Author: Terry M. Tritt
Publisher: Springer Science & Business Media
ISBN: 038726017X
Category : Science
Languages : en
Pages : 306
Book Description
It has been almost thirty years since the publication of a book that is entirely dedicated to the theory, description, characterization and measurement of the thermal conductivity of solids. The recent discovery of new materials which possess more complex crystal structures and thus more complicated phonon scattering mechanisms have brought innovative challenges to the theory and experimental understanding of these new materials. With the development of new and novel solid materials and new measurement techniques, this book will serve as a current and extensive resource to the next generation researchers in the field of thermal conductivity. This book is a valuable resource for research groups and special topics courses (8-10 students), for 1st or 2nd year graduate level courses in Thermal Properties of Solids, special topics courses in Thermal Conductivity, Superconductors and Magnetic Materials, and to researchers in Thermoelectrics, Thermal Barrier Materials and Solid State Physics.
Thermal Conductivity
Author: Terry M. Tritt
Publisher: Springer Science & Business Media
ISBN: 038726017X
Category : Science
Languages : en
Pages : 306
Book Description
It has been almost thirty years since the publication of a book that is entirely dedicated to the theory, description, characterization and measurement of the thermal conductivity of solids. The recent discovery of new materials which possess more complex crystal structures and thus more complicated phonon scattering mechanisms have brought innovative challenges to the theory and experimental understanding of these new materials. With the development of new and novel solid materials and new measurement techniques, this book will serve as a current and extensive resource to the next generation researchers in the field of thermal conductivity. This book is a valuable resource for research groups and special topics courses (8-10 students), for 1st or 2nd year graduate level courses in Thermal Properties of Solids, special topics courses in Thermal Conductivity, Superconductors and Magnetic Materials, and to researchers in Thermoelectrics, Thermal Barrier Materials and Solid State Physics.
Publisher: Springer Science & Business Media
ISBN: 038726017X
Category : Science
Languages : en
Pages : 306
Book Description
It has been almost thirty years since the publication of a book that is entirely dedicated to the theory, description, characterization and measurement of the thermal conductivity of solids. The recent discovery of new materials which possess more complex crystal structures and thus more complicated phonon scattering mechanisms have brought innovative challenges to the theory and experimental understanding of these new materials. With the development of new and novel solid materials and new measurement techniques, this book will serve as a current and extensive resource to the next generation researchers in the field of thermal conductivity. This book is a valuable resource for research groups and special topics courses (8-10 students), for 1st or 2nd year graduate level courses in Thermal Properties of Solids, special topics courses in Thermal Conductivity, Superconductors and Magnetic Materials, and to researchers in Thermoelectrics, Thermal Barrier Materials and Solid State Physics.
High Thermal Conductivity Materials
Author: Subhash L. Shinde
Publisher: Springer Science & Business Media
ISBN: 0387251006
Category : Science
Languages : en
Pages : 285
Book Description
The main objective of this book is to cover the basic understanding of thermal conduction mechanisms in various high thermal conductivity materials including diamond, cubic boron nitride, and also the latest material like carbon nanotubes. The book is intended as a good reference book for scientists and engineers involved in addressing thermal management issues in a broad spectrum of industries. Leading researchers from industry and academic institutions who are well known in their areas of expertise have contributed a chapter in the field of their interest.
Publisher: Springer Science & Business Media
ISBN: 0387251006
Category : Science
Languages : en
Pages : 285
Book Description
The main objective of this book is to cover the basic understanding of thermal conduction mechanisms in various high thermal conductivity materials including diamond, cubic boron nitride, and also the latest material like carbon nanotubes. The book is intended as a good reference book for scientists and engineers involved in addressing thermal management issues in a broad spectrum of industries. Leading researchers from industry and academic institutions who are well known in their areas of expertise have contributed a chapter in the field of their interest.
