TMOS Power MOSFET Reliability Report PDF Download
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Author: Motorola, Inc
Publisher:
ISBN:
Category : Metal oxide semiconductor field-effect transistors
Languages : en
Pages : 63
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Book Description
Author: Motorola, Inc
Publisher:
ISBN:
Category : Metal oxide semiconductor field-effect transistors
Languages : en
Pages : 63
Get Book Here
Book Description
Author: Motorola, Inc
Publisher:
ISBN:
Category : Metal oxide semiconductor field-effect transistors
Languages : en
Pages : 31
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Book Description
Author: Phoenix MOTOROLA INC. (AZ, Estados Unidos)
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Book Description
Symbols, terms and definitions. Basic TMOS structure, operation and physics. Distinct advantages of power mosfets. Basic characteristics of power mosfets. Electrostatic discharge and power mosfets. Design considerations in using power mosfets. Gate drive requirements. Paralleling power mosfets. TMOS applications. Spin-off technologies. Relative efficiencies of semiconductor devices. Packaging. Characterization and measurements. Reliability and quality. Mounting techniques for power mosfets.
Author: Alan G. Stanley
Publisher:
ISBN:
Category :
Languages : en
Pages : 112
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Book Description
Author: Pradeep Lall
Publisher: CRC Press
ISBN: 0429605595
Category : Technology & Engineering
Languages : en
Pages : 332
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Book Description
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Author: Jerry C. Whitaker
Publisher: CRC Press
ISBN: 1420036858
Category : Technology & Engineering
Languages : en
Pages : 624
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Book Description
The days of troubleshooting a piece of gear armed only with a scope, voltmeter, and a general idea of how the hardware works are gone forever. As technology continues to drive equipment design forward, maintenance difficulties will continue to increase, and those responsible for maintaining this equipment will continue to struggle to keep up. The Electronic Systems Maintenance Handbook, Second Edition establishes a foundation for servicing, operating, and optimizing audio, video, computer, and RF systems. Beginning with an overview of reliability principles and properties, a team of top experts describes the steps essential to ensuring high reliability and minimum downtime. They examine heat management issues, grounding systems, and all aspects of system test and measurement. They even explore disaster planning and provide guidelines for keeping a facility running under extreme circumstances. Today more than ever, the reliability of a system can have a direct and immediate impact on the profitability of an operation. Advocating a carefully planned, systematic maintenance program, the richly illustrated Electronic Systems Maintenance Handbook helps engineers and technicians meet the challenges inherent in modern electronic equipment and ensure top quality performance from each piece of hardware.
Author: Jerry C. Whitaker
Publisher: CRC Press
ISBN: 9781420049664
Category : Technology & Engineering
Languages : en
Pages : 612
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Book Description
Proper operation of sensitive equipment requires attention to transient disturbances, grounding practices, and standby power needs. This second edition of the successful AC Power Systems Handbook focuses on engineering technology essential to the design, maintenance, and operation of alternating current power supplies. What's New in the Second Edition? Expanded discussion on power-system components New chapter on grounding practices Appendix covering engineering data and tables Updated material in all chapters Serving engineering personnel involved in the specification, installation, and maintenance of electronic equipment for industry, this revision comprehensively examines the design and maintenance of ac power systems for critical-use applications. AC Power Systems Handbook also reflects the increased movement toward microelectronic equipment and microprocessor-based systems as well as the increased priority among electronics engineers on the protection of such systems.
Author: Motorola Semiconductor Products Inc. Technical Information Center
Publisher:
ISBN:
Category : Metal oxide semiconductor field-effect transistors
Languages : en
Pages : 500
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Book Description
Author: Michael Pecht
Publisher: CRC Press
ISBN: 1351829971
Category : Technology & Engineering
Languages : en
Pages : 910
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Book Description
Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Author:
Publisher:
ISBN:
Category : Metal oxide semiconductor field-effect transistors
Languages : en
Pages :
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Book Description
