Three-Dimensional Integrated Circuit Design

Three-Dimensional Integrated Circuit Design PDF Author: Vasilis F. Pavlidis
Publisher: Newnes
ISBN: 0124104843
Category : Technology & Engineering
Languages : en
Pages : 770

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Book Description
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization

Three-Dimensional Integrated Circuit Design

Three-Dimensional Integrated Circuit Design PDF Author: Vasilis F. Pavlidis
Publisher: Newnes
ISBN: 0124104843
Category : Technology & Engineering
Languages : en
Pages : 770

Get Book Here

Book Description
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization

Three-Dimensional Modeling with Geoscientific Information Systems

Three-Dimensional Modeling with Geoscientific Information Systems PDF Author: A.K. Turner
Publisher: Springer Science & Business Media
ISBN: 9401125562
Category : Science
Languages : en
Pages : 446

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Book Description
A. K. TURNER Department of Geology and Geological Engineering Colorado School of Mines Golden, Colorado 80401 USA Geology deals with three-dimensional data. Geoscientists are concerned with three dimensional spatial observations, measurements, and explanations of a great variety of phenomena. The representation of three-dimensional data has always been a problem. Prior to computers, graphical displays involved specialized maps, cross-sections, fence diagrams, and geometrical constructions such as stereonets. All were designed to portray three-dimensional relationships on two-dimensional paper products, and all were time consuming to develop. Until recently, computers were of little assistance to three-dimensional data handling and representation problems. Memory was too expensive to handle the huge amounts of data required by three-dimensional assessments; computational speeds were too slow to perform the necessary calculations within a reasonable time; and graphical displays had too Iowa resolution or were much too expensive to produce useful visualizations. Much experience was gained with two-dimensional geographic information systems (GIS), which were applied to many land-use management and resource assessment problems. The two-dimensional GIS field matured rapidly in the late 1980's and became widely accepted. The advent of the modern computer workstation, with its enhanced memory and graphical capabilities at ever more affordable prices, has largely overcome these earlier constraints.

Three-dimensional Displays Perceptual Research and Applications to Military Systems

Three-dimensional Displays Perceptual Research and Applications to Military Systems PDF Author: David J. Getty
Publisher: National Academies
ISBN:
Category : Depth perception
Languages : en
Pages : 196

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Book Description


Geometry In Our Three-dimensional World

Geometry In Our Three-dimensional World PDF Author: Alfred S Posamentier
Publisher: World Scientific
ISBN: 9811237123
Category : Mathematics
Languages : en
Pages : 441

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Book Description
The book presents a comprehensive overview of various aspects of three-dimensional geometry that can be experienced on a daily basis. By covering the wide range of topics — from the psychology of spatial perception to the principles of 3D modelling and printing, from the invention of perspective by Renaissance artists to the art of Origami, from polyhedral shapes to the theory of knots, from patterns in space to the problem of optimal packing, and from the problems of cartography to the geometry of solar and lunar eclipses — this book provides deep insight into phenomena related to the geometry of space and exposes incredible nuances that can enrich our lives.The book is aimed at the general readership and provides more than 420 color illustrations that support the explanations and replace formal mathematical arguments with clear graphical representations.

Three-Dimensional Integrated Circuit Design

Three-Dimensional Integrated Circuit Design PDF Author: Yuan Xie
Publisher: Springer Science & Business Media
ISBN: 144190784X
Category : Technology & Engineering
Languages : en
Pages : 292

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Book Description
We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).

A Modular Three-dimensional Finite-difference Ground-water Flow Model

A Modular Three-dimensional Finite-difference Ground-water Flow Model PDF Author: Michael G. McDonald
Publisher:
ISBN:
Category : Groundwater
Languages : en
Pages : 544

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Book Description


Photoelastic Analysis of Three-dimensional Stress Systems Using Scattered Light

Photoelastic Analysis of Three-dimensional Stress Systems Using Scattered Light PDF Author: R. Weller
Publisher:
ISBN:
Category : Photoelasticity
Languages : en
Pages : 42

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Book Description
A method has been developed for making photoelastic analyses of three-dmensional stress systems by utilizing the polarization phenomena associated with the scattering of light. By this method, the maximum shear and the directions of the three principal stresses at any point within a model can be determined, and the two principal stresses at a free-bounding surface can be seaparately evaluated. Polarizing light is projected into the model through a slit so that it illuminates a plane section. The light is continuously analyzed along its path by scattering and the state of stress in the illuminated section is obtained. By means of a series of such sections, the entire stress field may be explored. The method was used to analyze the stress system of a simple beam in bending. The results were found to be in good agreement with those expected from elementary theory.