Handbook of Thermal Conductivity of Liquids and Gases
Author: Natan B. Vargaftik
Publisher: CRC Press
ISBN: 9780849393457
Category : Science
Languages : en
Pages : 368
Book Description
Handbook of Thermal Conductivity of Liquids and Gases covers practically all of the data available on the thermalconductivity of pure liquids and gases. Thermal conductivity data included in the book is based on original experimental measurements and correlations recommended or adopted as a standard by the National Standard Reference Data Service of the Russian Federation. New tabulations of thermal conductivity data on high-molecular organic fluids and the alkali metals in both liquid and gaseous states are featured as well. This book will be an important reference for all researchers working in thermodynamics.
Publisher: CRC Press
ISBN: 9780849393457
Category : Science
Languages : en
Pages : 368
Book Description
Handbook of Thermal Conductivity of Liquids and Gases covers practically all of the data available on the thermalconductivity of pure liquids and gases. Thermal conductivity data included in the book is based on original experimental measurements and correlations recommended or adopted as a standard by the National Standard Reference Data Service of the Russian Federation. New tabulations of thermal conductivity data on high-molecular organic fluids and the alkali metals in both liquid and gaseous states are featured as well. This book will be an important reference for all researchers working in thermodynamics.
An Essential Guide to Thermal Conductivity
Author: Sohel Murshed
Publisher: Nova Science Publishers
ISBN: 9781685071967
Category : Science
Languages : en
Pages : 0
Book Description
"Thermal conductivity is one of the main properties of any materials as it plays a key role for their use in a wide range of essential applications. This book covers fundamentals of thermal conductivity, its measurements, mechanisms, and modeling for different important materials from multiphase systems and ceramic materials to emerging fluids like ionic liquids and suspensions of nanoparticles known as nanofluids. Despite being a popular topic under rapid evolution, knowledge on thermal conductivity of nanofluids is far from being mature. Besides discussion on various mechanisms and modeling, this book presents experimental findings related to the impact of various parameters on the thermal conductivity of these new fluids. It includes thermal conductivity of ionanocolloids which is a new type of nanofluids. The book is aimed to serve as a guide to research, education, and industries in the fields of heat transfer and exchange, cooling, and other thermal management"--
Publisher: Nova Science Publishers
ISBN: 9781685071967
Category : Science
Languages : en
Pages : 0
Book Description
"Thermal conductivity is one of the main properties of any materials as it plays a key role for their use in a wide range of essential applications. This book covers fundamentals of thermal conductivity, its measurements, mechanisms, and modeling for different important materials from multiphase systems and ceramic materials to emerging fluids like ionic liquids and suspensions of nanoparticles known as nanofluids. Despite being a popular topic under rapid evolution, knowledge on thermal conductivity of nanofluids is far from being mature. Besides discussion on various mechanisms and modeling, this book presents experimental findings related to the impact of various parameters on the thermal conductivity of these new fluids. It includes thermal conductivity of ionanocolloids which is a new type of nanofluids. The book is aimed to serve as a guide to research, education, and industries in the fields of heat transfer and exchange, cooling, and other thermal management"--
Thermal Conductivity 22
Author: Timothy W. Tong
Publisher: CRC Press
ISBN: 9781566761727
Category : Technology & Engineering
Languages : en
Pages : 1022
Book Description
Publisher: CRC Press
ISBN: 9781566761727
Category : Technology & Engineering
Languages : en
Pages : 1022
Book Description
Thermal Conductivity of Solids at Room Temperature and Below
Author: Gregg E. Childs
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 632
Book Description
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 632
Book Description
Thermal Conductivity 31/Thermal Expansion 19
Author: Laszlo Kiss
Publisher: DEStech Publications, Inc
ISBN: 1605950556
Category : Science
Languages : en
Pages : 343
Book Description
New volume in the ITCC/ITES book series on thermal conductivity. Papers include applications related to thermophysical properties measurement methods, equipment, processes, theory, and new developments.
Publisher: DEStech Publications, Inc
ISBN: 1605950556
Category : Science
Languages : en
Pages : 343
Book Description
New volume in the ITCC/ITES book series on thermal conductivity. Papers include applications related to thermophysical properties measurement methods, equipment, processes, theory, and new developments.
