Author:
Publisher:
ISBN:
Category : Optical interconnects
Languages : en
Pages : 0
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This report describes the results of experiments performed in various areas of material and component technology required for the development of multiple gigabit per second fiber based optical interconnect and optical communication links. First, we will summarize the development of a chromium-doped:YAG (Cr(4+): YAG) solid state laser for use in the 1500 nm transmission window of optical fiber. The Cr(4+): YAG laser produces tunable femtosecond pulses from 1488 to 1535 nm with average TEM sub 00 output powers ranging from 40 to 80 mW. The laser is mode locked using a novel saturable absorber mirror structure. The laser is also tunable from 1450 to 1574 nm in the continuous wave mode with an average TEM sub 00 output power of 600 mW at 1487 nm. Next, we will describe the synchronization of a passively mode locked erbium-doped fiber laser to an actively mode-locked fiber ring laser. Stable synchronization is obtained at injection powers of 1.5 mW. Finally, we report on the investigation of multiple quantum well saturable absorbers used to initiate mode-locking of standing wave linear cavity erbium-doped fiber lasers.
Author: Vipul Dutt Badoni
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 116
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Book Description
Author: Ray T. Chen
Publisher: Springer Nature
ISBN: 3031025539
Category : Technology & Engineering
Languages : en
Pages : 91
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Book Description
This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing.
Author: A. Miller
Publisher: CRC Press
ISBN: 9781420033212
Category : Science
Languages : en
Pages : 382
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Book Description
Ultrafast photonics has become an interdisciplinary topic of high international research interest because of the spectacular development of compact and efficient lasers producing optical pulses with durations in the femtosecond time domain. Present day long-haul telecommunications systems are almost entirely based on the transmission of short burst
Author: Tolga Tekin
Publisher: Woodhead Publishing
ISBN: 008100513X
Category : Computers
Languages : en
Pages : 431
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Book Description
Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers. - Summarizes the state-of-the-art in this emerging field - Presents a comprehensive review of all the key aspects of deploying optical interconnects in data centers, from materials and components, to circuit boards and methods for integration - Contains contributions that are drawn from leading international experts on the topic
Author: Philippe Lalanne
Publisher: Springer Science & Business Media
ISBN: 3642492649
Category : Computers
Languages : en
Pages : 420
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Book Description
This volume is a monograph on parallel optical interconnects. It presents not only the state of-the-art in this domain but also the necessary physical and chemical background. It also provides a discussion of the potential for future devices. Both experts and newcomers to the area will appreciate the authors' proficiency in providing the complete picture of this rapidly growing field. Optical interconnects are already established in telecommunications and should eventually find their way being applied to chip and even gate level connections in integrated systems. The inspiring environment of the Basic Research Working Group on Optical Information Technology WOIT (3199), together with the excellent and complementary skills of its participants, make this contribution highly worthwhile. G. Metakides Table of contents 1 Perspectives for parallel optical interconnects: introduction . . . . . . . . . . . . . . . . . . . . . . . . . l Pierre Chavel and Philippe lAlanne 1. 1 Optical Interconnects and ESPRIT BRA WOIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1. 2 What are optical interconnects? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1. 3 Optical interconnects: how ? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1. 3. 1 Passive devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1. 3. 2 Active devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1. 3. 3 Schemes for parallel optical interconnects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1. 3. 4 Limits of optical interconnects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1. 4 Optical interconnects: why ? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Acknowledgetnents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 First Section: Components Part 1. 1 Passive interconnect components 2 Free space interconnects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Philippe Lalanne and Pierre ChaveZ 2. 1 Introduction: 3D optical interconnects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2. 2 Optical free space channels and their implementations . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2. 2. 1 Diffraction and degrees of freedom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2. 2. 2 Two Qasic interconnect setups . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Author: Shigeru Kawai
Publisher: CRC Press
ISBN: 1420027778
Category : Computers
Languages : en
Pages : 480
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Book Description
As we reach the data transmission limits of copper wire and communications experts seek to bring the speed of long-haul fiber optics networks closer to access points, optical interconnects promise to provide efficient, high-speed data transmission for the next generation of networks and systems. They offer higher bit-rates, virtually no crosstalk, lower demands on power requirements and thermal management, and the possibility of two-dimensional channel arrays for chip-to-chip communication. The Handbook of Optical Interconnects introduces the systems and devices that will bring the speed and quality of optical transmission closer to the circuit board. Contributed by active experts, most from leading technology companies in the US and Japan, this outstanding handbook details various low-cost and small-size configurations, illustrates the discussion with more than 300 figures, and offers a look at the applications and future of this exciting and rapidly growing field. The book includes a detailed introduction to vertical cavity surface-emitting lasers (VCSELs); the use of optical interconnects in metropolitan, local-area, and access networks through FTTP (FTTH); and Jisso technologies, which are critical for developing low-cost, small-size modules. Driving down the size and cost of optical interconnects is vital for integrating these technologies into the network and onto microprocessors, and the Handbook of Optical Interconnects provides the knowledge and tools necessary to accomplish these goals.
Author: Lorenzo Pavesi
Publisher: Springer
ISBN: 3540289127
Category : Science
Languages : en
Pages : 397
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Book Description
Optical Interconnects provides a fascinating picture of the state of the art in optical interconnects and a perspective on what can be expected in the near future. It is composed of selected reviews authored by world leaders in the field, and these reviews are written from either an academic or industrial viewpoint. An in-depth discussion of the path towards fully-integrated optical interconnects in microelectronics is presented. This book will be useful not only to physicists, chemists, materials scientists, and engineers but also to graduate students who are interested in the fields of microelectronics and optoelectronics.
Author: Edik U. Rafailov
Publisher: John Wiley & Sons
ISBN: 3527634495
Category : Science
Languages : en
Pages : 243
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Book Description
In this monograph, the authors address the physics and engineering together with the latest achievements of efficient and compact ultrafast lasers based on novel quantum-dot structures and devices. Their approach encompasses a broad range of laser systems, while taking into consideration not only the physical and experimental aspects but also the much needed modeling tools, thus providing a holistic understanding of this hot topic.
Author: Jason Orcutt
Publisher: Elsevier Inc. Chapters
ISBN: 0128060662
Category : Technology & Engineering
Languages : en
Pages : 59
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Book Description
This chapter introduces optical interconnects as a possible solution to the emerging performance wall in high-density supercomputer applications, arising from limited bandwidth and density of on-chip interconnects and chip-to-chip (processor-to-memory) electrical interfaces. The chapter focuses on the translation of system and link level performance metrics to photonic component requirements. The topics to be developed include the network topology, photonic link components, circuit and system design for photonic links.
