Author: Yangyuan Wang
Publisher: Springer Nature
ISBN: 9819928362
Category : Technology & Engineering
Languages : en
Pages : 2006
Get Book Here
Book Description
Written by hundreds experts who have made contributions to both enterprise and academics research, these excellent reference books provide all necessary knowledge of the whole industrial chain of integrated circuits, and cover topics related to the technology evolution trends, fabrication, applications, new materials, equipment, economy, investment, and industrial developments of integrated circuits. Especially, the coverage is broad in scope and deep enough for all kind of readers being interested in integrated circuit industry. Remarkable data collection, update marketing evaluation, enough working knowledge of integrated circuit fabrication, clear and accessible category of integrated circuit products, and good equipment insight explanation, etc. can make general readers build up a clear overview about the whole integrated circuit industry. This encyclopedia is designed as a reference book for scientists and engineers actively involved in integrated circuit research and development field. In addition, this book provides enough guide lines and knowledges to benefit enterprisers being interested in integrated circuit industry.
Author: Asad A. Abidi
Publisher: Wiley-IEEE Press
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 696
Get Book Here
Book Description
Electrical Engineering Integrated Circuits for Wireless Communications High-frequency integrated circuit design is a booming area of growth that is driven not only by the expanding capabilities of underlying circuit technologies like CMOS, but also by the dramatic increase in wireless communications products that depend on them. Integrated Circuits for Wireless Communications includes seminal and classic papers in the field and is the first all-in-one resource to address this increasingly important topic. Internationally known and highly regarded in the field, editors Asad Abidi, Paul Gray, and Robert G. Meyer have meticulously compiled more than 100 papers and articles covering the very latest high-level integrated circuits techniques and solutions in use today. Integrated Circuits for Wireless Communications is devised expressly to provide IC design engineers, system architects, and integrators with a practical understanding of subjects ranging from architecture choices for integrated transceivers to actual circuit designs in all viable IC technologies, such as bipolar, CMOS, and GaAs. The papers selected represent a breadth of coverage and level of expertise that is simply unmatched in the field. Topics covered include: Radio architectures Receivers Transmitters and transceivers Power amplifiers and RF switches Oscillators Passive components Systems applications
Author: Texas Instruments Incorporated
Publisher:
ISBN:
Category : Diodes, Schottky-barrier
Languages : en
Pages : 362
Get Book Here
Book Description
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 852
Get Book Here
Book Description
Author:
Publisher:
ISBN:
Category : MICROELECTRONICS + INTEGRATED CIRCUITS
Languages : en
Pages :
Get Book Here
Book Description
Author: Motorola Semiconductor Products Inc
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 968
Get Book Here
Book Description
Author: Ian A. Grout
Publisher: Springer Science & Business Media
ISBN: 9781846280238
Category : Technology & Engineering
Languages : en
Pages : 396
Get Book Here
Book Description
Using the book and the software provided with it, the reader can build his/her own tester arrangement to investigate key aspects of analog-, digital- and mixed system circuits Plan of attack based on traditional testing, circuit design and circuit manufacture allows the reader to appreciate a testing regime from the point of view of all the participating interests Worked examples based on theoretical bookwork, practical experimentation and simulation exercises teach the reader how to test circuits thoroughly and effectively
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages :
Get Book Here
Book Description
Author: Emre Salman
Publisher: McGraw Hill Professional
ISBN: 0071635769
Category : Technology & Engineering
Languages : en
Pages : 738
Get Book Here
Book Description
The latest techniques for designing robust, high performance integrated circuits in nanoscale technologies Focusing on a new technological paradigm, this practical guide describes the interconnect-centric design methodologies that are now the major focus of nanoscale integrated circuits (ICs). High Performance Integrated Circuit Design begins by discussing the dominant role of on-chip interconnects and provides an overview of technology scaling. The book goes on to cover data signaling, power management, synchronization, and substrate-aware design. Specific design constraints and methodologies unique to each type of interconnect are addressed. This comprehensive volume also explains the design of specialized circuits such as tapered buffers and repeaters for data signaling, voltage regulators for power management, and phase-locked loops for synchronization. This is an invaluable resource for students, researchers, and engineers working in the area of high performance ICs. Coverage includes: Technology scaling Interconnect modeling and extraction Signal propagation and delay analysis Interconnect coupling noise Global signaling Power generation Power distribution networks CAD of power networks Techniques to reduce power supply noise Power dissipation Synchronization theory and tradeoffs Synchronous system characteristics On-chip clock generation and distribution Substrate noise in mixed-signal ICs Techniques to reduce substrate noise
Author: Vasilis F. Pavlidis
Publisher: Newnes
ISBN: 0124104843
Category : Technology & Engineering
Languages : en
Pages : 770
Get Book Here
Book Description
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
