Author: Charles H. Drummond, III
Publisher: John Wiley & Sons
ISBN: 0470295228
Category : Technology & Engineering
Languages : en
Pages : 306
Book Description
This volume is part of the Ceramic Engineering and Science Proceeding (CESP) series. This series contains a collection of papers dealing with issues in both traditional ceramics (i.e., glass, whitewares, refractories, and porcelain enamel) and advanced ceramics. Topics covered in the area of advanced ceramic include bioceramics, nanomaterials, composites, solid oxide fuel cells, mechanical properties and structural design, advanced ceramic coatings, ceramic armor, porous ceramics, and more.
63rd Conference on Glass Problems, Volume 24, Issue 1
63rd Conference on Glass Problems
Author:
Publisher:
ISBN:
Category : Glass
Languages : en
Pages : 312
Book Description
Publisher:
ISBN:
Category : Glass
Languages : en
Pages : 312
Book Description
Heterogeneous Integrations
Author: John H. Lau
Publisher: Springer
ISBN: 9811372241
Category : Technology & Engineering
Languages : en
Pages : 381
Book Description
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Publisher: Springer
ISBN: 9811372241
Category : Technology & Engineering
Languages : en
Pages : 381
Book Description
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Nuclear Science Abstracts
Author:
Publisher:
ISBN:
Category : Nuclear energy
Languages : en
Pages : 984
Book Description
Publisher:
ISBN:
Category : Nuclear energy
Languages : en
Pages : 984
Book Description
Monthly Labor Review, Index to Volume XXIII, July to December 1926
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 1506
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 1506
Book Description
Automation
Author:
Publisher:
ISBN:
Category : Automation
Languages : en
Pages : 882
Book Description
Publisher:
ISBN:
Category : Automation
Languages : en
Pages : 882
Book Description
The Department of State Bulletin
Author:
Publisher:
ISBN:
Category : United States
Languages : en
Pages : 480
Book Description
The official monthly record of United States foreign policy.
Publisher:
ISBN:
Category : United States
Languages : en
Pages : 480
Book Description
The official monthly record of United States foreign policy.
Scientific and Technical Aerospace Reports
Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 464
Book Description
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 464
Book Description
Creep and Fatigue in Polymer Matrix Composites
Author: Rui Miranda Guedes
Publisher: Elsevier
ISBN: 0857090437
Category : Technology & Engineering
Languages : en
Pages : 605
Book Description
Creep is the tendency of materials to deform when subjected to long-term stress, particularly when exposed to heat. Fatigue phenomena occur when a material is subjected to cyclic loading, causing damage which may progress to failure. Both are critical factors in the long-term performance and reliability of materials such as polymer matrix composites which are often exposed to these types of stress in civil engineering and other applications. This important book reviews the latest research in modelling and predicting creep and fatigue in polymer matrix composites. The first part of the book reviews the modelling of viscoelastic and viscoplastic behaviour as a way of predicting performance and service life. Part two discusses techniques for modelling creep rupture and failure. The final part of the book discusses ways of testing and predicting long-term creep and fatigue in polymer matrix composites. With its distinguished editor and international team of contributors, Creep and Fatigue in Polymer Matrix Composites is a standard reference for all those researching and using polymer matrix composites in such areas as civil engineering. - Reviews the latest research in modelling and predicting creep and fatigue in polymer matrix composites - A specific focus on viscoelestic and viscoplastic modelling features the time-temperature-age superposition principle for predicting long-term response - Creep rupture and damage interaction is examined with particular focus on time-dependent failure criteria for lifetime prediction of polymer matrix composite structures illustrated using experimental cases
Publisher: Elsevier
ISBN: 0857090437
Category : Technology & Engineering
Languages : en
Pages : 605
Book Description
Creep is the tendency of materials to deform when subjected to long-term stress, particularly when exposed to heat. Fatigue phenomena occur when a material is subjected to cyclic loading, causing damage which may progress to failure. Both are critical factors in the long-term performance and reliability of materials such as polymer matrix composites which are often exposed to these types of stress in civil engineering and other applications. This important book reviews the latest research in modelling and predicting creep and fatigue in polymer matrix composites. The first part of the book reviews the modelling of viscoelastic and viscoplastic behaviour as a way of predicting performance and service life. Part two discusses techniques for modelling creep rupture and failure. The final part of the book discusses ways of testing and predicting long-term creep and fatigue in polymer matrix composites. With its distinguished editor and international team of contributors, Creep and Fatigue in Polymer Matrix Composites is a standard reference for all those researching and using polymer matrix composites in such areas as civil engineering. - Reviews the latest research in modelling and predicting creep and fatigue in polymer matrix composites - A specific focus on viscoelestic and viscoplastic modelling features the time-temperature-age superposition principle for predicting long-term response - Creep rupture and damage interaction is examined with particular focus on time-dependent failure criteria for lifetime prediction of polymer matrix composite structures illustrated using experimental cases
Applied Mechanics Reviews
Author:
Publisher:
ISBN:
Category : Mechanics, Applied
Languages : en
Pages : 568
Book Description
Publisher:
ISBN:
Category : Mechanics, Applied
Languages : en
Pages : 568
Book Description