Author: W. D. Nix
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 750
Book Description
Papers presented at the 1991 Fall Meeting of the Materials Research Society
Thin Films: Volume 239
Author: W. D. Nix
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 750
Book Description
Papers presented at the 1991 Fall Meeting of the Materials Research Society
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 750
Book Description
Papers presented at the 1991 Fall Meeting of the Materials Research Society
Thin Films Stresses and Mechanical Properties VI
Author: Shefford P. Baker
Publisher: Materials Research Society
ISBN: 9781558993396
Category : Technology & Engineering
Languages : en
Pages : 576
Book Description
Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.
Publisher: Materials Research Society
ISBN: 9781558993396
Category : Technology & Engineering
Languages : en
Pages : 576
Book Description
Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.
Science And Technology Of Thin Films
Author: Francesco Cino Matacotta
Publisher: World Scientific
ISBN: 9814500747
Category : Technology & Engineering
Languages : en
Pages : 369
Book Description
This book brings together detailed discussions by leading experts on the various innovative aspects of thin films growth, deposition and characterization techniques, and new thin film materials and devices. It addresses through the different viewpoints of the contributors, the major problem of thin films science - the relation between the energy of the condensing species and the resulting properties of the films. Some of the issues considered include energetic condensation, bombardment stabilization, pulsed electron beam ablation, orientation and self-organization of organic, ferroelectric and nanoparticle thin films. Several chapters focus on applications such as the recent developments in organic optoelectronics, large area electronic technology and superconducting thin film devices.
Publisher: World Scientific
ISBN: 9814500747
Category : Technology & Engineering
Languages : en
Pages : 369
Book Description
This book brings together detailed discussions by leading experts on the various innovative aspects of thin films growth, deposition and characterization techniques, and new thin film materials and devices. It addresses through the different viewpoints of the contributors, the major problem of thin films science - the relation between the energy of the condensing species and the resulting properties of the films. Some of the issues considered include energetic condensation, bombardment stabilization, pulsed electron beam ablation, orientation and self-organization of organic, ferroelectric and nanoparticle thin films. Several chapters focus on applications such as the recent developments in organic optoelectronics, large area electronic technology and superconducting thin film devices.
Thin Films: Stresses and Mechanical Properties III. Materials Research Society Symposium Proceedings Held in Boston, Massachusetts on December 2-5, 1991
Author: William D. Nix
Publisher:
ISBN:
Category :
Languages : en
Pages : 714
Book Description
This volume consists of eight parts. Papers based on both oral and poster presentations are arranged according to these eight topics. The book begins with papers dealing with microstructural processes and intrinsic stresses in thin films. This is followed by papers on the stresses themselves and on thin film deformation processes. Mechanical testing techniques and the mechanical properties of thin films are presented next. Because indentation has become so important in the study of thin film mechanical properties, a special part of the symposium was devoted to modelling and experiments in indentation. The volume also includes a series of papers on the stresses and mechanical properties of multilayers, focusing mainly on metal multilayers with layer dimensions in the nanometer range. Strain relaxation in heteroepitaxial thin films by the formation of misfit dislocations continues to be one of the important research areas in this field, so a part of this volume is devoted to that topic. The last topics in the volume deal with failure processes in thin films. Papers on adhesion and fracture properties of thin films are grouped together in part VII. The last part of the book deals with the phenomena of electromigration and stress induced voiding in interconnect metal films.
Publisher:
ISBN:
Category :
Languages : en
Pages : 714
Book Description
This volume consists of eight parts. Papers based on both oral and poster presentations are arranged according to these eight topics. The book begins with papers dealing with microstructural processes and intrinsic stresses in thin films. This is followed by papers on the stresses themselves and on thin film deformation processes. Mechanical testing techniques and the mechanical properties of thin films are presented next. Because indentation has become so important in the study of thin film mechanical properties, a special part of the symposium was devoted to modelling and experiments in indentation. The volume also includes a series of papers on the stresses and mechanical properties of multilayers, focusing mainly on metal multilayers with layer dimensions in the nanometer range. Strain relaxation in heteroepitaxial thin films by the formation of misfit dislocations continues to be one of the important research areas in this field, so a part of this volume is devoted to that topic. The last topics in the volume deal with failure processes in thin films. Papers on adhesion and fracture properties of thin films are grouped together in part VII. The last part of the book deals with the phenomena of electromigration and stress induced voiding in interconnect metal films.
Thin Films
Author: Heinz Hoffmann
Publisher:
ISBN:
Category : Thin films
Languages : en
Pages : 374
Book Description
Publisher:
ISBN:
Category : Thin films
Languages : en
Pages : 374
Book Description
Thin Films: Volume 308
Author: Paul H. Townsend
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 808
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 808
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Thin Films
Author: Heinz Hoffmann (chemia)
Publisher:
ISBN: 9781851668021
Category :
Languages : en
Pages : 0
Book Description
Publisher:
ISBN: 9781851668021
Category :
Languages : en
Pages : 0
Book Description
Physics of Thin Films
Author: Georg Hass (ured.)
Publisher:
ISBN: 9780125330091
Category : Thin films
Languages : en
Pages : 316
Book Description
Publisher:
ISBN: 9780125330091
Category : Thin films
Languages : en
Pages : 316
Book Description
Materials Research Society Symposium Proceedings Held in Boston, Massachusetts on 2-5 December 1991. Thin Films: Stresses and Mechanical Properties III
Author: John Ballance
Publisher:
ISBN:
Category :
Languages : en
Pages : 717
Book Description
The book begins with papers dealing with microstructural processes and intrinsic stresses in thin films. This is followed by papers on the stresses themselves and on thin film deformation processes. Mechanical testing techniques and the mechanical properties of thin films are presented next. Because indentation has become so important in the study of thin film mechanical properties, a special part of the symposium was devoted to modelling and experiments in indentation. The volume also includes a series of papers on the stresses and mechanical properties of multilayers, focussing mainly on metal multilayers with layer dimensions in the nanometer range. Strain relaxation in heteroepitaxial thin films by the formation of misfit dislocations continues to be one of the important research areas in this field, so a part of this volume is devoted to that topic. The last topics in the volume deal with failure processes in thin films. Papers on adhesion and fracture properties of thin films are grouped together in Part VII. The last part of the book deals with the phenomena of electromigration and stress induced voiding in interconnect metal films.
Publisher:
ISBN:
Category :
Languages : en
Pages : 717
Book Description
The book begins with papers dealing with microstructural processes and intrinsic stresses in thin films. This is followed by papers on the stresses themselves and on thin film deformation processes. Mechanical testing techniques and the mechanical properties of thin films are presented next. Because indentation has become so important in the study of thin film mechanical properties, a special part of the symposium was devoted to modelling and experiments in indentation. The volume also includes a series of papers on the stresses and mechanical properties of multilayers, focussing mainly on metal multilayers with layer dimensions in the nanometer range. Strain relaxation in heteroepitaxial thin films by the formation of misfit dislocations continues to be one of the important research areas in this field, so a part of this volume is devoted to that topic. The last topics in the volume deal with failure processes in thin films. Papers on adhesion and fracture properties of thin films are grouped together in Part VII. The last part of the book deals with the phenomena of electromigration and stress induced voiding in interconnect metal films.
Thin Films - Present and Future
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
Book Description