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Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 404
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Book Description
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 404
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Book Description
Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 290
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Book Description
Author: James E. Morris
Publisher: Springer Science & Business Media
ISBN: 0387473262
Category : Technology & Engineering
Languages : en
Pages : 553
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Book Description
This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Author: Electrochemical Society. Meeting
Publisher: The Electrochemical Society
ISBN: 9781566774123
Category : Technology & Engineering
Languages : en
Pages : 332
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Book Description
Author: Ephraim Suhir
Publisher: Springer Science & Business Media
ISBN: 0387329897
Category : Technology & Engineering
Languages : en
Pages : 1471
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Book Description
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Author:
Publisher:
ISBN:
Category : Electronic ceramics
Languages : en
Pages : 1046
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Book Description
Author: Cristina H. Amon
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 1148
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Book Description
Author:
Publisher: Information Gatekeepers Inc
ISBN:
Category :
Languages : en
Pages : 39
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Book Description
Author: Daniel Lu
Publisher: Springer Science & Business Media
ISBN: 0387782192
Category : Technology & Engineering
Languages : en
Pages : 723
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Book Description
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author: M.R. Oliver
Publisher: Springer Science & Business Media
ISBN: 3662062348
Category : Technology & Engineering
Languages : en
Pages : 432
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Book Description
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
