Author: United States. National Aeronautics and Space Administration
Publisher:
ISBN:
Category :
Languages : en
Pages : 180

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Author:
Publisher:
ISBN:
Category : Industrial engineering
Languages : en
Pages : 180

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Author: Jonathan Swingler
Publisher: Momentum Press
ISBN: 1606504681
Category : Technology & Engineering
Languages : en
Pages : 200

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Degradation is apparent in all things and is fundamental to both manufactured and natural objects. It is often described by the second law of thermodynamics, where entropy, a measure of disorder, tends to increase with time in a closed system. Things age! This concise reference work brings together experts and key players engaged in the physics of degradation to present the background science, current thinking and developments in understanding, and gives a detailed account of emerging issues across a selection of engineering applications. The work has been put together to equip the upper level undergraduate student, postgraduate student, as well as the professional engineer and scientist, in the importance of physics of degradation. The aim of The Physics of Degradation in Engineered Materials and Devices is to bridge the gap between published textbooks on the fundamental science of degradation phenomena and published research on the engineering science of actual fabricated materials and devices. A history of the observation and understanding of physics of degradation is presented and the fundamentals and principles of thermodynamics and entropy are extensively discussed. This is the focus of this book, with an extended chapter by Alec Feinberg on equilibrium thermodynamic damage and non-equilibrium thermodynamic damage. It concludes with two particular technologies to give examples of areas of application.

Author: B. Dhillon
Publisher: Routledge
ISBN: 1136773851
Category : Business & Economics
Languages : en
Pages : 376

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Product acquisition involves an examination of the support cost of major equipment over its total life years. Depending on the type of equipment, support costs may range from 10 to 100 times the cost of acquisition. "Life Cycle Costing: Techniques, Models and Applications" offers a comprehensive approach to the entire field, and treats it in such a

Author: B.S. Dhillon
Publisher: CRC Press
ISBN: 143985890X
Category : Technology & Engineering
Languages : en
Pages : 166

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Book Description
Cradle-to-grave analyses are becoming the norm, as an increasing amount of corporations and government agencies are basing their procurement decisions not only on initial costs but also on life cycle costs. And while life cycle costing has been covered in journals and conference proceedings, few, if any, books have gathered this information into an

Author: Yoshio Nishi
Publisher: CRC Press
ISBN: 1351829823
Category : Technology & Engineering
Languages : en
Pages : 3276

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Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

Author: United States. Department of Defense
Publisher:
ISBN:
Category : Electric discharges
Languages : en
Pages : 168

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Author: Alan J. Perlis
Publisher: MIT Press
ISBN: 9780262160834
Category : Computers
Languages : en
Pages : 424

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Software Metrics is the first book to survey its subject, measuring its present extent, describing its characteristic features, and indicating directions of potential expansion.

Author: Franklin Richard Nash, Ph.D.
Publisher: CRC Press
ISBN: 1315353849
Category : Business & Economics
Languages : en
Pages : 713

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Book Description
This book provides engineers and scientists with a single source introduction to the concepts, models, and case studies for making credible reliability assessments. It satisfies the need for thorough discussions of several fundamental subjects. Section I contains a comprehensive overview of assessing and assuring reliability that is followed by discussions of: • Concept of randomness and its relationship to chaos • Uses and limitations of the binomial and Poisson distributions • Relationship of the chi-square method and Poisson curves • Derivations and applications of the exponential, Weibull, and lognormal models • Examination of the human mortality bathtub curve as a template for components Section II introduces the case study modeling of failure data and is followed by analyses of: • 5 sets of ideal Weibull, lognormal, and normal failure data • 83 sets of actual (real) failure data The intent of the modeling was to find the best descriptions of the failures using statistical life models, principally the Weibull, lognormal, and normal models, for characterizing the failure probability distributions of the times-, cycles-, and miles-to-failure during laboratory or field testing. The statistical model providing the preferred characterization was determined empirically by choosing the two-parameter model that gave the best straight-line fit in the failure probability plots using a combination of visual inspection and three statistical goodness-of-fit (GoF) tests. This book offers practical insight in dealing with single item reliability and illustrates the use of reliability methods to solve industry problems.

Author: P. R. Abelkis
Publisher: ASTM International
ISBN: 9780803107144
Category : Technology & Engineering
Languages : en
Pages : 500

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Book Description