Thin Oxide Reliability in Integrated Circuits PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download Thin Oxide Reliability in Integrated Circuits PDF full book. Access full book title Thin Oxide Reliability in Integrated Circuits by Elyse Rosenbaum. Download full books in PDF and EPUB format.
Author: Elyse Rosenbaum
Publisher:
ISBN:
Category :
Languages : en
Pages : 228
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Book Description
Author: Elyse Rosenbaum
Publisher:
ISBN:
Category :
Languages : en
Pages : 228
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Book Description
Author: D. J. Dumin
Publisher: World Scientific
ISBN: 9789810248420
Category : Technology & Engineering
Languages : en
Pages : 292
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Book Description
Presents in summary the state of our knowledge of oxide reliability.
Author: David J Dumin
Publisher: World Scientific
ISBN: 981448945X
Category : Technology & Engineering
Languages : en
Pages : 281
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Book Description
This book presents in summary the state of our knowledge of oxide reliability. The articles have been written by experts who are among the most knowledgeable in the field. The book will be an invaluable aid to reliability engineers and manufacturing engineers, helping them to produce and characterize reliable oxides. It can be used as an introduction for new engineers interested in oxide reliability, besides being a reference for engineers already engaged in the field.
Author: Arman Vassighi
Publisher: Springer Science & Business Media
ISBN: 0387297499
Category : Technology & Engineering
Languages : en
Pages : 188
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Book Description
In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
Author: Joseph B. Bernstein
Publisher: John Wiley & Sons
ISBN: 1394210930
Category : Technology & Engineering
Languages : en
Pages : 404
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Book Description
RELIABILITY PREDICTION FOR MICROELECTRONICS Wiley Series in Quality & Reliability Engineering REVOLUTIONIZE YOUR APPROACH TO RELIABILITY ASSESSMENT WITH THIS GROUNDBREAKING BOOK Reliability evaluation is a critical aspect of engineering, without which safe performance within desired parameters over the lifespan of machines cannot be guaranteed. With microelectronics in particular, the challenges to evaluating reliability are considerable, and statistical methods for creating microelectronic reliability standards are complex. With nano-scale microelectronic devices increasingly prominent in modern life, it has never been more important to understand the tools available to evaluate reliability. Reliability Prediction for Microelectronics meets this need with a cluster of tools built around principles of reliability physics and the concept of remaining useful life (RUL). It takes as its core subject the ‘physics of failure’, combining a thorough understanding of conventional approaches to reliability evaluation with a keen knowledge of their blind spots. It equips engineers and researchers with the capacity to overcome decades of errant reliability physics and place their work on a sound engineering footing. Reliability Prediction for Microelectronics readers will also find: Focus on the tools required to perform reliability assessments in real operating conditions Detailed discussion of topics including failure foundation, reliability testing, acceleration factor calculation, and more New multi-physics of failure on DSM technologies, including TDDB, EM, HCI, and BTI Reliability Prediction for Microelectronics is ideal for reliability and quality engineers, design engineers, and advanced engineering students looking to understand this crucial area of product design and testing.
Author: Alvin W. Strong
Publisher: John Wiley & Sons
ISBN: 047045525X
Category : Technology & Engineering
Languages : en
Pages : 642
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Book Description
This invaluable resource tells the complete story of failure mechanisms—from basic concepts to the tools necessary to conduct reliability tests and analyze the results. Both a text and a reference work for this important area of semiconductor technology, it assumes no reliability education or experience. It also offers the first reference book with all relevant physics, equations, and step-by-step procedures for CMOS technology reliability in one place. Practical appendices provide basic experimental procedures that include experiment design, performing stressing in the laboratory, data analysis, reliability projections, and interpreting projections.
Author: Hisham Z. Massoud
Publisher:
ISBN:
Category : Nature
Languages : en
Pages : 562
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Book Description
Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 836
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Book Description
Author:
Publisher: Elsevier
ISBN: 1782422250
Category : Technology & Engineering
Languages : en
Pages : 274
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Book Description
This book takes a holistic approach to reliability engineering for electrical and electronic systems by looking at the failure mechanisms, testing methods, failure analysis, characterisation techniques and prediction models that can be used to increase reliability for a range of devices. The text describes the reliability behavior of electrical and electronic systems. It takes an empirical scientific approach to reliability engineering to facilitate a greater understanding of operating conditions, failure mechanisms and the need for testing for a more realistic characterisation. After introducing the fundamentals and background to reliability theory, the text moves on to describe the methods of reliability analysis and charactersation across a wide range of applications. Takes a holistic approach to reliability engineering Looks at the failure mechanisms, testing methods, failure analysis, characterisation techniques and prediction models that can be used to increase reliability Facilitates a greater understanding of operating conditions, failure mechanisms and the need for testing for a more realistic characterisation
Author: Ronald Donald Schrimpf
Publisher: World Scientific
ISBN: 9812389407
Category : Technology & Engineering
Languages : en
Pages : 349
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Book Description
This book provides a detailed treatment of radiation effects in electronic devices, including effects at the material, device, and circuit levels. The emphasis is on transient effects caused by single ionizing particles (single-event effects and soft errors) and effects produced by the cumulative energy deposited by the radiation (total ionizing dose effects). Bipolar (Si and SiGe), metal-oxide-semiconductor (MOS), and compound semi-conductor technologies are discussed. In addition to considering the specific issues associated with high-performance devices and technologies, the book includes the background material necessary for understanding radiation effects at a more general level.
