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Author: Mike Golio
Publisher: CRC Press
ISBN: 1420006703
Category : Technology & Engineering
Languages : en
Pages : 772
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Book Description
Highlighting the challenges RF and microwave circuit designers face in their day-to-day tasks, RF and Microwave Circuits, Measurements, and Modeling explores RF and microwave circuit designs in terms of performance and critical design specifications. The book discusses transmitters and receivers first in terms of functional circuit block and then examines each block individually. Separate articles consider fundamental amplifier issues, low noise amplifiers, power amplifiers for handset applications and high power, power amplifiers. Additional chapters cover other circuit functions including oscillators, mixers, modulators, phase locked loops, filters and multiplexers. New chapters discuss high-power PAs, bit error rate testing, and nonlinear modeling of heterojunction bipolar transistors, while other chapters feature new and updated material that reflects recent progress in such areas as high-volume testing, transmitters and receivers, and CAD tools. The unique behavior and requirements associated with RF and microwave systems establishes a need for unique and complex models and simulation tools. The required toolset for a microwave circuit designer includes unique device models, both 2D and 3D electromagnetic simulators, as well as frequency domain based small signal and large signal circuit and system simulators. This unique suite of tools requires a design procedure that is also distinctive. This book examines not only the distinct design tools of the microwave circuit designer, but also the design procedures that must be followed to use them effectively.
Author: Mike Golio
Publisher: CRC Press
ISBN: 1420006703
Category : Technology & Engineering
Languages : en
Pages : 772
Get Book Here
Book Description
Highlighting the challenges RF and microwave circuit designers face in their day-to-day tasks, RF and Microwave Circuits, Measurements, and Modeling explores RF and microwave circuit designs in terms of performance and critical design specifications. The book discusses transmitters and receivers first in terms of functional circuit block and then examines each block individually. Separate articles consider fundamental amplifier issues, low noise amplifiers, power amplifiers for handset applications and high power, power amplifiers. Additional chapters cover other circuit functions including oscillators, mixers, modulators, phase locked loops, filters and multiplexers. New chapters discuss high-power PAs, bit error rate testing, and nonlinear modeling of heterojunction bipolar transistors, while other chapters feature new and updated material that reflects recent progress in such areas as high-volume testing, transmitters and receivers, and CAD tools. The unique behavior and requirements associated with RF and microwave systems establishes a need for unique and complex models and simulation tools. The required toolset for a microwave circuit designer includes unique device models, both 2D and 3D electromagnetic simulators, as well as frequency domain based small signal and large signal circuit and system simulators. This unique suite of tools requires a design procedure that is also distinctive. This book examines not only the distinct design tools of the microwave circuit designer, but also the design procedures that must be followed to use them effectively.
Author: Mike Golio
Publisher: CRC Press
ISBN: 1420036769
Category : Technology & Engineering
Languages : en
Pages : 1377
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Book Description
The recent shift in focus from defense and government work to commercial wireless efforts has caused the job of the typical microwave engineer to change dramatically. The modern microwave and RF engineer is expected to know customer expectations, market trends, manufacturing technologies, and factory models to a degree that is unprecedented in the
Author: William R. Loerop
Publisher: World Scientific
ISBN: 9789812796820
Category : Technology & Engineering
Languages : en
Pages : 366
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Book Description
The last research frontier in high frequency electronics now lies in the so-called THz (or submillimeter-wave) regime between the traditional microwave and infrared domains. Significant scientific and technical challenges within the terahertz (THz) frequency regime have recently motivated an array of new research activities. During the last few years, major research programs have emerged that are focused on advancing the state of the art in THz frequency electronic technology and on investigating novel applications of THz frequency sensing. This book serves as a detailed reference for the new THz frequency technological advances that are emerging across a wide spectrum of sensing and technology areas. Contents: THz Technology: An Overview (P H Siegel); Two-Terminal Active Devices for Terahertz Sources (G I Haddad et al.); Multiplier and Harmonic Generator Technologies for Terahertz Applications (R M Weikle II et al.); Submicron InP-Based HBTs for Ultra-High Frequency Amplifiers (M Urteaga et al.); THz Generation by Photomixing in Ultrafast Photoconductors (E R Brown); Silicon-Germanium Quantum-Cascade Lasers (R W Kelsall & R A Soref); Plasma Wave Electronics (M S Shur & V Ryzhii); T-Ray Sensing and Imaging (S P Mickan & X-C Zhang); Multistatic Reflection Imaging with Terahertz Pulses (T D Dorney et al.). Readership: Undergraduates, graduate students, academics and researchers in electrical & electronic engineering.