Lower-Dimensional Systems and Molecular Electronics

Lower-Dimensional Systems and Molecular Electronics PDF Author: Robert M. Metzger
Publisher: Springer Science & Business Media
ISBN: 1489920889
Category : Science
Languages : en
Pages : 729

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Book Description
This volume represents the written account of the NATO Advanced Study Institute "Lower-Dimensional Systems and Molecular Electronics" held at Hotel Spetses, Spetses Island, Greece from 12 June to 23 June 1989. The goal of the Institute was to demonstrate the breadth of chemical and physical knowledge that has been acquired in the last 20 years in inorganic and organic crystals, polymers, and thin films, which exhibit phenomena of reduced dimensionality. The interest in these systems started in the late 1960's with lower-dimensional inorganic conductors, in the early 1970's with quasi-one-dimensional crystalline organic conductors. which by 1979 led to the first organic superconductors, and, in 1977, to the fITSt conducting polymers. The study of monolayer films (Langmuir-Blodgett films) had progressed since the 1930's, but reached a great upsurge in . the early 1980's. The pursuit of non-linear optical phenomena became increasingly popular in the early 1980's, as the attention turned from inorganic crystals to organic films and polymers. And in the last few years the term "moleculw' electronics" has gained ever-increasing acceptance, although it is used in several contexts. We now have organic superconductors with critical temperatures in excess of 10 K, conducting polymers that are soluble and processable, and used commercially; we have films of a few monolayers that have high in-plane electrical conductivity, and polymers that show great promise in photonics; we even have a few devices that function almost at the molecular level.

Dynamics Of Very High Dimensional Systems

Dynamics Of Very High Dimensional Systems PDF Author: Earl H Dowell
Publisher: World Scientific Publishing Company
ISBN: 9813102276
Category : Technology & Engineering
Languages : en
Pages : 285

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Book Description
Many books on dynamics start with a discussion of systems with one or two degrees of freedom and then turn to the generalization to the case of many degrees of freedom. For linear systems, the concept of eigenfunctions provides a compact and elegant method for decomposing the dynamics of a high dimensional system into a series of independent single-degree-of-freedom dynamical systems. Yet, when the system has a very high dimension, the determination of the eigenfunctions may be a distinct challenge, and when the dynamical system is nonconservative and/or nonlinear, the whole notion of uncoupled eigenmodes requires nontrivial extensions of classical methods. These issues constitute the subject of this book.

Dynamics of Infinite Dimensional Systems

Dynamics of Infinite Dimensional Systems PDF Author: Shui-Nee Chow
Publisher: Springer Science & Business Media
ISBN: 3642864589
Category : Mathematics
Languages : en
Pages : 509

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Book Description
The 1986 NATO Advanced Study Insti tute on Dynamics of Infini te Dimensional Systems was held at the Instituto Superior Tecnico. Lisbon. Portugal. In recent years. there have been several research workers who have been considering partial differential equations and functional differential equations as dynamical systems on function spaces. Such approaches have led to the formulation of more theoretical problems that need to be investigated. In the applications. the theoretical ideas have contributed significantly to a better understanding of phenomena that have been experimentally and computationally observed. The investigators of this development come wi th several different backgrounds - some from classical partial differential equations. some from classical ordinary differential equations and some interested in specific applications. Each group has special ideas and often these ideas have not been transmitted from one group to another. The purpose of this NATO Workshop was to bring together research workers from these various areas. It provided asoundboard for the impact of the ideas of each respective discipline. We believe that goal was accomplished. but time will be a better judge. We have included the list of participants at the workshop. with most of these giving a presentation. Although the proceedings do not include all of the presentations. it is a good representative sampie. We wish to express our gratitude to NATO. and.to Dr. M. di Lullo of NATO. who unfortunately did not live to see the completion of this project.