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Three-dimensional Integration and Modeling

Three-dimensional Integration and Modeling PDF Author: Jong-Hoon Lee
Publisher: Morgan & Claypool Publishers
ISBN: 1598292447
Category : Hybrid integrated circuits
Languages : en
Pages : 114

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Book Description
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.