Author: W. Ross Stone
Publisher: John Wiley & Sons
ISBN: 9780471268666
Category : Science
Languages : en
Pages : 1028
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Book Description
A triennial summation of the state of the art in radio science This book is the fourth in the modern series of triennial reviews prepared by the International Union of Radio Science to further communication and understanding of the status and future of radio science, both for those working in the field, and for those who want to know what is of current importance in this area. The International Union of Radio Science, URSI (Union Radio-Scientifique Internationale), has divided the subject of "Radio Science" according to the ten topics of the Scientific Commissions that make up URSI. This volume consists of thirty-eight original, peer-reviewed papers. Each paper provides a critical, in-depth review of–and, in many cases, tutorial on–advances and research that have been of significant importance within the area of interest of the Commissions during the past three to four years. Among the topics covered are: Electromagnetic metrology Fields and waves Signals and systems Electronics and photonics Electromagnetic noise and interference Wave propagation and remote sensing Ionospheric radio and propagation Waves in plasmas Radio astronomy Electromagnetics in biology and medicine With an included CD-ROM of the full book text, allowing the user to do full-text searching of all the papers, the Review of Radio Science: 1999—2002 is a resource of vital importance to anyone working in, or with an interest in, radio science.
Author: Ingo Wolff
Publisher: John Wiley & Sons
ISBN: 0471121010
Category : Technology & Engineering
Languages : en
Pages : 558
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Book Description
The tools and techniques to fully leverage coplanar technology Coplanar Microwave Integrated Circuits sets forth the theoretical underpinnings of coplanar waveguides and thoroughly examines the various coplanar components such as discontinuities, lumped elements, resonators, couplers, and filters, which are essential for microwave integrated circuit design. Based on the results of his own research findings, the author effectively demonstrates the many advantages of coplanar waveguide technology for modern circuit design. Following a brief introductory chapter, the text thoroughly covers the material needed for successful design and realization of coplanar microwave circuits, including: * Fundamental transmission properties of coplanar waveguides using a full wave analysis * Detailed analysis of most discontinuities used in coplanar waveguide design * Lumped elements in coplanar technology that are needed in circuit design * Development of software for coplanar circuit design, including a CD-ROM containing a test version of the software for modeling coplanar circuit components and circuits * Application of derived results to build more complex components such as lumped element filters, waveguide filters, millimeter wave filters, end-coupled waveguide structures, waveguide couplers, and Wilkinson couplers for different frequency ranges in coplanar technology The final chapter focuses on special coplanar microwave integrated circuits that have been developed using the software presented in the text. The book concludes with a thought-provoking discussion of the advantages and disadvantages of the coplanar technique. Extensive use of figures and tables helps readers easily digest and visualize complex concepts. A bibliography is included at the end of each chapter for further study and research. Coplanar Microwave Integrated Circuits is recommended for graduate students and engineers in RF microwaves who want to reap all the advantages and possibilities of coplanar technology.
Author: Teresa M. Braun
Publisher: John Wiley & Sons
ISBN: 0470540842
Category : Science
Languages : en
Pages : 400
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Book Description
This is the first book primarily about the satellite payload of satellite communications systems. It represents a unique combination of practical systems engineering and communications theory. It tells about the satellites in geostationary and low-earth orbits today, both the so-called bent-pipe payloads and the processing payloads. The on-orbit environment, mitigated by the spacecraft bus, is described. The payload units (e.g. antennas and amplifiers), as well as payload-integration elements (e.g. waveguide and switches) are discussed in regard to how they work, what they do to the signal, their technology, environment sensitivity, and specifications. At a higher level are discussions on the payload as an entity: architecture including redundancy; specifications--what they mean, how they relate to unit specifications, and how to verify; and specification-compliance analysis (“budgets”) with uncertainty. Aspects of probability theory handy for calculating and using uncertainty and variation are presented. The highest-level discussions, on the end-to-end communications system, start with a practical introduction to physical-layer communications theory. Atmospheric effects and interference on the communications link are described. A chapter gives an example of optimizing a multibeam payload via probabilistic analysis. Finally, practical tips on system simulation and emulation are provided. The carrier frequencies treated are 1 GHz and above. Familiarity with Fourier analysis will enhance understanding of some topics. References are provided throughout the book for readers who want to dig deeper. Payload systems engineers, payload proposal writers, satellite-communications systems designers and analysts, and satellite customers will find that the book cuts their learning time. Spacecraft-bus systems engineers, payload unit engineers, and spacecraft operators will gain insight into the overall system. Students in systems engineering, microwave engineering, communications theory, probability theory, and communications simulation and modelling will find examples to supplement theoretical texts.