Physical Properties of Polymers Handbook
Author: James E. Mark
Publisher: Springer Science & Business Media
ISBN: 0387690026
Category : Technology & Engineering
Languages : en
Pages : 1050
Book Description
This book offers concise information on the properties of polymeric materials, particularly those most relevant to physical chemistry and chemical physics. Extensive updates and revisions to each chapter include eleven new chapters on novel polymeric structures, reinforcing phases in polymers, and experiments on single polymer chains. The study of complex materials is highly interdisciplinary, and new findings are scattered among a large selection of scientific and engineering journals. This book brings together data from experts in the different disciplines contributing to the rapidly growing area of polymers and complex materials.
Publisher: Springer Science & Business Media
ISBN: 0387690026
Category : Technology & Engineering
Languages : en
Pages : 1050
Book Description
This book offers concise information on the properties of polymeric materials, particularly those most relevant to physical chemistry and chemical physics. Extensive updates and revisions to each chapter include eleven new chapters on novel polymeric structures, reinforcing phases in polymers, and experiments on single polymer chains. The study of complex materials is highly interdisciplinary, and new findings are scattered among a large selection of scientific and engineering journals. This book brings together data from experts in the different disciplines contributing to the rapidly growing area of polymers and complex materials.
Thermal Conductivity 24/Thermal Expansion 12
Author: Peter S. Gaal
Publisher: CRC Press
ISBN: 9781566767118
Category : Technology & Engineering
Languages : en
Pages : 874
Book Description
Publisher: CRC Press
ISBN: 9781566767118
Category : Technology & Engineering
Languages : en
Pages : 874
Book Description
High Thermal Conductivity Materials
Author: Subhash L. Shinde
Publisher: Springer Science & Business Media
ISBN: 9780387220215
Category : Science
Languages : en
Pages : 302
Book Description
Thedemandfore?cientthermalmanagementhasincreasedsubstantiallyover the last decade in every imaginable area, be it a formula 1 racing car suddenly braking to decelerate from 200 to 50 mph going around a sharp corner, a space shuttle entering the earth’s atmosphere, or an advanced microproc- sor operating at a very high speed. The temperatures at the hot junctions are extremely high and the thermal ?ux can reach values higher than a few 2 hundred to a thousand watts/cm in these applications. To take a speci?c example of the microelectronics area, the chip heat ?ux for CMOS microp- cessors, though moderate compared to the numbers mentioned above have 2 already reached values close to 100 W/cm , and are projected to increase 2 above 200 W/cm over the next few years. Although the thermal mana- ment strategies for microprocessors do involve power optimization through improved design, it is extremely di?cult to eliminate “hot spots” completely. This is where high thermal conductivity materials ?nd most of their appli- tions, as “heat spreaders”. The high thermal conductivity of these materials allows the heat to be carried away from the “hot spots” very quickly in all directions thereby “spreading” the heat. Heat spreading reduces the heat ?ux density, and thus makes it possible to cool systems using standard cooling solutions like ?nned heat sinks with forced air cooling.
Publisher: Springer Science & Business Media
ISBN: 9780387220215
Category : Science
Languages : en
Pages : 302
Book Description
Thedemandfore?cientthermalmanagementhasincreasedsubstantiallyover the last decade in every imaginable area, be it a formula 1 racing car suddenly braking to decelerate from 200 to 50 mph going around a sharp corner, a space shuttle entering the earth’s atmosphere, or an advanced microproc- sor operating at a very high speed. The temperatures at the hot junctions are extremely high and the thermal ?ux can reach values higher than a few 2 hundred to a thousand watts/cm in these applications. To take a speci?c example of the microelectronics area, the chip heat ?ux for CMOS microp- cessors, though moderate compared to the numbers mentioned above have 2 already reached values close to 100 W/cm , and are projected to increase 2 above 200 W/cm over the next few years. Although the thermal mana- ment strategies for microprocessors do involve power optimization through improved design, it is extremely di?cult to eliminate “hot spots” completely. This is where high thermal conductivity materials ?nd most of their appli- tions, as “heat spreaders”. The high thermal conductivity of these materials allows the heat to be carried away from the “hot spots” very quickly in all directions thereby “spreading” the heat. Heat spreading reduces the heat ?ux density, and thus makes it possible to cool systems using standard cooling solutions like ?nned heat sinks with forced air cooling.