Variation Tolerant On-Chip Interconnects PDF Download
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Author: Ethiopia Enideg Nigussie
Publisher: Springer Science & Business Media
ISBN: 1461401313
Category : Technology & Engineering
Languages : en
Pages : 177
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Book Description
This book presents design techniques, analysis and implementation of high performance and power efficient, variation tolerant on-chip interconnects. Given the design paradigm shift to multi-core, interconnect-centric designs and the increase in sources of variability and their impact in sub-100nm technologies, this book will be an invaluable reference for anyone concerned with the design of next generation, high-performance electronics systems.
Author: Ethiopia Enideg Nigussie
Publisher: Springer Science & Business Media
ISBN: 1461401313
Category : Technology & Engineering
Languages : en
Pages : 177
Get Book Here
Book Description
This book presents design techniques, analysis and implementation of high performance and power efficient, variation tolerant on-chip interconnects. Given the design paradigm shift to multi-core, interconnect-centric designs and the increase in sources of variability and their impact in sub-100nm technologies, this book will be an invaluable reference for anyone concerned with the design of next generation, high-performance electronics systems.
Author: Swarup Bhunia
Publisher: Springer Science & Business Media
ISBN: 1441974180
Category : Technology & Engineering
Languages : en
Pages : 444
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Book Description
Design considerations for low-power operations and robustness with respect to variations typically impose contradictory requirements. Low-power design techniques such as voltage scaling, dual-threshold assignment and gate sizing can have large negative impact on parametric yield under process variations. This book focuses on circuit/architectural design techniques for achieving low power operation under parameter variations. We consider both logic and memory design aspects and cover modeling and analysis, as well as design methodology to achieve simultaneously low power and variation tolerance, while minimizing design overhead. This book will discuss current industrial practices and emerging challenges at future technology nodes.
Author: E.H. D'Hollander
Publisher: IOS Press
ISBN: 1614993246
Category : Computers
Languages : en
Pages : 228
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Book Description
The US, Europe, Japan and China are racing to develop the next generation of supercomputers – exascale machines capable of 10 to the 18th power calculations a second – by 2020. But the barriers are daunting: the challenge is to change the paradigm of high-performance computing. The 2012 biennial high performance workshop, held in Cetraro, Italy in June 2012, focused on the challenges facing the computing research community to reach exascale performance in the next decade. This book presents papers from this workshop, arranged into four major topics: energy, scalability, new architectural concepts and programming of heterogeneous computing systems. Chapter 1 introduces the status of present supercomputers, which are still about two orders of magnitude separated from the exascale mark. Chapter 2 examines energy demands, a major limiting factor of today's fastest supercomputers; the quantum leap in performance required for exascale computing will require a shift in architectures and technology. In Chapter 3, scalable computer paradigms for dense linear algebra on massive heterogeneous systems are presented, and Chapter 4 discusses architectural concepts. Finally, Chapter 5 addresses the programming of heterogeneous systems. This book will be of interest to all those wishing to understand how the development of modern supercomputers is set to advance in the next decade.
Author: Mohamed Abu Rahma
Publisher: Springer Science & Business Media
ISBN: 1461417481
Category : Technology & Engineering
Languages : en
Pages : 176
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Book Description
Variability is one of the most challenging obstacles for IC design in the nanometer regime. In nanometer technologies, SRAM show an increased sensitivity to process variations due to low-voltage operation requirements, which are aggravated by the strong demand for lower power consumption and cost, while achieving higher performance and density. With the drastic increase in memory densities, lower supply voltages, and higher variations, statistical simulation methodologies become imperative to estimate memory yield and optimize performance and power. This book is an invaluable reference on robust SRAM circuits and statistical design methodologies for researchers and practicing engineers in the field of memory design. It combines state of the art circuit techniques and statistical methodologies to optimize SRAM performance and yield in nanometer technologies. Provides comprehensive review of state-of-the-art, variation-tolerant SRAM circuit techniques; Discusses Impact of device related process variations and how they affect circuit and system performance, from a design point of view; Helps designers optimize memory yield, with practical statistical design methodologies and yield estimation techniques.