Author: Rob A. Rutenbar
Publisher: John Wiley & Sons
ISBN: 047122782X
Category : Technology & Engineering
Languages : en
Pages : 773
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Book Description
The tools and techniques you need to break the analog design bottleneck! Ten years ago, analog seemed to be a dead-end technology. Today, System-on-Chip (SoC) designs are increasingly mixed-signal designs. With the advent of application-specific integrated circuits (ASIC) technologies that can integrate both analog and digital functions on a single chip, analog has become more crucial than ever to the design process. Today, designers are moving beyond hand-crafted, one-transistor-at-a-time methods. They are using new circuit and physical synthesis tools to design practical analog circuits; new modeling and analysis tools to allow rapid exploration of system level alternatives; and new simulation tools to provide accurate answers for analog circuit behaviors and interactions that were considered impossible to handle only a few years ago. To give circuit designers and CAD professionals a better understanding of the history and the current state of the art in the field, this volume collects in one place the essential set of analog CAD papers that form the foundation of today's new analog design automation tools. Areas covered are: * Analog synthesis * Symbolic analysis * Analog layout * Analog modeling and analysis * Specialized analog simulation * Circuit centering and yield optimization * Circuit testing Computer-Aided Design of Analog Integrated Circuits and Systems is the cutting-edge reference that will be an invaluable resource for every semiconductor circuit designer and CAD professional who hopes to break the analog design bottleneck.
Author: Fengyuan Sun
Publisher: Editions Publibook
ISBN: 2753903298
Category :
Languages : en
Pages : 178
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Book Description
The proposal of doubling the number of transistors on an IC chip (with minimum costs and subtle innovations) every 24 months by Gordon Moore in 1965 (the so-called called Moore's law) has been the most powerful driver for the emphasis of the microelectronics industry in the past 50 years. This law enhances lithography scaling and integration, in 2D, of all functions on a single chip, increasingly through system-on-chip (SOC). On the other hand, the integration of all these functions can be achieved through 3D integrations . Generally speaking, 3D integration consists of 3D IC packaging, 3D IC integration, and 3D Si integration. They are different and mostly the TSV (through-silicon via) separates 3D IC packaging from 3D IC/Si integrations since the latter two uses TSVs, but 3D IC packaging does not. TSV (with a new concept that every chip or interposer could have two surfaces with circuits) is the heart of 3D IC/Si integrations. Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. 3D Si integration is the right way to go and compete with Moore's law (more than Moore versus more Moore). However, it is still a long way to go. In this book, Fengyuan SUN proposes new substrate network extraction techniques. Using this latter, the substrate coupling and loss in IC's can be analyzed. He implements some Green/TLM (Transmission Line Matrix) algorithms in MATLAB. It permits to extract impedances between any number of embedded contacts or/and TSVS. He does investigate models of high aspect ratio TSV, on both analytical and numerical methods electromagnetic simulations. This model enables to extract substrate and TSV impedance, S parameters and parasitic elements, considering the variable resistivity of the substrate. It is full compatible with SPICE-like solvers and should allow an investigation in depth of TSV impact on circuit performance.
Author:
Publisher: Academic Press
ISBN: 0123946360
Category : Technology & Engineering
Languages : en
Pages : 521
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Book Description
Advances in Imaging and Electron Physics merges two long-running serials--Advances in Electronics and Electron Physics and Advances in Optical and Electron Microscopy. This series features extended articles on the physics of electron devices (especially semiconductor devices), particle optics at high and low energies, microlithography, image science and digital image processing, electromagnetic wave propagation, electron microscopy, and the computing methods used in all these domains. - Contributions from leading authorities - Informs and updates on all the latest developments in the field
Author: R.E. Miles
Publisher: Springer Science & Business Media
ISBN: 9401008248
Category : Technology & Engineering
Languages : en
Pages : 340
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Book Description
Terahertz technology has moved on from being a useful but expensive circuit technique, applied largely in astronomy and space science, to become a subject in its own right, with important applications - terahertz imaging in particular. Indeed, the driving force in terahertz technology is currently imaging and spectroscopy. We now have the means to obtain images and chemical information in this frequency band. The images reproduced in this volume are striking and, not surprisingly, the clinical and analytical uses are the subject of intense activity. There is still, however, no complete range of active THz electronic components, but an encouraging conclusion of the book is that THz electronics will become necessary in communications systems in the foreseeable future. Terahertz technology has come of age, and the future lies open to new, exciting science and vital applications.
