Author: R.A. Levy
Publisher: Springer Science & Business Media
ISBN: 9400909179
Category : Technology & Engineering
Languages : en
Pages : 992
Book Description
The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS!) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS!.
Microelectronic Materials and Processes
Author: R.A. Levy
Publisher: Springer Science & Business Media
ISBN: 9400909179
Category : Technology & Engineering
Languages : en
Pages : 992
Book Description
The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS!) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS!.
Publisher: Springer Science & Business Media
ISBN: 9400909179
Category : Technology & Engineering
Languages : en
Pages : 992
Book Description
The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS!) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS!.
Semiconductor Measurement Technology
Author: United States. National Bureau of Standards
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 116
Book Description
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 116
Book Description
ULSI Science and Technology, 1989
Author: C. M. Osburn
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 804
Book Description
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 804
Book Description
Proceedings of the Symposium on Multilevel Metallization, Interconnection, and Contact Technologies
Author: L. B. Rothman
Publisher:
ISBN:
Category : Electronics
Languages : en
Pages : 288
Book Description
Publisher:
ISBN:
Category : Electronics
Languages : en
Pages : 288
Book Description
Proceedings of the Third International Symposium on Defects in Silicon
Author: Takao Abe
Publisher: The Electrochemical Society
ISBN: 9781566772235
Category : Science
Languages : en
Pages : 548
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566772235
Category : Science
Languages : en
Pages : 548
Book Description
Semiconductor Measurement Technology
Author: National Institute of Standards and Technology (U.S.)
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 140
Book Description
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 140
Book Description
Proceedings of the Ninth International Conference on Chemical Vapor Deposition, 1984
Author: McD. Robinson
Publisher:
ISBN:
Category : Vapor-plating
Languages : en
Pages : 828
Book Description
Publisher:
ISBN:
Category : Vapor-plating
Languages : en
Pages : 828
Book Description
Dry Etching for Microelectronics
Author: R.A. Powell
Publisher: Elsevier
ISBN: 0080983588
Category : Technology & Engineering
Languages : en
Pages : 312
Book Description
This volume collects together for the first time a series of in-depth, critical reviews of important topics in dry etching, such as dry processing of III-V compound semiconductors, dry etching of refractory metal silicides and dry etching aluminium and aluminium alloys. This topical format provides the reader with more specialised information and references than found in a general review article. In addition, it presents a broad perspective which would otherwise have to be gained by reading a large number of individual research papers. An additional important and unique feature of this book is the inclusion of an extensive literature review of dry processing, compiled by search of computerized data bases. A subject index allows ready access to the key points raised in each of the chapters.
Publisher: Elsevier
ISBN: 0080983588
Category : Technology & Engineering
Languages : en
Pages : 312
Book Description
This volume collects together for the first time a series of in-depth, critical reviews of important topics in dry etching, such as dry processing of III-V compound semiconductors, dry etching of refractory metal silicides and dry etching aluminium and aluminium alloys. This topical format provides the reader with more specialised information and references than found in a general review article. In addition, it presents a broad perspective which would otherwise have to be gained by reading a large number of individual research papers. An additional important and unique feature of this book is the inclusion of an extensive literature review of dry processing, compiled by search of computerized data bases. A subject index allows ready access to the key points raised in each of the chapters.
Microelectronic Materials
Author: C.R.M. Grovenor
Publisher: Routledge
ISBN: 1351431544
Category : Science
Languages : en
Pages : 557
Book Description
This practical book shows how an understanding of structure, thermodynamics, and electrical properties can explain some of the choices of materials used in microelectronics, and can assist in the design of new materials for specific applications. It emphasizes the importance of the phase chemistry of semiconductor and metal systems for ensuring the long-term stability of new devices. The book discusses single-crystal and polycrystalline silicon, aluminium- and gold-based metallisation schemes, packaging semiconductor devices, failure analysis, and the suitability of various materials for optoelectronic devices and solar cells. It has been designed for senior undergraduates, graduates, and researchers in physics, electronic engineering, and materials science.
Publisher: Routledge
ISBN: 1351431544
Category : Science
Languages : en
Pages : 557
Book Description
This practical book shows how an understanding of structure, thermodynamics, and electrical properties can explain some of the choices of materials used in microelectronics, and can assist in the design of new materials for specific applications. It emphasizes the importance of the phase chemistry of semiconductor and metal systems for ensuring the long-term stability of new devices. The book discusses single-crystal and polycrystalline silicon, aluminium- and gold-based metallisation schemes, packaging semiconductor devices, failure analysis, and the suitability of various materials for optoelectronic devices and solar cells. It has been designed for senior undergraduates, graduates, and researchers in physics, electronic engineering, and materials science.
Proceedings
Author:
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 454
Book Description
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 454
Book Description