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Author: Lian-Tuu Yeh
Publisher: American Society of Mechanical Engineers
ISBN:
Category : Science
Languages : en
Pages : 454
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Book Description
With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.
Author: Lian-Tuu Yeh
Publisher: American Society of Mechanical Engineers
ISBN:
Category : Science
Languages : en
Pages : 454
Get Book Here
Book Description
With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.
Author: Sadik Kakaç
Publisher: Springer Science & Business Media
ISBN: 9401110905
Category : Technology & Engineering
Languages : en
Pages : 953
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Book Description
Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Author: Allan D. Kraus
Publisher: Wiley-Interscience
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 432
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Book Description
A powerful methodology for producing superior thermal performance at low cost with minimum added mass . . . Here is the only available comprehensive treatment of the design and analysis of heat sinks. It provides all the theoretical and practical information necessary to successfully design and/or select cost-effective heat sinks for electronic equipment. The presentation includes detailed explanations of the governing heat transfer phenomena, complete coverage of thermal modeling tools for geometrically complex fin structures, and extensive discussion on recognizing thermal optimization opportunities. Other topics covered include: Fundamentals of heat transfer Thermal modeling of electronic packages Mathematical tools for heat-sink analysis and design Prevailing thermal transport processes Models for a variety of fin geometries Simple "transfer function" relations for single fin, cascaded fin, and fin array heat sinks Thermal characterization and optimization of plate-fin heat sinks Completely self-contained and filled with valuable information not available from any other single source, Design and Analysis of Heat Sinks is both a superior reference for accomplished thermal specialists and an excellent textbook for graduate courses in advanced thermal applications for mechanical engineering students. This book can also serve as a text in thermal science for students of electrical engineering.
Author: Younes Shabany
Publisher: CRC Press
ISBN: 1439814686
Category : Science
Languages : en
Pages : 526
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Book Description
The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use
Author: David Reay
Publisher: Butterworth-Heinemann
ISBN: 0080982794
Category : Technology & Engineering
Languages : en
Pages : 280
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Book Description
Heat Pipes, Sixth Edition, takes a highly practical approach to the design and selection of heat pipes, making it an essential guide for practicing engineers and an ideal text for postgraduate students.This new edition has been revised to include new information on the underlying theory of heat pipes and heat transfer, and features fully updated applications, new data sections, and updated chapters on design and electronics cooling. The book is a useful reference for those with experience and an accessible introduction for those approaching the topic for the first time. - Contains all information required to design and manufacture a heat pipe - Suitable for use as a professional reference and graduate text - Revised with greater coverage of key electronic cooling applications
Author: Xingcun Colin Tong
Publisher: Springer Science & Business Media
ISBN: 1441977597
Category : Technology & Engineering
Languages : en
Pages : 633
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Book Description
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Author: S. M. Sohel Murshed
Publisher: BoD – Books on Demand
ISBN: 9535124056
Category : Computers
Languages : en
Pages : 184
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Book Description
Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.
Author: Ralph Remsburg
Publisher: CRC Press
ISBN: 1351835912
Category : Technology & Engineering
Languages : en
Pages : 440
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Book Description
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
Author: C.J. Hoogendoorn
Publisher: Springer Science & Business Media
ISBN: 9401110824
Category : Technology & Engineering
Languages : en
Pages : 334
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Book Description
The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Seminar. Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in miniaturisation. It might be argued that we are on the verge of a revolution in thermal management techniques. Previously, a packaging engineer had no way of predicting the tempera tures of critical electronic parts with the required accuracy. He or she· had to rely on full-scale experiments, doubtful design rules, or worst-case estimates. This situation is going to be changed in the foreseeable future. User-friendly software tools, the acquisition and integrity of input and output data, the badly needed training mea sures, the introduction into a concurrent engineering environment: all these items will exert a heavy toll on the flexibility of the electronics industries. Fortunately, this situation is being realised at the appropriate management levels, and the interest in this seminar and the pre-conference tutorials testifies to this assertion.
Author: Stephen S. Furkay
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 396
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Book Description
