identify device-performance bottlenecks on one hand and as a tool for circuit design to investigate the impact of behavioral nuances of the device on circuit performance, on the other. Part of this thesis consists of demonstrations of the capabilities of the model to accurately predict device characteristics such as terminal DC- and pulsed-currents, charges, small-signal S-parameters, large-signal switching characteristics, load-pull, source-pull and power-sweep, inter-modulation-distortion and noise-figure of both HV- and RF-devices. The thesis also aims to tie device-physics concepts of carrier transport and charge distribution in GaN HEMTs to circuit-design through circuit-level evaluation. In the HV-application regime benchmarking is conducted against switching characteristics of a GaN DC-DC converter to understand the impact of device capacitances, field plates, temperature and charge-trapping on switching slew rates. In the RF-application regime validation is done against the large-signal characteristics of GaN-power amplifiers to study the output-power, efficiency and compression characteristics as function of class-of-operation. Noise-figure of low-noise amplifiers is tested to estimate the contributions of device-level noise sources, and validation against switching frequency and phase-noise characteristics of voltage-controlled oscillators is done to evaluate the noise performance of GaN HEMT technology. Evaluation of model-accuracy in determining the conversion-efficiency of RF-converters and linearity metrics of saturated non-linear amplifiers is carried out. The key contribution of this work is to provide a tool in the form of a physics-based compact model to device-technology-engineers and circuit-designers, who can use it to evaluate the potential strengths and weaknesses of the emerging GaN technology.
Author: Vikrant Bhateja
Publisher: Springer Nature
ISBN: 981974895X
Category :
Languages : en
Pages : 564
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Book Description
Author: Yogesh Singh Chauhan
Publisher: Elsevier
ISBN: 0323999409
Category : Technology & Engineering
Languages : en
Pages : 262
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Book Description
GaN Transistor Modeling for RF and Power Electronics: Using The ASM-GaN-HEMT Model covers all aspects of characterization and modeling of GaN transistors for both RF and Power electronics applications. Chapters cover an in-depth analysis of the industry standard compact model ASM-HEMT for GaN transistors. The book details the core surface-potential calculations and a variety of real device effects, including trapping, self-heating, field plate effects, and more to replicate realistic device behavior. The authors also include chapters on step-by-step parameter extraction procedures for the ASM-HEMT model and benchmark test results. GaN is the fastest emerging technology for RF circuits as well as power electronics. This technology is going to grow at an exponential rate over the next decade. This book is envisioned to serve as an excellent reference for the emerging GaN technology, especially for circuit designers, materials science specialists, device engineers and academic researchers and students. - Provides an overview of the operation and physics of GaN-based transistors - Features in-depth description (by the developers of the model) of all aspects of the industry standard ASM-HEMT model for GaN circuits - Details parameter extraction of GaN devices and measurement data requirements for GaN model extraction
Author: Eldad Bahat-Treidel
Publisher: Cuvillier Verlag
ISBN: 3736940947
Category : Science
Languages : en
Pages : 220
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Book Description
Gallium nitride (GaN)-based High Electron Mobility Transistors (HEMTs) for high voltage, high power switching and regulating for space applications are studied in this work. Efficient power switching is associated with operation in high OFF-state blocking voltage while keeping the ON-state resistance, the dynamic dispersion and leakage currents as low as possible. The potential of such devices to operate at high voltages is limited by a chain of factors such as subthreshold leakages and the device geometry. Blocking voltage enhancement is a complicated problem that requires parallel methods for solution; epitaxial layers design, device structural and geometry design, and suitable semiconductor manufacturing technique. In this work physical-based device simulation as an engineering tool was developed. An overview on GaN-based HEMTs physical based device simulation using Silvaco-“ATLAS” is given. The simulation is utilized to analyze, give insight to the modes of operation of the device and for design and evaluation of innovative concepts. Physical-based models that describe the properties of the semiconductor material are introduced. A detailed description of the specific AlGaN/GaN HEMT structure definition and geometries are given along with the complex fine meshing requirements. Nitride-semiconductor specific material properties and their physical models are reviewed focusing on the energetic band structure, epitaxial strain tensor calculation in wurtzite materials and build-in polarization models. Special attention for thermal conductivity, carriers’ mobility and Schottky-gate-reverse-bias-tunneling is paid. Empirical parameters matching and adjustment of models parameters to match the experimental device measured results are discussed. An enhancement of breakdown voltage in AlxGa1-xN/GaN HEMT devices by increasing the electron confinement in the transistor channel using a low Al content AlyGa1-yN back-barrier layer structure is systematically studied. It is shown that the reduced sub-threshold drain-leakage current through the buffer layer postpones the punch-through and therefore shifts the breakdown of the device to higher voltages. It is also shown that the punch-through voltage (VPT) scales up with the device dimensions (gate to drain separation). An optimized electron confinement results both, in a scaling of breakdown voltage with device geometry and a significantly reduced sub-threshold drain and gate