16th DASC, AIAA/IEEE Digital Avionics Systems Conference : Reflections to the Future PDF Download
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Author: IEEE Aerospace and Electronic Systems Society
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN: 9780780341500
Category : Air traffic control
Languages : en
Pages : 900
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Author: IEEE Aerospace and Electronic Systems Society
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN: 9780780341500
Category : Air traffic control
Languages : en
Pages : 900
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Book Description
Author: Rajesh Vanchipura
Publisher: CRC Press
ISBN: 1351124129
Category : Mathematics
Languages : en
Pages : 1786
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Book Description
The International Conference on Emerging Trends in Engineering, Science and Technology (ICETEST) was held at the Government Engineering College, Thrissur, Kerala, India, from 18th to 20th January 2018, with the theme, “Society, Energy and Environment”, covering related topics in the areas of Civil Engineering, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Electronics & Communication Engineering, Computer Science and Architecture. Conflict between energy and environment has been of global significance in recent years. Academic research needs to support the industry and society through socially and environmentally sustainable outcomes. ICETEST 2018 was organized with this specific objective. The conference provided a platform for researchers from different domains, to discuss and disseminate their findings. Outstanding speakers, faculties, and scholars from different parts of the world presented their research outcomes in modern technologies using sustainable technologies.
Author: Michael Harrison
Publisher: Springer Nature
ISBN: 3031592352
Category :
Languages : en
Pages : 233
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Author: A.H.C. Ng
Publisher: IOS Press
ISBN: 1643682695
Category : Technology & Engineering
Languages : en
Pages : 874
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Book Description
The realization of a successful product requires collaboration between developers and producers, taking account of stakeholder value, reinforcing the contribution of industry to society and enhancing the wellbeing of workers while respecting planetary boundaries. Founded in 2006, the Swedish Production Academy (SPA) aims to drive and develop production research and education and to increase cooperation within the production area. This book presents the proceedings of the 10th Swedish Production Symposium (SPS2022), held in Skövde, Sweden, from 26-29 April 2022. The overall theme of the symposium was ‘Industry 5.0 Transformation – Towards a Sustainable, Human-Centric, and Resilient Production’. Since its inception in 2007, the purpose of SPS has been to facilitate an event at which members and interested participants from industry and academia can meet to exchange ideas. The 69 papers accepted for presentation here are grouped into ten sections: resource-efficient production; flexible production; humans in the production system; circular production systems and maintenance; integrated product and production development; industrial optimization and decision-making; cyber-physical production systems and digital twins; innovative production processes and additive manufacturing; smart and resilient supply chains; and linking research and education. Also included are three sections covering the Special Sessions at SPS2022: artificial intelligence and industrial analytics in industry 4.0; development of resilient and sustainable production systems; and boundary crossing and boundary objects in product and production development. The book will be of interest to all those involved in the development and production of future products.
Author: Masayoshi Esashi
Publisher: John Wiley & Sons
ISBN: 3527823255
Category : Technology & Engineering
Languages : en
Pages : 528
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Book Description
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Author: Rimvydas Skyrius
Publisher: Springer Nature
ISBN: 3030670325
Category : Computers
Languages : en
Pages : 281
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Book Description
This book examines the managerial dimensions of business intelligence (BI) systems. It develops a set of guidelines for value creation by implementing business intelligence systems and technologies. In particular the book looks at BI as a process – driven by a mix of human and technological capabilities – to serve complex information needs in building insights and providing aid in decision making. After an introduction to the key concepts of BI and neighboring areas of information processing, the book looks at the complexity and multidimensionality of BI. It tackles both data integration and information integration issues. Bodies of knowledge and other widely accepted collections of experience are presented and turned into lessons learned. Following a straightforward introduction to the processes and technologies of BI the book embarks on BI maturity and agility, the components, drivers and inhibitors of BI culture and soft BI factors like attention, sense and trust. Eventually the book attempts to provide a holistic view on business intelligence, possible structures and tradeoffs and embarks to provide an outlook on possible developments in BI and analytics.
Author: Ji Su Park
Publisher: Springer Nature
ISBN: 9819982111
Category : Computers
Languages : en
Pages : 325
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Book Description
This book constitutes the refereed proceedings of the International Conference on Parallel and Distributed Computing, Applications and Technologies (PDCAT) which was held in Jeju, Korea in August, 2023. The papers of this volume are organized in topical sections on wired and wireless communication systems, high dimensional data representation and processing, networks and information security, computing techniques for efficient networks design, electronic circuits for communication systems.
Author: British Library. Document Supply Centre
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 890
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Author:
Publisher:
ISBN:
Category : Avionics
Languages : en
Pages : 964
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Author:
Publisher:
ISBN:
Category : Air traffic control
Languages : en
Pages : 896
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Book Description