Author: Gabriela Nicolescu
Publisher: CRC Press
ISBN: 1000793370
Category : Technology & Engineering
Languages : en
Pages : 453
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Book Description
In recent years, there has been a considerable amount of effort, both in industry and academia, focusing on the design, implementation, performance analysis, evaluation and prediction of silicon photonic interconnects for inter- and intra-chip communication, paving the way for the design and dimensioning of the next and future generation of high-performance computing systems. Photonic Interconnects for Computing Systems provides a comprehensive overview of the current state-of-the-art technology and research achievements in employing silicon photonics for interconnection networks and high-performance computing, summarizing main opportunities and some challenges. The majority of the chapters were collected from presentations made at the International Workshop on Optical/Photonic Interconnects for Computing Systems (OPTICS) held over the past two years. The workshop invites internationally recognized speakers on the range of topics relevant to silicon photonics and computing systems. Technical topics discussed in the book include:Design and Implementation of Chip-Scale Photonic Interconnects;Developing Design Automation Solutions for Chip-Scale Photonic Interconnects;Design Space Exploration in Chip-Scale Photonic Interconnects;Thermal Analysis and Modeling in Photonic Interconnects;Design for Reliability;Fabrication Non-Uniformity in Photonic Interconnects;Photonic Interconnects for Computing Systems presents a compilation of outstanding contributions from leading research groups in the field. It presents a comprehensive overview of the design, advantages, challenges, and requirements of photonic interconnects for computing systems. The selected contributions present important discussions and approaches related to the design and development of novel photonic interconnect architectures, as well as various design solutions to improve the performance of such systems while considering different challenges. The book is ideal for personnel in computer/photonic industries as well as academic staff and master/graduate students in computer science and engineering, electronic engineering, electrical engineering and photonics.
Author: Aida Todri-Sanial
Publisher: CRC Press
ISBN: 1498710379
Category : Technology & Engineering
Languages : en
Pages : 416
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Book Description
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Author: Cristina Silvano
Publisher: Springer Science & Business Media
ISBN: 144196911X
Category : Technology & Engineering
Languages : en
Pages : 301
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Book Description
In recent years, both Networks-on-Chip, as an architectural solution for high-speed interconnect, and power consumption, as a key design constraint, have continued to gain interest in the design and research communities. This book offers a single-source reference to some of the most important design techniques proposed in the context of low-power design for networks-on-chip architectures.
Author: Vladimir Robles-Bykbaev
Publisher: Springer Nature
ISBN: 3031243277
Category : Technology & Engineering
Languages : en
Pages : 452
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Book Description
This book is oriented towards applications and perspectives on future developments connected to intelligent technologies. Specifying topics connected to industry, mobility, telecommunications, biomechanics, among others. The innovative character of the text allows relating technical experiences and advances that seek to improve the implication of new technologies at local, national and regional levels, demonstrating the advances towards the different fields of knowledge in the area of engineering. The potential readers of this work would be master and doctorate students, professors–researchers in the field of new technologies and companies connected to the development of engineering. The texts serve to illustrate new procedures, new cases and new techniques for the optimization of systems that optimize social progress.
Author: Ranjith Kumar
Publisher:
ISBN:
Category :
Languages : en
Pages : 246
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Book Description
Author: Umit Y. Ogras
Publisher: Springer Science & Business Media
ISBN: 9400739583
Category : Technology & Engineering
Languages : en
Pages : 182
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Book Description
Traditionally, design space exploration for Systems-on-Chip (SoCs) has focused on the computational aspects of the problem at hand. However, as the number of components on a single chip and their performance continue to increase, the communication architecture plays a major role in the area, performance and energy consumption of the overall system. As a result, a shift from computation-based to communication-based design becomes mandatory. Towards this end, network-on-chip (NoC) communication architectures have emerged recently as a promising alternative to classical bus and point-to-point communication architectures. In this dissertation, we study outstanding research problems related to modeling, analysis and optimization of NoC communication architectures. More precisely, we present novel design methodologies, software tools and FPGA prototypes to aid the design of application-specific NoCs.