leakage currents. These beneficial properties are pronounced even further if gate recess technology is applied for device fabrication. For the systematic study a large variations of back-barrier epitaxial structures were grown on sapphire, n-type 4H-SiC and semi-insulating 4H-SiC substrates. The devices with 5 μm gate-drain separation grown on n-SiC owning Al0.05Ga0.95N and Al0.10Ga0.90N back-barrier exhibit 304 V and 0.43 m × cm2 and 342 V and 0.41 m × cm2 respectively. To investigate the impact of AlyGa1-yN back-barrier on the device properties the devices were characterized in DC along with microwave mode and robustness DC-step-stress test. Physical-based device simulations give insight in the respective electronic mechanisms and to the punch-through process that leads to device breakdown. Systematic study of GaN-based HEMT devices with insulating carbon-doped GaN back-barrier for high voltage operation is also presented. Suppression of the OFF-state sub-threshold drain leakage-currents enables breakdown voltage enhancement over 1000 V with low ON-state resistance. The devices with 5 μm gate-drain separation on SI-SiC and 7 μm gate-drain separation on n-SiC exhibit 938 V and 0.39 m × cm2 and 942 V and 0.39 m × cm2 respectively. Power device figure of merit of ~2.3 × 109 V2/-cm2 was calculated for these devices. The impacts of variations of carbon doping concentration, GaN channel thickness and substrates are evaluated. Trade-off considerations in ON-state resistance and of current collapse are addressed. A novel GaN-based HEMTs with innovative planar Multiple-Grating-Field-Plates (MGFPs) for high voltage operation are described. A synergy effect with additional electron channel confinement by using a heterojunction AlGaN back-barrier is demonstrated. Suppression of the OFF-state sub-threshold gate and drain leakage-currents enables breakdown voltage enhancement over 700 V and low ON-state resistance of 0.68 m × cm2. Such devices have a minor trade-off in ON-state resistance, lag factor, maximum oscillation frequency and cut-off frequency. Systematic study of the MGFP design and the effect of Al composition in the back-barrier are described. Physics-based device simulation results give insight into electric field distribution and charge carrier concentration depending on field-plate design. The GaN superior material breakdown strength properties are not always a guarantee for high voltage devices. In addition to superior epitaxial growth design and optimization for high voltage operation the device geometrical layout design and the device manufacturing process design and parameters optimization are important criteria for breakdown voltage enhancement. Smart layout prevent immature breakdown due to lateral proximity of highly biased interconnects. Optimization of inter device isolation designed for high voltage prevents substantial subthreshold leakage. An example for high voltage test device layout design and an example for critical inter-device insulation manufacturing process optimization are presented. While major efforts are being made to improve the forward blocking performance, devices with reverse blocking capability are also desired in a number of applications. A novel GaN-based HEMT with reverse blocking capability for Class-S switch-mode amplifiers is introduced. The high voltage protection is achieved by introducing an integrated recessed Schottky contact as a drain electrode. Results from our Schottky-drain HEMT demonstrate an excellent reverse blocking with minor trade-off in the ON-state resistance for the complete device. The excellent quality of the forward diode characteristics indicates high robustness of the recess process. The reverse blocking capability of the diode is better than –110 V. Physical-based device simulations give insight in the respective electronic mechanisms. Zusammenfassung In dieser Arbeit wurden Galliumnitrid (GaN)-basierte Hochspannungs-HEMTs (High Electron Mobility Transistor) für Hochleistungsschalt- und Regelanwendungen in der Raumfahrt untersucht. Effizientes Leistungsschalten erfordert einen Betrieb bei hohen Sperrspannungen gepaart mit niedrigem Einschaltwiderstand, geringer dynamischer Dispersion und minimalen Leckströmen. Dabei wird das aus dem Halbleitermaterial herrührende Potential für extrem spannungsfeste Transistoren aufgrund mehrerer Faktoren aus dem lateralen und dem vertikalen Bauelementedesign oft nicht erreicht. Physikalisch-basierte Simulationswerkzeuge für die Bauelemente wurden daher entwickelt. Die damit durchgeführte Analyse der unterschiedlichen Transistorbetriebszustände ermöglichte das Entwickeln innovativer Bauelementdesignkonzepte. Das Erhöhen der Bauelementsperrspannung erfordert parallele und ineinandergreifende Lösungsansätze für die Epitaxieschichten, das strukturelle und das geometrische Design und für die Prozessierungstechnologie. Neuartige Bauelementstrukturen mit einer rückseitigen Kanalbarriere (back-barrier) aus AlGaN oder Kohlenstoff-dotierem GaN in Kombination mit neuartigen geometrischen Strukturen wie den Mehrfachgitterfeldplatten (MGFP, Multiple-Grating-Field-Plate) wurden untersucht. Die elektrische Gleichspannungscharakterisierung zeigte dabei eine signifikante Verringerung der Leckströme im gesperrten Zustand. Dies resultierte bei nach wie vor sehr kleinem Einschaltwiderstand in einer Durchbruchspannungserhöhung um das etwa Zehnfache auf über 1000 V. Vorzeitige Spannungsüberschläge aufgrund von Feldstärkenspitzen an Verbindungsmetallisierungen werden durch ein geschickt gestaltetes Bauelementlayout verhindert. Eine Optimierung der Halbleiterisolierung zwischen den aktiven Strukturen führte auch im kV-Bereich zu vernachlässigbaren Leckströme. Während das Hauptaugenmerk der Arbeit auf der Erhöhung der Spannungsfestigkeit im Vorwärtsbetrieb des Transistors lag, ist für einige Anwendung auch ein rückwärtiges Sperren erwünscht. Für Schaltverstärker im S-Klassenbetrieb wurde ein neuartiger GaN-HEMT entwickelt, dessen rückwärtiges Sperrverhalten durch einen tiefgelegten Schottkykontakt als Drainelektrode hervorgerufen wird. Eine derartige Struktur ergab eine rückwärtige Spannungsfestigkeit von über 110 V.
