Author: Ross Hinson
Publisher:
ISBN:
Category : Electronic dissertations
Languages : en
Pages : 97
Book Description
The chemical ordering of FePt requires an annealing temperature>500 °C. At these temperatures, grain growth attributed to thermal annealing lowers the areal density in computer hard drives. Multiple paths have been proposed to lower the ordering temperature in order to decrease the grain growth. Ternary additions show promise as a way to lower the ordering temperature and decrease the grain growth. Though multiple studies have been conducted on the incorporation of Cu into FePt, these studies have produced contradictory results on the ordering temperature. Currently, there is no literature on the in situ growth stresses during deposition of FePtCu as a function of ordering temperature. InsituFe_44.5 Pt_51 Cu_4.5 and Fe_50 Pt_50 (for comparison) thin films were produced in order to determine how stress and ordering are affected by the incorporation of Cu. The incorporation of Cu at the amounts studied did not change the stress behavior of FePt when compared to Fe_50 Pt_50 . The addition of Cu raised the ordering temperature and had little to no effect on the grain size as compared to the Fe_50 Pt_50 . This retardation of ordering has been explained by the placement of Cu at lattice sites which minimize the bond distance to Pt and maximize the bond distance to Fe.
The Role of Copper on Stress Evolution and Chemical Ordering in Iron-copper-platinum Thin Films
Author: Ross Hinson
Publisher:
ISBN:
Category : Electronic dissertations
Languages : en
Pages : 97
Book Description
The chemical ordering of FePt requires an annealing temperature>500 °C. At these temperatures, grain growth attributed to thermal annealing lowers the areal density in computer hard drives. Multiple paths have been proposed to lower the ordering temperature in order to decrease the grain growth. Ternary additions show promise as a way to lower the ordering temperature and decrease the grain growth. Though multiple studies have been conducted on the incorporation of Cu into FePt, these studies have produced contradictory results on the ordering temperature. Currently, there is no literature on the in situ growth stresses during deposition of FePtCu as a function of ordering temperature. InsituFe_44.5 Pt_51 Cu_4.5 and Fe_50 Pt_50 (for comparison) thin films were produced in order to determine how stress and ordering are affected by the incorporation of Cu. The incorporation of Cu at the amounts studied did not change the stress behavior of FePt when compared to Fe_50 Pt_50 . The addition of Cu raised the ordering temperature and had little to no effect on the grain size as compared to the Fe_50 Pt_50 . This retardation of ordering has been explained by the placement of Cu at lattice sites which minimize the bond distance to Pt and maximize the bond distance to Fe.
Publisher:
ISBN:
Category : Electronic dissertations
Languages : en
Pages : 97
Book Description
The chemical ordering of FePt requires an annealing temperature>500 °C. At these temperatures, grain growth attributed to thermal annealing lowers the areal density in computer hard drives. Multiple paths have been proposed to lower the ordering temperature in order to decrease the grain growth. Ternary additions show promise as a way to lower the ordering temperature and decrease the grain growth. Though multiple studies have been conducted on the incorporation of Cu into FePt, these studies have produced contradictory results on the ordering temperature. Currently, there is no literature on the in situ growth stresses during deposition of FePtCu as a function of ordering temperature. InsituFe_44.5 Pt_51 Cu_4.5 and Fe_50 Pt_50 (for comparison) thin films were produced in order to determine how stress and ordering are affected by the incorporation of Cu. The incorporation of Cu at the amounts studied did not change the stress behavior of FePt when compared to Fe_50 Pt_50 . The addition of Cu raised the ordering temperature and had little to no effect on the grain size as compared to the Fe_50 Pt_50 . This retardation of ordering has been explained by the placement of Cu at lattice sites which minimize the bond distance to Pt and maximize the bond distance to Fe.
