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Author: Amr Baher Darwish
Publisher: Springer
ISBN: 3030248275
Category : Technology & Engineering
Languages : en
Pages : 123
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Book Description
This book describes for readers a methodology for dynamic power estimation, using Transaction Level Modeling (TLM). The methodology exploits the existing tools for RTL simulation, design synthesis and SystemC prototyping to provide fast and accurate power estimation using Transaction Level Power Modeling (TLPM). Readers will benefit from this innovative way of evaluating power on a high level of abstraction, at an early stage of the product life cycle, decreasing the number of the expensive design iterations.
Author: Amr Baher Darwish
Publisher: Springer
ISBN: 3030248275
Category : Technology & Engineering
Languages : en
Pages : 123
Get Book Here
Book Description
This book describes for readers a methodology for dynamic power estimation, using Transaction Level Modeling (TLM). The methodology exploits the existing tools for RTL simulation, design synthesis and SystemC prototyping to provide fast and accurate power estimation using Transaction Level Power Modeling (TLPM). Readers will benefit from this innovative way of evaluating power on a high level of abstraction, at an early stage of the product life cycle, decreasing the number of the expensive design iterations.
Author: Jose L. Ayala
Publisher: Springer Science & Business Media
ISBN: 3642241530
Category : Computers
Languages : en
Pages : 362
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Book Description
This book constitutes the refereed proceedings of the 21st International Conference on Integrated Circuit and System Design, PATMOS 2011, held in Madrid, Spain, in September 2011. The 34 revised full papers presented were carefully reviewed and selected from numerous submissions. The paper feature emerging challenges in methodologies and tools for the design of upcoming generations of integrated circuits and systems and focus especially on timing, performance and power consumption as well as architectural aspects with particular emphasis on modeling, design, characterization, analysis and optimization.
Author: Sumit Ahuja
Publisher: Springer Science & Business Media
ISBN: 1461408725
Category : Technology & Engineering
Languages : en
Pages : 186
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Book Description
This book presents novel research techniques, algorithms, methodologies and experimental results for high level power estimation and power aware high-level synthesis. Readers will learn to apply such techniques to enable design flows resulting in shorter time to market and successful low power ASIC/FPGA design.
Author: Stefan Schuermans
Publisher: Springer
ISBN: 303001875X
Category : Technology & Engineering
Languages : en
Pages : 346
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Book Description
This book describes a flexible and largely automated methodology for adding the estimation of power consumption to high level simulations at the electronic system level (ESL). This method enables the inclusion of power consumption considerations from the very start of a design. This ability can help designers of electronic systems to create devices with low power consumption. The authors also demonstrate the implementation of the method, using the popular ESL language “SystemC”. This implementation enables most existing SystemC ESL simulations for power estimation with very little manual work. Extensive case-studies of a Network on Chip communication architecture and a dual-core application processor “ARM Cortex-A9” showcase the applicability and accuracy of the method to different types of electronic devices. The evaluation compares various trade-offs regarding amount of manual work, types of ESL models, achieved estimation accuracy and impact on the simulation speed. Describes a flexible and largely automated ESL power estimation method; Shows implementation of power estimation methodology in SystemC; Uses two extensive case studies to demonstrate method introduced.
Author: Rohit Sharma
Publisher: CRC Press
ISBN: 1351831593
Category : Technology & Engineering
Languages : en
Pages : 328
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Book Description
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
Author: Georgios Kornaros
Publisher: CRC Press
ISBN: 1351834088
Category : Computers
Languages : en
Pages : 421
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Book Description
Details a real-world product that applies a cutting-edge multi-core architecture Increasingly demanding modern applications—such as those used in telecommunications networking and real-time processing of audio, video, and multimedia streams—require multiple processors to achieve computational performance at the rate of a few giga-operations per second. This necessity for speed and manageable power consumption makes it likely that the next generation of embedded processing systems will include hundreds of cores, while being increasingly programmable, blending processors and configurable hardware in a power-efficient manner. Multi-Core Embedded Systems presents a variety of perspectives that elucidate the technical challenges associated with such increased integration of homogeneous (processors) and heterogeneous multiple cores. It offers an analysis that industry engineers and professionals will need to understand the physical details of both software and hardware in embedded architectures, as well as their limitations and potential for future growth. Discusses the available programming models spread across different abstraction levels The book begins with an overview of the evolution of multiprocessor architectures for embedded applications and discusses techniques for autonomous power management of system-level parameters. It addresses the use of existing open-source (and free) tools originating from several application domains—such as traffic modeling, graph theory, parallel computing and network simulation. In addition, the authors cover other important topics associated with multi-core embedded systems, such as: Architectures and interconnects Embedded design methodologies Mapping of applications
Author: Mohamed Ben Ahmed
Publisher: Springer Nature
ISBN: 3031268520
Category : Technology & Engineering
Languages : en
Pages : 908
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Book Description
This book highlights original research and recent advances in various fields related to smart cities and their applications. Bringing together new contributions by prominent researchers from around the globe, the book is a rich pedagogical tool and an inspiring research support for courses on computer science, electrical engineering, and urban sciences. The book gathers papers presented at the 7th International Conference on Smart City Applications (SCA 2022), held on October 19–21, 2022, in Castelo Branco, Portugal. The technical program of SCA 2022 consisted of 80 papers. The keynote speakers were Eng. Loide Monteiro (Foundation Smart City Cape Verde), Prof. Teodora Vuckovic (University of Novi Sad), Prof. Susana Sargento (University of Aveiro), Prof. Andy Van Den Dobblesteen (TU Delft), and Prof. Juan Corchado (University of Salamanca). SCA 2022 provided a good forum for all researchers to discuss all aspects of science and technology that are relevant to smart city applications.
Author: José L. Ayala
Publisher: Springer
ISBN: 3642361579
Category : Computers
Languages : en
Pages : 266
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Book Description
This book constitutes the refereed proceedings of the 22nd International Conference on Integrated Circuit and System Design, PATMOS 2012, held in Newcastle, UK Spain, in September 2012. The 25 revised full papers presented were carefully reviewed and selected from numerous submissions. The paper feature emerging challenges in methodologies and tools for the design of upcoming generations of integrated circuits and systems, including reconfigurable hardware such as FPGAs. The technical program focus on timing, performance and power consumption as well as architectural aspects with particular emphasis on modeling, design, characterization, analysis and optimization.
Author: Mohammad S. Obaidat
Publisher: Springer
ISBN: 3319312952
Category : Technology & Engineering
Languages : en
Pages : 185
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Book Description
The present book includes a set of selected extended papers from the 5th International Conference on Simulation and Modeling Methodologies, Technologies and Applications (SIMULTECH 2015), held in Colmar, France, from 21 to 23 July 2015. The conference brought together researchers, engineers and practitioners interested in methodologies and applications of modeling and simulation. New and innovative solutions are reported in this book. SIMULTECH 2015 received 102 submissions, from 36 countries, in all continents. After a double blind paper review performed by the Program Committee, 19% were accepted as full papers and thus selected for oral presentation. Additional papers were accepted as short papers and posters. A further selection was made after the Conference, based also on the assessment of presentation quality and audience interest, so that this book includes the extended and revised versions of the very best papers of SIMULTECH 2015. Commitment to high quality standards is a major concern of SIMULTECH that will be maintained in the next editions, considering not only the stringent paper acceptance ratios but also the quality of the program committee, keynote lectures, participation level and logistics.
Author:
Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 902
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Book Description