In Situ Growth Stresses in Iron-platinum and Iron-copper Alloy
Author: Bianzhu Fu
Publisher:
ISBN:
Category : Electronic dissertations
Languages : en
Pages : 83
Book Description
Intrinsic thin film stress is evitable with the thin film deposition process and plays an important role in tuning the physical properties of thin films. In this thesis, the in situ and post growth stress evolution of the Fe-Pt and Fe-Cu alloy system was studied and correlated to the microstructure evolutions. At ambient temperature and constant deposition pressure, the growth stresses of both the Fe-Pt and Fe-Cu alloy were found to be dependent on the compositions and affected by their growth rates. The final intrinsic stress states after growth could be tuned to be either tensile, zero or compressive depending upon composition and deposition rate for similar grain sizes. This is due to the preferential segregation of one species (the more mobile element) to the grain boundaries. At elevated growth temperatures, the Fe-Pt alloy forms ordered phase while the Fe-Cu alloy forms phase separation. The magnitude of the compressive stress state is reduced as the Fe54Pt46 thin film orders in situ during growth. The compressive stress relaxation rate is increased with increasing substrate temperature or order parameter. This compressive stress reduction has been rationalized as a reduction of adatom mobility on the surface as Fe and Pt occupy specific lattice sites for L10 on each grain. The ordered nature of the grains contributes to additional chemical energy at the boundary which, upon ceasing deposition, significantly increases the stress relaxation rate. In contrary, the growth compressive stress of the Fe51Cu49 alloys in the continuous growth regime is increased with substrate temperature. This has been rationalized as the migration of adatoms to thermodynamically preferred surfaces during growth.
Publisher:
ISBN:
Category : Electronic dissertations
Languages : en
Pages : 83
Book Description
Intrinsic thin film stress is evitable with the thin film deposition process and plays an important role in tuning the physical properties of thin films. In this thesis, the in situ and post growth stress evolution of the Fe-Pt and Fe-Cu alloy system was studied and correlated to the microstructure evolutions. At ambient temperature and constant deposition pressure, the growth stresses of both the Fe-Pt and Fe-Cu alloy were found to be dependent on the compositions and affected by their growth rates. The final intrinsic stress states after growth could be tuned to be either tensile, zero or compressive depending upon composition and deposition rate for similar grain sizes. This is due to the preferential segregation of one species (the more mobile element) to the grain boundaries. At elevated growth temperatures, the Fe-Pt alloy forms ordered phase while the Fe-Cu alloy forms phase separation. The magnitude of the compressive stress state is reduced as the Fe54Pt46 thin film orders in situ during growth. The compressive stress relaxation rate is increased with increasing substrate temperature or order parameter. This compressive stress reduction has been rationalized as a reduction of adatom mobility on the surface as Fe and Pt occupy specific lattice sites for L10 on each grain. The ordered nature of the grains contributes to additional chemical energy at the boundary which, upon ceasing deposition, significantly increases the stress relaxation rate. In contrary, the growth compressive stress of the Fe51Cu49 alloys in the continuous growth regime is increased with substrate temperature. This has been rationalized as the migration of adatoms to thermodynamically preferred surfaces during growth.
Scientific and Technical Aerospace Reports
Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 704
Book Description
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 704
Book Description
Thin Films of Copper Oxide and Copper Grown by Atomic Layer Deposition for Applications in Metallization Systems of Microelectronic Devices
Author: Thomas Wächtler
Publisher: Thomas Waechtler
ISBN: 3941003178
Category :
Languages : en
Pages : 247
Book Description
Publisher: Thomas Waechtler
ISBN: 3941003178
Category :
Languages : en
Pages : 247
Book Description
The Influence of Copper on the Rate of Solution of Iron in Acids
Author: Frederick Keller Bell
Publisher:
ISBN:
Category : Chemical kinetics
Languages : en
Pages : 40
Book Description
Publisher:
ISBN:
Category : Chemical kinetics
Languages : en
Pages : 40
Book Description
Kinetics of Interfacial Reaction and Stress Evolution in Bimetallic Copper-tin Thin Films
Author: Lucine Kabakian Reinbold
Publisher:
ISBN:
Category : Metallic films
Languages : en
Pages : 342
Book Description
Publisher:
ISBN:
Category : Metallic films
Languages : en
Pages : 342
Book Description
Synthesis and Characterization of Iron-copper Nitride Thin Films
Author: Hrishikesh Kamat
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Chemical Abstracts
Author:
Publisher:
ISBN:
Category : Chemistry
Languages : en
Pages : 2540
Book Description
Publisher:
ISBN:
Category : Chemistry
Languages : en
Pages : 2540
Book Description
Measurements of Stress During Deposition of Copper and Silver Thin Films and Multilayers
Author: Alison Lee Shull
Publisher:
ISBN:
Category : Metallic films
Languages : en
Pages : 328
Book Description
Publisher:
ISBN:
Category : Metallic films
Languages : en
Pages : 328
Book Description
Metals Abstracts
Author:
Publisher:
ISBN:
Category : Metallurgy
Languages : en
Pages : 1042
Book Description
Publisher:
ISBN:
Category : Metallurgy
Languages : en
Pages : 1042
Book Description